Special Issue "Selected Papers from ICI2017 and Spintech Thesis Awards"
A special issue of Inventions (ISSN 2411-5134). This special issue belongs to the section "Inventions and innovation in Advanced Manufacturing".
Deadline for manuscript submissions: closed (28 February 2018)
Prof. Dr. Chien-Hung Liu
Department of Mechanical Engineering, National Chung Hsing University, 250 Kuo Kuang Rd., Taichung 402, Taiwan
Fax: +886 4 2287 7170
Interests: high precision instrument design; laser engineering; smart sensors and actuators; optical device; optical measurement; metrology
This Special Issue will select the papers from ICI2017 (2017 3rd International Conference on Inventions, http://sciforum.net/conference/ICI2017) and Spintech Thesis Awards. The aims and scope of the 2017 3rd International Conference on Inventions is to make researchers focus on patent-based research. Papers with innovative ideas in all aspects of science and engineering are also encouraged in this Special Issue.
Prof. Dr. Chien-Hung Liu
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Inventions is an international peer-reviewed open access quarterly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) is waived for well-prepared manuscripts submitted to this issue. Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
- Invention and innovation in advanced manufacturing
- Invention/innovation in applied optics and lasers
- Invention/innovation in devices, sensors and actuators
- Invention/innovation in energy and thermal/fluidic science
- Invention/innovation in biotechnology/materials
- Invention/innovation surface science/ nanotechnology technology
- Invention/innovation in design/modeling/computing methods