Millimeter-Wave Radar Technologies for Next-Generation Wireless Networks

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Microwave and Wireless Communications".

Deadline for manuscript submissions: 30 June 2026 | Viewed by 602

Special Issue Editors


E-Mail Website
Guest Editor
Department of Electrical and Computer Engineering, Microwaves Lab, Democritus University of Thrace, 67100 Xanthi, Greece
Interests: design and implementation of microwave circuits; radar and antenna systems; computational electromagnetic; 5G wireless systems; biomedical applications
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
College of Engineering & Computing, Florida International University, Miami, FL 33174, USA
Interests: theoretical and computational electromagnetics; microwaves; antennas; photonics
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
Department of Electrical and Computer Engineering, Microwaves Lab, Democritus University of Thrace, 67100 Xanthi, Greece
Interests: information technology and communications; wireless communications; satellite communications; RF/microwave circuits; antenna analysis and design; computational methods in electromagnetics

Special Issue Information

Dear Colleagues,

This Special Issue will focus on the emerging topic of millimeter-wave radar technologies. Millimeter-wave (mmWave) radar has emerged as a foundational technology for next-generation wireless networks, with unprecedented capabilities in sensing, communication, and environmental awareness. As 5G continues to evolve and 6G systems begin to take shape, integrated radar-communication architectures are expected to play a transformative role in achieving highly intelligent, adaptive, and context-aware wireless environments. To fully unlock these capabilities, mmWave radar systems must be capable of ultra-high-resolution sensing; robust operation in dynamic and cluttered environments; and seamless coexistence with high-capacity wireless links with multi-Gb/s data rates, dense user connectivity, and sub-millisecond latency.

This Special Issue aims to present cutting-edge research on the design, analysis, and implementation of millimeter-wave radar technologies that will pave the way for the next era of wireless networks. We welcome contributions on advanced mmWave radar front-ends, integrated sensing-and-communication (ISAC) architectures, and novel hardware or signal processing techniques that support high performance, miniaturization, and large-scale deployment.

Topics of interest include, but are not limited to, the following:

  • Millimeter-wave radar architectures for 5G/6G networks;
  • Multi-beam and MIMO radar systems;
  • Integrated sensing-and-communication (ISAC) technologies;
  • Millimeter-wave antennas and arrays for radar and joint radar–communication;
  • Beamforming, beam tracking, and adaptive array techniques for radar;
  • Integrated RF/mmWave components (filters, couplers, power dividers, etc.) for radar front-ends;
  • Reconfigurable and programmable apertures (reflectarrays, transmitarrays, metasurfaces) for sensing and tracking;
  • Broadband and multi-band mmWave radar components;
  • High-frequency amplifiers, mixers, VCOs, detectors, and transceiver modules for radar systems;
  • On-chip and in-package mmWave radar devices;
  • Packaging and antenna-in-package (AiP) solutions for integrated radar systems;
  • Radar signal processing, waveform design, and machine learning-based sensing;
  • Optimization and synthesis techniques for mmWave radar arrays and components.

Prof. Dr. George Kyriacou
Dr. Constantinos L. Zekios
Dr. Theodoros N. Kaifas
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • millimeter-wave radar
  • 5G/6G sensing
  • ISAC
  • beamforming
  • antenna arrays
  • mmWave components
  • high-frequency circuits
  • radar front-end

Benefits of Publishing in a Special Issue

  • Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
  • Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
  • Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
  • External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
  • Reprint: MDPI Books provides the opportunity to republish successful Special Issues in book format, both online and in print.

Further information on MDPI's Special Issue policies can be found here.

Published Papers (1 paper)

Order results
Result details
Select all
Export citation of selected articles as:

Research

24 pages, 6557 KB  
Article
Ka-Band 16-Channel T/R Module Based on MMIC with Low Cost and High Integration
by Mengyun He, Qinghua Zeng, Xuesong Zhao, Song Wang, Yan Zhao, Pengfei Zhang, Gaoang Li and Xiao Liu
Electronics 2026, 15(6), 1185; https://doi.org/10.3390/electronics15061185 - 12 Mar 2026
Viewed by 382
Abstract
Based on monolithic microwave integrated circuit (MMIC) technology, this paper presents the design and implementation of a low-cost, highly integrated Ka-band sixteen-channel transmit/receive (T/R) module, specifically tailored to meet the application requirements of phased array antennas in airborne and spaceborne radar systems, satellite [...] Read more.
Based on monolithic microwave integrated circuit (MMIC) technology, this paper presents the design and implementation of a low-cost, highly integrated Ka-band sixteen-channel transmit/receive (T/R) module, specifically tailored to meet the application requirements of phased array antennas in airborne and spaceborne radar systems, satellite communications, and 5G/6G millimeter-wave networks. The proposed module employs an MMIC-based single-channel dual-chip discrete architecture, optimally integrating amplitude-phase multifunction chips and transmit-receive multifunction chips in terms of both fabrication process and performance characteristics, achieving a favorable balance between high performance and high-integration density. Using low-cost, low-temperature co-fired ceramic (LTCC) substrates, full-silver conductive paste, and a nickel–palladium–gold plating process, a novel “back-to-back” thin-slice packaging technique is presented to improve integration, lower manufacturing costs, and boost long-term reliability. Furthermore, the design incorporates glass insulators and a direct array interconnection scheme, which significantly minimizes transmission losses and reduces interface dimensions. The final module measures 70.3 mm × 26.2 mm × 10.9 mm and weighs only 34 g. Experimental results demonstrate a transmit output power of at least 23 dBm, a receive gain exceeding 26 dB, and a noise figure below 3.5 dB, achieving a 22.5–58% reduction in volume per channel while maintaining competitive RF performance. To improve testing effectiveness and guarantee data consistency, an automated radio frequency (RF) test system based on Python 3.11.5 was also developed. This work provides a practical technical approach for the engineering realization of Ka-band phased array systems. Full article
Show Figures

Figure 1

Back to TopTop