Exploring Energy Innovations: The Rise of Next-Generation Photovoltaic Modules

Dear Colleagues,

Driven by the global need to decarbonize the energy sector, the photovoltaic (PV) industry continues to evolve rapidly, with next-generation PV modules playing a key role in shaping the future of solar energy. Innovations in cell architecture, materials, and integration technologies have led to significant improvements in power conversion efficiency, energy yield, form factor flexibility, and long-term reliability. These advancements are essential for meeting the growing demand for high-performance solar systems across diverse applications, ranging from residential rooftops to utility-scale power plants and emerging building-integrated solutions.

This Special Issue, "Exploring Energy Innovations: The Rise of Next-Generation Photovoltaic Modules," will provide a forum for the latest scientific and technological developments in advanced PV modules. As new technologies such as tandem cells, bifacial designs, shingled modules, and perovskite-based solutions transition from research to commercialization, critical investigations are needed to assess their performance, durability, cost-effectiveness, and environmental impact under real-world conditions.

We invite original research articles, reviews, and case studies that address (i) novel cell and module architectures (e.g., tandem, heterojunction, perovskite/silicon); (ii) materials innovation, including encapsulants, backsheets, and coatings; (iii) advancements in module integration, interconnection, and packaging techniques; (iv) performance analysis under diverse operating conditions, including temperature, light spectrum, and angular incidence; (v) the modeling and simulation of next-generation modules; and (vi) sustainability metrics, including lifecycle assessment and recyclability.

This Special Issue will showcase breakthrough innovations, facilitate interdisciplinary dialogue, and contribute to the global acceleration of solar energy adoption through next-generation module technology.

Prof. Dr. Jaehyeong Lee
Dr. Chaehwan Jeong
Guest Editors

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