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Advances in Reconfigurable Computing for Embedded Systems Based on FPGAs...
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Advances in Reconfigurable Computing for Embedded Systems Based on FPGAs and SoCs

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Computer Science & Engineering".

Deadline for manuscript submissions: closed (1 September 2024) | Viewed by 10605

Special Issue Editors

Prof. Andrea Guerrieri

E-Mail Website
Guest Editor
inIT, Hepia, University of Applied Sciences Western Switzerland, 1950 Sion, Switzerland
Interests: reconfigurable computing; electronic design automation; software-defined hardware
Special Issues, Collections and Topics in MDPI journals
Dr. Mohamed El-Hadedy Aly

E-Mail Website
Guest Editor
Department of Electrical and Computer Engineering, California State Polytechnic University, Pomona, CA 91768, USA
Interests: cryptography; field programmable gate arrays; microprocessor chips; reconfigurable architecture
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Reconfigurable computing based on System-on-Chip (SoC) and Field-Programmable Gate Arrays (FPGAs) stands at the forefront of the development of modern embedded systems. These platforms, which integrate reconfigurable logic with a variety of processors and adaptive computing elements, play a pivotal role in accelerating AI inference and fostering energy-efficient embedded systems. Reconfigurable SoCs and FPGAs are essential for real-time systems like industrial automation, robotics, autonomous drive and navigation, and communication systems from aerospace, military, astronomical, and ground segment applications. These reconfigurable platforms are now instrumental in crafting self-adaptive systems that autonomously reconfigure themselves in response to environmental conditions and workloads, thereby optimizing their performance and power consumption in a dynamic manner. Notably, advances in low-power SoCs and FPGAs further enhance energy efficiency, rendering them ideal for battery-powered systems.

Moreover, they play a crucial role in contributing to the advancement of quantum computing, aiding tasks like error correction and classical–quantum interface development. In the realm of security, they offer an attractive avenue for implementing secure systems, including post-quantum cryptography.

Electronic Design Automation (EDA) tools are advancing significantly, but efficiently programming these modern heterogeneous architectures is an ongoing effort. Finally, open-source SoCs, FPGAs and toolchains aim to democratize heterogeneous custom computing and development, reduce vendor lock-in, and increase accessibility for smaller developers and researchers.

We are pleased to invite researchers, scholars, and experts to submit their original research papers and articles to this Special Issue on advances in reconfigurable computing for embedded systems. Authors are encouraged to share their valuable insights and findings in the form of research papers. Submitted works should be of high quality, relevance, and significance with regard to the following topics:

  • Novel and custom heterogeneous architectures;
  • AI inferencing and machine learning acceleration;
  • Quantum computing acceleration;
  • Security and post-quantum cryptography;
  • Energy-constrained and battery-powered applications;
  • Auto-adaptive systems;
  • Real-time processing and mixed-criticality systems;
  • High-level tools and abstractions;
  • Open-source SOC and FPGAs;
  • Open-source EDA tools and ecosystems;

This Special Issue reflects the versatility of FPGAs and SoCs in addressing the demands of modern embedded systems across various domains, including aerospace, astronomy, communications, edge computing, and emerging technologies such as AI and quantum computing.

Prof. Dr. Andrea Guerrieri
Dr. Mohamed El-Hadedy Aly
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • reconfigurable computing
  • SoCs
  • FPGAs
  • heterogeneous architectures
  • embedded systems

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Published Papers (1 paper)

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Research

16 pages, 2868 KiB  
Article
Mitigating Thermal Side-Channel Vulnerabilities in FPGA-Based SiP Systems Through Advanced Thermal Management and Security Integration Using Thermal Digital Twin (TDT) Technology
by Amrou Zyad Benelhaouare, Idir Mellal, Maroua Oumlaz and Ahmed Lakhssassi
Electronics 2024, 13(21), 4176; https://doi.org/10.3390/electronics13214176 - 24 Oct 2024
Cited by 1 | Viewed by 10183
Abstract
Side-channel attacks (SCAs) are powerful techniques used to recover keys from electronic devices by exploiting various physical leakages, such as power, timing, and heat. Although heat is one of the less frequently analyzed channels due to the high noise associated with thermal traces, [...] Read more.
Side-channel attacks (SCAs) are powerful techniques used to recover keys from electronic devices by exploiting various physical leakages, such as power, timing, and heat. Although heat is one of the less frequently analyzed channels due to the high noise associated with thermal traces, it poses a significant and growing threat to the security of very large-scale integrated (VLSI) microsystems, particularly system in package (SiP) technologies. Thermal side-channel attacks (TSCAs) exploit temperature variations, risking not only hardware damage from excessive heat dissipation but also enabling the extraction of sensitive data, like cryptographic keys, by observing thermal patterns. This dual threat underscores the need for a synergistic approach to thermal management and security in designing integrated microsystems. In response, this paper presents a novel approach that improves the early detection of abnormal thermal fluctuations in SiP designs, preventing cybercriminals from exploiting such anomalies to extract sensitive information for malicious purposes. Our approach employs a new concept called Thermal Digital Twin (TDT), which integrates two previously separate methods and techniques, resulting in successful outcomes. It combines the gradient direction sensor scan (GDSSCAN) to capture thermal data from the physical field programmable gate array (FPGA), which guarantees rapid thermal scan with a measurement period that could be close to 10 μs, a resolution of 0.5 ∘C, and a temperature range from −40 ∘C to 140 ∘C; once the data are transmitted in real time to a Digital Twin created in COMSOL Multiphysics® 6.0 for simulation using the Finite Element Method (FEM), the real time required by the CPU to perform all the necessary calculations can extend to several seconds or minutes. This integration allows for a detailed analysis of thermal transfer within the SiP model of our FPGA. Implementation and simulations demonstrate that the Thermal Digital Twin (TDT) approach could reduce the risks associated with TSCA by a significant percentage, thereby enhancing the security of FPGA systems against thermal threats. Full article
(This article belongs to the Special Issue Advances in Reconfigurable Computing for Embedded Systems Based on FPGAs and SoCs)
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