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Advances in Surface Modification for Adhesive Bonding

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Advanced Materials Characterization".

Deadline for manuscript submissions: closed (20 March 2024) | Viewed by 216

Special Issue Editors


E-Mail Website
Guest Editor
Engineering and Architecture Department, University of Parma, 43124 Parma, Italy
Interests: adhesive bonding; surface preparation; finite element modeling; composite materials

E-Mail Website
Guest Editor
Engineering and Architecture Department, University of Parma, 43124 Parma, Italy
Interests: adhesive bonding; surface preparation; mechanical behavior of materials; finite element modeling; hygienic design; integrated and virtual methods for product development

Special Issue Information

Dear Colleagues,

Adhesive bonding is a joining technology whose application is continuously increasing in several industrial fields. This is due to the several benefits it can bring, for example, assembly lightweight, even stress distribution, improved aesthetics and, often, the capability to connect different materials together.

However, adhesive bonding works via surface action and an effective interaction between the adhesive and the substrate is required to ensure adequate bond strength. The complexity of this issue is increased by considering the different chemical nature of substrates and the technological aspects that a wide range of materials to be connected can bring.

In this context, several methods have been developed in recent years to improve the strength of the interface between the adhesive and the substrate, and new ideas and solutions are continuously being generated.

The aim of this Special Issue is therefore to collect the latest scientific studies exploring methods and technologies to improve the strength at the interface. Experimental studies describing innovations in the application of chemical or physical treatments developed to toughen the interfaces of adhesive bonded joints are encouraged, as well as papers illustrating new strategies to modify the surface morphology (from the nano to the meso scale) and chemistry in order to increase the joints’ strength and durability under typical working conditions. Additionally, review papers on these topics are welcome.

Dr. Fabrizio Moroni
Dr. Francesco Musiari
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • adhesive bonding
  • durability
  • surface treatments
  • toughening
  • laser ablation
  • plasma
  • abrasion
  • etching
  • anodizing
  • coating

Published Papers

There is no accepted submissions to this special issue at this moment.
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