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Advancements in Optical Materials and Photonic Device Technologies—2nd Edition

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Optical and Photonic Materials".

Deadline for manuscript submissions: 20 June 2026 | Viewed by 369

Special Issue Editors


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Guest Editor
Research Center for Non-Destructive Testing GmbH, Linz, Austria
Interests: optics and photonics; interferometry; laser technology; optical coherence tomography; imaging; infrared spectroscopy; quantum sensing; non-destructive testing
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
1. Research Center for Non-Destructive Testing (RECENDT)-GmbH, Linz, Austria
2. Institute for Mathematical Methods in Medicine and Data Based Modelling, Johannes Kepler University (JKU), Linz, Austria
Interests: optical imaging techniques for material research; optical sensing; digital and computational optics; scattering media
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

In recent decades, the photonics industry has experienced rapid growth in many sectors. The application scenarios range from biomedicine, telecommunications, routine microscopy, and process monitoring at industrial facilities to telescopy, the observation of gravitational waves, and sensing with quantum light. This progress is generating an intense demand for the development and advancement of optical materials, which are the cornerstone of light handling and manipulation. The development of new photonic devices and detectors, extending operating ranges, reducing losses, increasing sensitivity, and the ability to generate light with desired properties are just a few examples related to materials development.

This second edition is dedicated to the latest advances in optical materials facilitating the progress of photonic technologies, and thus, aims to dissiminate the most recent result in this field. Topics will cover a broad range of materials: semiconductors, glasses, linear and nonlinear materials, crystals, active and passive systems, fibers and waveguides, metamaterials, quantum dots, mirrors, and coatings.

Researchers with unpublished original results in the above-mentioned areas who are keen for rapid dissemination are encouraged to contribute in the form of research and review articles.

Dr. Ivan Zorin
Dr. Bettina Heise
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • advanced optial materials
  • enhanced optical properties
  • glasses
  • photonic crystals
  • semiconductors
  • optical fibers
  • nonlinear crystals
  • metamaterials
  • material aspects of photonic devices
  • coatings

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Published Papers (1 paper)

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Research

10 pages, 2556 KB  
Article
Stage-Wise Curing for Improving the Bonding Strength of Imaging Coupling Devices
by Yuwen Xing, Yajie Du, Miao Chu, Peng Jiao, Yang Fu, Zeping Sun, Miao Dong and Yonggang Huang
Materials 2026, 19(8), 1562; https://doi.org/10.3390/ma19081562 - 14 Apr 2026
Viewed by 202
Abstract
In extreme scenarios such as nuclear explosions and high-energy radiation detection in space, UV-cured adhesives are usually used as coupling media to bind tapered optic fiber arrays with intensified charge-coupled devices or complementary metal–oxide semiconductors and a tapered optic fiber array for effective [...] Read more.
In extreme scenarios such as nuclear explosions and high-energy radiation detection in space, UV-cured adhesives are usually used as coupling media to bind tapered optic fiber arrays with intensified charge-coupled devices or complementary metal–oxide semiconductors and a tapered optic fiber array for effective optical signal transmission. To address the issue of weak bonding strength caused by the small binding area between charge-coupled devices or complementary metal–oxide semiconductors and TOFA, a stage-wise curing process was investigated and proved to be efficient through comparison with the single curing process. The effect of interval time between the initial and final curing on coupling strength was characterized by tensile strength, shear strength and shock acceleration testing, and the samples were exposed to high and low temperatures for evaluation of their environmental adaptability. The curing mechanism was analyzed by surface morphology of the adhesive layer after decoupling and an energy-dispersive X-ray spectroscopy elemental analysis of interface layer. The results show that when the interval time is extended from 5 min to 60 min, the shock acceleration of the coupling device decreases by 26.1%, while the tensile and shear strengths also decrease by 49.4% and 60.7%, respectively. The decline in coupling strength is attributed to oxygen inhibition during interval time. The exposure of the adhesive surface to the air allows oxygen to diffuse into and react with active the free radicals that remain from the initial curing, which inhibits further polymerization and generates a thin, incompletely cured weak boundary layer. These findings provide insights for optimizing stage-wise curing processes and improving the reliability of coupled imaging devices. Full article
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