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Structure and Properties of Rapidly Solidified High-Entropy Alloys

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Metals and Alloys".

Deadline for manuscript submissions: 20 December 2026 | Viewed by 226

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Guest Editor
Department of Engineering Materials and Biomaterials, Silesian University of Technology, Konarskiego 18a St, 44-100, Gliwice, Poland
Interests: materials engineering; amorphous and nanocrystalline materials; functional materials; nanomaterials; metallic glasses; biomaterials; computer modelling of amorphous structure
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Special Issue Information

Dear Colleagues,

Interest in high-entropy alloys (HEAs) is steadily growing because of their applications and use as modern engineering materials in various industrial sectors. The unique properties of these alloys are the result of the structural disorder, created by the use of at least five constituent elements with similar atomic fractions. Their most distinct feature—an increased configurational entropy—enables to obtain relatively simple single- or dual-phase structures, promoting the stabilization of solid solutions. HEAs can be obtained using conventional methods such as arc melting, induction melting, or the Bridgeman crystallization method. Concurrently, utilization of rapid solidification methods, involving casting of molten alloys into a copper mold or additive manufacturing techniques, allowing to obtain non-equilibrium or metastable phases, as well as refined microstructures, uncovers new prospects to further improve their properties. 

This Special Issue will focus on research papers on high entropy alloys as well as multi-principal component alloys with amorphous, nanocrystalline, and metastable structures. Papers on supercooled metallic alloys and nanostructured materials, will also be considered. Papers on structural and functional alloys will also be included that involve characterization in terms of their mechanical, electrical, magnetic, thermal, and corrosion properties, as well as structural analysis and modelling.

We invite you to contribute full papers, reviews, or communications to this Special Issue. In all cases, the papers must demonstrate novelty and importance to the scope.

Dr. Rafał Babilas
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-anonymized peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • multi-principal component alloys
  • high-entropy alloys
  • metallic glasses
  • rapid solidification
  • crystalline, nanocrystalline, and metastable materials
  • structural characterization and modelling
  • anticorrosion and electrochemical properties
  • magnetic properties
  • mechanical properties
  • wear resistance

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Published Papers

This special issue is now open for submission.
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