You are currently viewing a new version of our website. To view the old version click .

Simultaneous Localization and Mapping (SLAM) of Mobile Robots

Special Issue Information

Dear Colleagues,

Simultaneous Localization and Mapping (SLAM) has long been a fundamental and challenging technology in enabling mobile robots to operate autonomously in unknown environments, where safety and precision are the vital issues for reliable and high-level autonomous applications. This Special Issue seeks to gather insights into state-of-the-art research and to promote the continuous progress of SLAM technology for mobile robots. Topics of interest for this Special Issue include, but are not limited to, the following:

  1. Advanced SLAM Algorithm Development: The improvement of existing algorithms to increase the accuracy and robustness of localization and mapping.
  2. AI and Machine Learning for SLAM: The integration of advanced AI and machine learning techniques with SLAM algorithms in dynamic and complex environments.
  3. Expansion of Application Scenarios: Applications of SLAM technology in new scenarios, such as environmental monitoring, autonomous delivery, and cultural heritage exploration.
  4. Cooperative SLAM (C-SLAM): Multi-robot SLAM system development, dealing with communication barriers, co-localization issues, and joint optimization problems to enable efficient and effective multi-robot navigation.
  5. Fast SLAM for Edge Deployment: Real-time SLAM on edge devices, Hardware–Software co-design optimization, efficient data processing technologies, and resource-constrained SLAM solutions.

Dr. Zhan Wang
Dr. Jin Wang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • localization and mapping
  • robotic navigation
  • autonomous system
  • AI-enhanced SLAM
  • vision inertial SLAM
  • multi-sensor fusion
  • mobile robot

Benefits of Publishing in a Special Issue

  • Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
  • Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
  • Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
  • External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
  • e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.

Published Papers

Get Alerted

Add your email address to receive forthcoming issues of this journal.

XFacebookLinkedIn
Electronics - ISSN 2079-9292