Advancements in Power Electronics Design: Thermal Management and Reliability
A special issue of Energies (ISSN 1996-1073). This special issue belongs to the section "F3: Power Electronics".
Deadline for manuscript submissions: 20 October 2026 | Viewed by 1127
Special Issue Editor
Interests: thermal management of electronic devices; theoretical calcualtion of thermal and electrical transport; energy conversion; machine learning-assisted design
Special Issue Information
Dear Colleagues,
As the integration of electronic devices has increased, their heat flux density has risen substantially. Meanwhile, the operational environments encountered by these devices are becoming progressively more complex, often entailing extreme conditions such as ultra-high temperatures, ultra-high pressures, and micro-scale dimensions. Consequently, effective thermal management and reliability assurance have emerged as critical challenges, creating a fundamental requirement for ensuring both operational performance and safety.
This Special issue aims to present the latest advancements in theories, methodologies, technologies, materials, and applications related to the thermal management and reliability of electronic devices. Topics of interest for publication include, but are not limited to, the following:
- Thermal design of electronic devices;
- Design and optimization of thermal management systems;
- Thermal management strategies for extreme operating conditions;
- Advanced thermal management materials;
- Micro-scale heat transfer enhancement;
- Innovative cooling technologies and equipment;
- Reliability design for electronic devices;
- Reliability prediction and control of electronic devices;
- Application of artificial intelligence for thermal management and reliability.
Dr. Jinlong Ma
Guest Editor
Manuscript Submission Information
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Keywords
- thermal management
- reliability
- heat transport
- electronic devices
- design and optimization
- thermal materials
- artificial intelligence
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