Materials Innovation Through Atomic Layer Deposition: Process Optimization, Material Properties, and Applications
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Thin Films and Interfaces".
Deadline for manuscript submissions: 10 December 2025 | Viewed by 220
Special Issue Editor
Special Issue Information
Dear Colleagues,
Atomic layer deposition (ALD) has revolutionized materials science and engineering by enabling precise, layer-by-layer deposition of thin films with exceptional uniformity and control. This technique has played a critical role in advancing next-generation materials for applications in microelectronics, energy storage, protective coatings, and biomedical devices. The continuous innovation in ALD processes and materials is driving new frontiers in nanotechnology and industrial manufacturing.
Optimizing ALD process parameters such as precursor chemistry, deposition temperature, and reaction kinetics is essential for enhancing film quality, growth rate, and cost efficiency. Recent research has focused on data-driven approaches, including statistical modeling and machine learning, to achieve precise process control and improve deposition uniformity across large-area substrates. Plasma-enhanced and spatial ALD techniques have further expanded material selection and deposition scalability and facilitated their integration into industrial production.
Material properties, including electrical, optical, and mechanical characteristics, are heavily influenced by ALD process conditions. Advanced characterization techniques, such as X-ray diffraction (XRD), transmission electron microscopy (TEM), and spectroscopic ellipsometry, provide critical insights into film composition, crystallinity, and interfacial properties. These insights enable the design of high-performance materials for specific applications.
ALD’s versatility continues to shape the future of materials science, particularly in semiconductor device fabrication, energy conversion and storage, corrosion-resistant coatings, and flexible electronics. This Special Issue explores recent advancements in ALD process optimization, material innovation, and novel applications, providing a platform for researchers to share breakthroughs that drive the next generation of atomic-scale materials engineering.
Dr. Dongqing Pan
Guest Editor
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Keywords
- atomic layer deposition (ALD)
- process optimization
- precursor chemistry
- material characterization
- nanotechnology
- semiconductor fabrication
- energy storage applications
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