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Advanced Materials Processing Technologies for Lightweight Design
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Advanced Materials Processing Technologies for Lightweight Design

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Manufacturing Processes and Systems".

Deadline for manuscript submissions: 20 August 2026 | Viewed by 6645

Special Issue Editors

Dr. Mingrun Yu

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Guest Editor
Research Institute for Advanced Manufacturing, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hong Kong
Interests: solid-state additive manufacturing; welding and joining of dissimilar materials; nonlinear finite element modeling
Dr. Sendong Ren

E-Mail Website
Guest Editor
School of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310023, China
Interests: dissimilar material joining; CFRP; joining and fracture mechanisms; computational welding mechanics; resistance spot welding; artificial neural network; solid-state phase transformation
Dr. Zubin Chen

E-Mail Website
Guest Editor
Yantai Research Institute and Graduate School of Harbin Engineering University, Yantai 264006, China
Interests: laser cladding; ultrasonic energy field-assisted laser additive manufacturing
Special Issues, Collections and Topics in MDPI journals
Dr. Changyong Chen

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Guest Editor
State Key Laboratory of Ultra-precision Machining Technology, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hong Kong 999077, China
Interests: microstructure and properties regulation of metal additive manufacturing; smelting and processing of special steel; NiTi shape memory alloys
Prof. Dr. Li Zhou

E-Mail Website
Guest Editor
1. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China
2. Shandong Provincial Key Laboratory of Special Welding Technology, Harbin Institute of Technology at Weihai, Weihai 264209, China
Interests: solid-phase joining; metal remanufacturing; additive manufacturing; welding/joining; additive manufacturing metallurgy

Special Issue Information

Dear Colleagues,

This Special Issue aims to explore the latest advancements in material processing technologies that contribute to the development of lightweight designs across various applications. As industries increasingly prioritize sustainability and efficiency, the demand for lightweight materials has surged, leading to significant innovations in processing techniques. This Special Issue seeks to address the challenges and opportunities associated with the development and implementation of advanced materials that optimize weight without compromising performance. We welcome the submission of papers that examine novel processing methods, the properties of materials, and design strategies that enhance the functionality and applicability of lightweight materials in fields such as aerospace, aviation, automotives, and marine engineering.

The scope of this Special Issue includes, but is not limited to, the following topics:

  • Additive manufacturing approaches for lightweight components
  • The characterization of the microstructure and mechanical properties of advanced materials
  • Computational simulation and modeling to optimize material processes
  • Advanced joining processes for lightweight material assemblies
  • Innovative approaches in casting and forging processes
  • Advanced surface treatment and coating technologies
  • The application of lightweight design in engineering and manufacturing

Dr. Mingrun Yu
Dr. Sendong Ren
Dr. Zubin Chen
Dr. Changyong Chen
Prof. Dr. Li Zhou
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • lightweight materials
  • materials characterization
  • additive manufacturing
  • casting
  • forging
  • welding
  • brazing
  • surface modification
  • coating
  • tribology
  • fatigue
  • modeling

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Further information on MDPI's Special Issue policies can be found here.

Published Papers (4 papers)

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Research

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17 pages, 3406 KB  
Article
Study on Microstructure and Properties of Micron Copper Powder-Liquid Metal Gallium Composite Interconnect Joint
by Bo Wang, Siliang He, Guopei Zhang, Menghao Liu, Kaixuan He, Wei Huang and Kailin Pan
Materials 2026, 19(2), 314; https://doi.org/10.3390/ma19020314 - 13 Jan 2026
Cited by 1 | Viewed by 584
Abstract
Liquid gallium (Ga) enables low-temperature transient liquid phase bonding (TLPB), but optimizing microstructure and joint performance remains challenging. Here, we developed a copper (Cu)-powder/liquid-Ga composite paste for Cu/Cu interconnects and systematically studied the effects on the interconnect joint performance of Cu powder particle [...] Read more.
Liquid gallium (Ga) enables low-temperature transient liquid phase bonding (TLPB), but optimizing microstructure and joint performance remains challenging. Here, we developed a copper (Cu)-powder/liquid-Ga composite paste for Cu/Cu interconnects and systematically studied the effects on the interconnect joint performance of Cu powder particle size (CuPS, 10–20, 20–30 and 30–40 μm) and Cu mass fraction (CuMF, 10–30 wt%). The microstructure, electrical conductivity, and shear strength of the joint were evaluated, followed by an assessment of bonding temperature, pressure, and time. Under bonding conditions of 220 °C, 5 MPa and 720 min, a dense intermetallic compound (IMC) microstructure predominantly composed of Cu9Ga4 and CuGa2 was formed, yielding an electrical conductivity of approximately 1.1 × 107  S·m−1 and a shear strength of 52.2 MPa, thereby achieving a synergistic optimization of electrical and mechanical properties; even under rapid bonding conditions of 220 °C, 5 MPa and 1 min, the joint still attained a shear strength of 39.2 MPa, demonstrating the potential of this process for high-efficiency, short-time interconnection applications. These results show that adjusting the composite paste formulation and dosage enables Cu–Ga TLPB joints that combine high conductivity with robust mechanical integrity for advanced packaging. Full article
(This article belongs to the Special Issue Advanced Materials Processing Technologies for Lightweight Design)
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21 pages, 16769 KB  
Article
Oscillating Laser Welding of TC4-304SS Dissimilar Joints: Regulating Microstructure and Mechanical Properties via Cu, Mo, and Nb Interlayers
by Zhi Cheng, Zheng Wang, Yanfei Bian, Yuanyuan Cheng, Shiming Huang and Chunhuan Chen
Materials 2026, 19(1), 86; https://doi.org/10.3390/ma19010086 - 25 Dec 2025
Viewed by 486
Abstract
This study investigated the use of oscillating laser welding with Cu, Mo, and Nb interlayers to mitigate the issue of brittle intermetallic compound (IMC) formation in titanium-steel dissimilar welding for TC4/304SS lap joints. This study systematically examined the influence of interlayer type on [...] Read more.
This study investigated the use of oscillating laser welding with Cu, Mo, and Nb interlayers to mitigate the issue of brittle intermetallic compound (IMC) formation in titanium-steel dissimilar welding for TC4/304SS lap joints. This study systematically examined the influence of interlayer type on joining mechanisms, microstructure, and mechanical properties. Results indicated that direct welding produced Ti-Fe IMCs (TiFe phase) through fusion, resulting in a thick brittle layer. The Cu interlayer facilitated fusion welding while promoting the formation of TiFe2 and TiCu4 phases. Mo and Nb interlayers, through fusion-brazing and brazing mechanisms, respectively, inhibited Ti-Fe IMCs by generating Fe-Mo/Nb IMCs and (Ti, Mo/Nb) solid solutions. Mechanical testing indicated that Mo-interlayer joints exhibited the highest shear strength at 1129.53 N, representing a 31% increase relative to direct joining. This was followed by Nb at 1004.4 N, Cu at 871.6 N, and direct welding at 859.13 N. Fracture transitioned from brittle IMC layers in Cu and direct welding to interfaces between interlayers and TC4 in Mo and Nb systems. This study presents Mo/Nb interlayers as the most effective choice for high-strength Ti-steel joints, providing insights for the selection of interlayers in engineering applications. Full article
(This article belongs to the Special Issue Advanced Materials Processing Technologies for Lightweight Design)
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15 pages, 16004 KB  
Article
Fabrication of Graphite Flake/Al Composites via the Hybrid Powder-Melt Process: Synergistic Enhancement of Strength and Conductivity Through Low Content Addition
by Jiapeng Luo, Chunyang Lu, Feihua Liu, Xinwei Yang, Ziren Wang, Qian Qian, Ming Yan and Haihui Lin
Materials 2025, 18(20), 4683; https://doi.org/10.3390/ma18204683 - 13 Oct 2025
Viewed by 802
Abstract
This study addresses the challenge of simultaneously improving the electrical conductivity and strength of aluminum alloys. We innovatively combine powder metallurgy with melt stirring casting to fabricate graphite flake-added aluminum matrix composites through secondary remelting, electromagnetic stirring, and extruding. The influence of graphite [...] Read more.
This study addresses the challenge of simultaneously improving the electrical conductivity and strength of aluminum alloys. We innovatively combine powder metallurgy with melt stirring casting to fabricate graphite flake-added aluminum matrix composites through secondary remelting, electromagnetic stirring, and extruding. The influence of graphite flake content gradient (0–3.0 wt.%) on the mechanical properties and electrical conductivity was systematically investigated. Our results demonstrate that the composite with 0.2 wt.% graphite flakes (sample GM02) exhibits optimal comprehensive performance: tensile strength reaches 100.9 MPa (a 124% increase over pure Al), and electrical conductivity reaches 67.1% IACS (a 9.6% increase). Microstructural analysis reveals that low-content graphite flakes effectively suppressed electron scattering by forming semi-coherent interfaces. However, when graphite flake content exceeds 0.5 wt.%, a significant decrease in conductivity and plasticity (elongation below 10%) occurs due to increased Al4C3 phase formation, enhanced grain boundary scattering caused by grain refinement, and porosity defects induced by graphite flake agglomeration. This study provides a novel approach for the industrial production of high-performance, lightweight conductive components. Full article
(This article belongs to the Special Issue Advanced Materials Processing Technologies for Lightweight Design)
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Review

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28 pages, 3055 KB  
Review
Smart Manufacturing for High-Performance Materials: Advances, Challenges, and Future Directions
by Subin Antony Jose, Alex Tonner, Marc Feliciano, Teddy Roy, Aidan Shackleford and Pradeep L. Menezes
Materials 2025, 18(10), 2255; https://doi.org/10.3390/ma18102255 - 13 May 2025
Cited by 15 | Viewed by 3992
Abstract
Smart manufacturing utilizes advanced computing technologies to enhance adaptability within traditional mass production systems. This enables the creation of highly specialized products on demand, maintaining efficiency and cost-effectiveness. Integrating these technologies with high-performance materials further accelerates the development and testing of innovative materials [...] Read more.
Smart manufacturing utilizes advanced computing technologies to enhance adaptability within traditional mass production systems. This enables the creation of highly specialized products on demand, maintaining efficiency and cost-effectiveness. Integrating these technologies with high-performance materials further accelerates the development and testing of innovative materials that support efficient and flexible manufacturing processes. This paper explores the critical technologies driving smart manufacturing and highlights advancements in manufacturing techniques that offer unprecedented design freedom. It also examines the challenges associated with scaling smart manufacturing solutions and presents case studies from industries that have successfully adopted these approaches. Lastly, the paper summarizes key findings and proposes future research directions to further advance the field of smart manufacturing. Full article
(This article belongs to the Special Issue Advanced Materials Processing Technologies for Lightweight Design)
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