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Timely AI Advancements and Interdisciplinary Synergies for Intelligent Modeling

This special issue belongs to the section “Artificial Intelligence“.

Special Issue Information

Dear Colleagues,

This joint Special Issue, in collaboration with the 27th International Conference on Engineering Applications and Advances of Artificial Intelligence (EAAAI 2026, ex EANN) and the 22nd International Conference on Artificial Intelligence Applications and Innovations (AIAI 2026), aims to consolidate cutting-edge research that bridges AI theory, practical engineering deployment, and interdisciplinary innovation—core themes shared by both prestigious conferences.

Reflecting the scope of both conferences, this issue invites original contributions spanning: (1) theoretical innovations in AI (e.g., graph neural networks, reinforcement learning, optimization algorithms); (2) engineering/Environmental applications of AI (e.g., anomaly detection, smart transportation, cyber security using deep learning, environmental and engineering modeling); (3) interdisciplinary synergies (e.g., bioinformatics modeling, multi-agent systems for complex tasks); and (4) methodological advances in evaluating and scaling AI solutions.

We welcome expanded versions of high-impact papers from EAAAI 2026 and AIAI 2026 that demonstrate novel insights, rigorous validation, and relevance to global AI advancement, with at least a 50% increase.

Additionally, this Special Issue enthusiastically welcomes new and original contributions from researchers, academics, and industry practitioners who did not participate in the conference but whose work aligns with its thematic scope.

Prof. Dr. Lazaros Iliadis
Prof. Dr. Ilias Maglogiannis
Dr. Antonis Papaleonidas
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • artificial intelligence
  • engineering applications
  • interdisciplinary advancements
  • theoretical innovations
  • methodological advances

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Electronics - ISSN 2079-9292