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Low-Dimensional Electromagnetic Functional Materials

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Electronic Materials".

Deadline for manuscript submissions: 20 October 2024 | Viewed by 257

Special Issue Editor


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Guest Editor
School of Materials Science and Engineering, Anhui Polytechnic University, Wuhu, China
Interests: low-dimensional electromagnetic functional materials; energy storage materials

Special Issue Information

Dear Colleagues,

Electromagnetic functional materials refer to electromagnetic protection materials (including microwave absorption and electromagnetic interference shielding materials), as well as materials with electromagnetic protection properties and other applications. With the arrival of the 5G era, electromagnetic pollution is becoming increasingly serious, and the key to solving electromagnetic pollution is to develop electromagnetic protection materials. Electromagnetic protection materials have become one of the most frequently debated topics in the field of materials research.

Long-term research has shown that low-dimensional materials (usually referring to one-dimensional and two-dimensional materials) have significant advantages in the field of electromagnetic protection, such as a high specific surface area, strong electron transfer ability, and natural defects. A high specific surface area makes it easier to design structures, a strong electron transfer ability can effectively form a surface current to reflect electromagnetic waves, and natural defects can effectively form dipole polarization to effectively attenuate electromagnetic waves. Therefore, introducing low-dimensional materials into the field of electromagnetic protection will be the main development trend of future electromagnetic protection materials.

In recent years, in order to meet the ever-changing military and civilian market demands, electromagnetic protection materials need to meet more application requirements, such as flexible wearability, oxidation resistance, and flame retardancy, among others, including developing into a multifunctional and integrated electromagnetic functional material based on electromagnetic protection applications.

It is my pleasure to invite you to submit a manuscript to this Special Issue. Full papers, communications, and reviews are all welcome.

Dr. Peng He
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • microwave absorption
  • electromagnetic interference shielding
  • low-dimensional materials
  • multifunctional electromagnetic protection

Published Papers

This special issue is now open for submission.
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