Advances in MEMS/NEMS: Theory, Devices, and Intelligent Applications

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Microelectronics".

Deadline for manuscript submissions: 15 June 2026 | Viewed by 8

Special Issue Editor

School of Integrated Circuits, Jiangnan University, Wuxi 214122, China
Interests: MEMS/NEMS; resonator; physical reservoir computation; thermoelectric generator

Special Issue Information

Dear Colleagues,

Continuous innovation in Micro-Electro-Mechanical Systems (MEMS) and Nano-Electro-Mechanical Systems (NEMS) is essential for progress across nearly all major sectors, from healthcare and the automotive industry to telecommunications and consumer electronics.

In recent years, the field has been invigorated by powerful new drivers. The growth of the Internet of Things and 5G/6G, coupled with the rise of Artificial Intelligence, has acted as a significant catalyst. This has created new demands and unprecedented opportunities for MEMS/NEMS to evolve in terms of their performance, functionality, and integration. This Special Issue is dedicated to capturing the full, diverse spectrum of these advances. We welcome original research articles and reviews that focus on deepening our fundamental understanding of this domain, developing physical functionalities, or demonstrating system-level integration.

Topics of particular interest include, but are not limited to:

  • Dynamics, stability, and control in MEMS/NEMS;
  • Advanced multi-physics modeling;
  • Reliability, packaging, thermal management, and long-term stability;
  • RF MEMS and MOEMS;
  • MEMS/NEMS resonators;
  • Piezoelectric MEMS;
  • Flexible, stretchable, and wearable MEMS/NEMS;
  • Devices based on new or emerging materials;
  • BioMEMS and MEMS for brain–computer interface (BCI);
  • AI-enabled and “smart” MEMS/NEMS;
  • Sensing applications of MEMS/NEMS.

Dr. Wei Yu
Guest Editor

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Keywords

  • MEMS
  • NEMS
  • BioMEMS
  • resonator
  • smart material
  • sensor
  • flexible MEMS

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Published Papers

This special issue is now open for submission.
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