AI-Native Ubiquitous 6G: Key Technologies, Architectures, and Applications
A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Microwave and Wireless Communications".
Deadline for manuscript submissions: 15 August 2026 | Viewed by 811
Special Issue Editors
Interests: holographic MIMO; XL-MIMO; RIS; signal processing
Special Issues, Collections and Topics in MDPI journals
Interests: cell-free massive MIMO; mobile communications; performance analysis
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Ubiquitous future 6G wireless networks are expected to move beyond the conventional pursuit of higher peak rates and denser coverage. Instead, 6G is increasingly envisioned as a unified cyber–physical–intelligent fabric that tightly couples communication, sensing, computing, and control to support a broad spectrum of services—from immersive human-centric experiences (XR and holographic telepresence) to mission-critical industrial automation, cooperative robotics, and massive machine-type connectivity. Such an evolution introduces unprecedented system requirements, including extreme reliability and low latency, fine-grained spatial and temporal awareness, scalable energy efficiency, and end-to-end trustworthiness under heterogeneous and dynamic environments. Meanwhile, emerging technologies—such as extremely large/aperture arrays, holographic MIMO and reconfigurable intelligent surfaces, integrated sensing and communications, edge–cloud continuum computing, and AI-native network orchestration—are fundamentally reshaping how wireless networks are designed, optimized, and operated.
In this context, this Special Issue aims to bring together key enabling theories, algorithms, frameworks, architectures, and prototypes that can realize truly ubiquitous 6G connectivity and intelligence. By emphasizing AI-native design, data-driven automation, and cross-layer co-optimization, the collection seeks to foster convergent research that bridges physical-layer innovations and network-level intelligence, enabling practical pathways toward scalable, deployable, and resilient 6G systems. We particularly welcome original contributions across (but not limited to) the following topics.
The collection spans theory, algorithms, frameworks, architectures, and protype across the following:
- AI-enabled 6G networks/services/applications/scenarios;
- Large language models (LLMs) and foundation models for 6G operations/orchestrations;
- Digital twins for real-time 6G network cognition/prediction/optimization/closed-loop control;
- 6G new antenna and propagation paradigms;
- 6G advanced signal processing techniques and algorithms;
- 6G resource allocation and scheduling for heterogeneous services;
- 6G edge-cloud computing and distributed intelligence;
- 6G wireless network security/privacy and trust;
- Representative 6G application scenarios (e.g., XR, industrial automation, vehicular/robotic networks, IoT/IoE, integrating sensing and communications).
Dr. Yuanbin Chen
Dr. Jiakang Zheng
Dr. Zile Liu
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- 6G
- AI
- digital twin
Benefits of Publishing in a Special Issue
- Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
- Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
- Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
- External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
- Reprint: MDPI Books provides the opportunity to republish successful Special Issues in book format, both online and in print.
Further information on MDPI's Special Issue policies can be found here.


