Advanced Electronic Materials: Processing, Modeling, Failure Mechanisms, and Reliability
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Electronic Materials".
Deadline for manuscript submissions: 30 January 2027
Special Issue Editors
Interests: electronic materials and devices; multi-scale and multi-physics modeling; degradation mechanisms; devices reliability
Interests: computational mechanics of composites; mechanical metamaterial
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
The rapid advancement of micro- and nano-electronic technologies has imposed increasingly stringent requirements on the performance, reliability, and integration of electronic materials. In the post-Moore era, the design and development of next-generation electronic systems require not only advanced processing strategies but also a fundamental understanding of multi-physics behavior, failure mechanisms, and long-term reliability across multiple length and time scales.
This Special Issue of Materials, entitled “Advanced Electronic Materials: Processing, Modeling, Failure Mechanisms, and Reliability”, aims to provide a platform for reporting recent advances in electronic materials and micro/nano structures, with an emphasis on the intrinsic links between processing-induced microstructures, constitutive behavior, damage evolution, and reliability. Topics of interest include advanced electronic and interconnect materials, novel processing techniques, high-fidelity constitutive and multi-scale modeling, multi-physics coupled behavior, failure and degradation mechanisms, lifetime prediction, and reliability assessment.
Both experimental and computational studies are welcome, as are review articles addressing emerging challenges and opportunities. Contributions that bridge fundamental understanding and engineering application, or those that integrate experiments with physics-based and data-driven modeling approaches, are particularly encouraged.
Dr. Yutai Su
Dr. Xujiang Chao
Guest Editors
Dr. Canyu Liu
Guest Editor Assistant
Manuscript Submission Information
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Keywords
- advanced electronic materials
- materials processing
- micro- and nano-electronic structures
- multi-scale modeling
- multi-physics coupling
- constitutive modeling
- failure mechanisms
- damage and degradation
- reliability assessment
- lifetime prediction
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