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Advanced Structural Materials and Nanomaterials

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Advanced Nanomaterials and Nanotechnology".

Deadline for manuscript submissions: closed (5 October 2021) | Viewed by 510

Special Issue Editors


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Guest Editor
Department of Materials Science, Universidad Politecnica de Madrid, Madrid, Spain
Interests: mechanics of materials; constitutive modelling; micromechanics; fibrous materials; nanocarbons; hydrogen embrittlement

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Guest Editor
Institute for Infrastructures and Environment, School of Engineering, The University of Edinburgh, Edinburgh, UK
Interests: composite materials; impulsive dynamics; advanced characterisation techniques; multiscale modelling

Special Issue Information

Dear Colleagues,

Materials science has always benefitted from advances in the neighboring fields of Chemistry, Physics, and Engineering and their fruitful cross-fertilisation. Over the last few decades, the synergistic contribution of unprecedented computational power, novel manufacturing techniques and effective access to the nanoscale have boosted the development of new materials and applications, whereas the advent of data science and AI is announcing a new revolution.

Bearing this accelerated development in mind, the purpose of this Special Issue is to provide high-quality readings to researchers interested in current developments in the field of structural materials and nanomaterials.

The main topics to be covered include novel structural materials of any kind, state-of-the-art characterisation or testing, modelling and simulation, unconventional mechanical behaviour and advanced applications. Particular attention will be paid to manuscripts combining experiments and models, as well as innovative methods.

In this context, we are pleased to invite you to submit a manuscript (original research article, communication or review) for this Special Issue of Materials MDPI “Advanced Structural Materials and Nanomaterials”.

Prof. Alvaro Ridruejo
Dr. Francisca Martinez Hergueta
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Advanced metal alloys
  • Polymers and nanopolymers
  • Structural composites and hybrid materials
  • Nanocarbon-based materials
  • Ceramics for structural applications
  • Biological structural materials
  • Materials for extreme in-service conditions
  • Multifunctional structural materials and metamaterials
  • Advanced characterisation techniques
  • Constitutive modelling and simulation of structural materials

Published Papers

There is no accepted submissions to this special issue at this moment.
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