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Thermal Energy Management to Increase the Reliability and the Lifetime of Power Devices

A special issue of Energies (ISSN 1996-1073). This special issue belongs to the section "J: Thermal Management".

Deadline for manuscript submissions: closed (15 May 2026) | Viewed by 820

Special Issue Editors


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Guest Editor
Energy and Control of Transportation Systems Laboratory, Graduate School of Aeronautical, Aerospace, Automobile, Railway Engineering (ESTACA), 53061 Laval, France
Interests: power electronics; nonlinear dynamics; fault diagnosis; electrothermal modeling; lifetime
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
Mechatronic Laboratory, Graduate School of Aeronautical, Aerospace, Automobile, Railway Engineering (ESTACA), 53061 Laval, France
Interests: battery-powered vehicles; optimization; adaptive control; battery management systems; closed-loop systems; electric vehicles; energy storage; hybrid electric vehicles; secondary cells; Lyapunov methods; energy management systems; fuel cell vehicles
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

The Guest Editor is inviting submissions for a Special Issue of Energies on the subject area of "Thermal Energy Management to Increase the Reliability and the Lifetime of Power Devices".

MOSFETs and IGBTs are the most widely used power semiconductor switching devices in power converters due to their robust design and low conduction losses. However, these components are also vulnerable, and their main cause of failure depends on stress conditions. Therefore, understanding failure mechanisms and the availability of verified lifetime models (number of cycles to end of life) are essential to determine the reliability of power converters. Accelerated cycling tests are used to assess the reliability of power modules. Lifetime models are developed under predefined thermal stress conditions: junction temperature variation, minimum or average junction temperatures, module heating and cooling times, heating current, and power module design parameters. Circuit overheating is a problem that affects device performance and reliability. Appropriate thermal management strategies can ensure continuous device operation under extreme heat conditions and prevent irreversible damage.

This Special Issue will focus on thermal energy management to increase the reliability and the lifetime of power devices.

Topics of interest for publication include, but are not limited to, the following:

  • Power cycling tests.
  • Cycles to failure.
  • Lifetime models.
  • Thermal management to improve reliability.

Dr. Cristina Morel
Dr. Nassim Rizoug
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Energies is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • thermal energy management
  • reliability of power devices
  • lifetime of power devices
  • power converters
  • circuit overheating
  • power cycling tests

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Published Papers (1 paper)

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Research

20 pages, 3683 KB  
Article
Evaluating the Use of a Thermoelectric Module Cooling to Increase the Power Density of Power Converters
by Abdullahi Abubakar, Christian Klumpner and Patrick Wheeler
Energies 2026, 19(7), 1709; https://doi.org/10.3390/en19071709 - 31 Mar 2026
Viewed by 566
Abstract
This paper starts by analysing the equivalent circuit model of a Thermoelectric Module (TEM) with PLECS simulation by using the PLECS thermal block-set. The approach enables the evaluation of power-module losses when mounted on a sandwich assembly of a TEM, heatsink, and cooling [...] Read more.
This paper starts by analysing the equivalent circuit model of a Thermoelectric Module (TEM) with PLECS simulation by using the PLECS thermal block-set. The approach enables the evaluation of power-module losses when mounted on a sandwich assembly of a TEM, heatsink, and cooling fan. An experimental setup was first built using power resistors for controlled heat generation to be absorbed by the cooling system and validated with the simulation model. Experimental investigations were then carried out on a DC/DC converter under four cooling conditions: natural convection and forced convection without a TEM and then natural convection and forced convection with a TEM. The experimental results are validated using PLECS Software (version 4.8). This result demonstrates a reduction in the power-module junction temperature of the DC/DC converter when employing forced convection with a TEM compared to forced convection without a TEM. Furthermore, the results indicate about 32% potential weight and size reduction of the converter magnetic components, along with improved power density, through the integration of TEM-based cooling. Full article
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