Advances in SoCs and Embedded Systems

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Circuit and Signal Processing".

Deadline for manuscript submissions: 15 December 2024 | Viewed by 1268

Special Issue Editors


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Guest Editor
Engineering Product Development (EPD), Singapore University of Technology and Design, Singapore 487372, Singapore
Interests: low-power and low-voltage design for sensor interface; mixed-signal wireless; AI integrated circuit
Special Issues, Collections and Topics in MDPI journals

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Guest Editor
College of Engineering, Science and Environment, School of Engineering, Newcastle Australia Institute of Higher Education, Singapore 188064, Singapore
Interests: ASIC design of power management unit; robotics; Artificial Intelligence; energy-harvesting applications

Special Issue Information

Dear Colleagues,

We are pleased to announce a call for papers for a Special Issue on "Advances in SoCs and Embedded Systems" in Electronics. This Special Issue aims to provide a platform for researchers, engineers, and practitioners to present their latest research findings, innovations, and advancements in the field of SoCs (System-on-Chip) and embedded systems. We invite original, high-quality submissions that explore various aspects of SoCs and embedded systems, including, but not limited to, the following topics:

  1. Wireless Communication Systems:
    • Next-generation wireless communication protocols and technologies;
    • Wireless sensor networks;
    • Cognitive radio networks;
    • 5G and beyond systems;
    • IoT connectivity and wireless networking.
  2. Cyber Security in Embedded Systems:
    • Security protocols and algorithms for embedded systems;
    • Threat modeling and vulnerability analysis;
    • Hardware and software security solutions;
    • Secure communication and encryption;
    • Secure boot and firmware protection.
  3. Industrial Internet of Things (IIoT):
    • IIoT architectures and frameworks;
    • IIoT data analytics and visualization;
    • Industrial automation and control systems;
    • Edge computing for IIoT;
    • IIoT applications in manufacturing, healthcare, transportation, etc.
  4. Electronics and Circuit Design:
    • Advanced circuit design techniques;
    • Low-power and energy-efficient designs;
    • High-speed and high-performance circuits;
    • Mixed-signal and analog circuit design;
    • Design methodologies and tools.
  5. RISC-V Architecture and Applications:
    • RISC-V processor design and optimization;
    • RISC-V-based embedded systems;
    • RISC-V tools and software development;
    • RISC-V extensions and customizations;
    • RISC-V in IoT and edge computing.

While the above topics are of particular interest, we also welcome submissions on any other relevant topic related to SoCs and embedded systems. We encourage submissions that address practical challenges, propose novel solutions, and demonstrate the potential impact of SoCs and embedded systems in various domains. Both theoretical and experimental studies are welcome.

Dr. Teo Tee Hui
Dr. Kok Chiang Liang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • wireless communication
  • cybersecurity
  • Industry Internet of Things (IIoT)
  • electronics
  • RISC-V
  • embedded systems
  • System-on-Chip (SoC) design
  • Artificial Intelligence (AI) in embedded systems
  • edge computing
  • real-time systems
  • cloud computing

Published Papers (1 paper)

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Research

16 pages, 2808 KiB  
Article
Designing a Twin Frequency Control DC-DC Buck Converter Using Accurate Load Current Sensing Technique
by Chiang Liang Kok and Liter Siek
Electronics 2024, 13(1), 45; https://doi.org/10.3390/electronics13010045 - 20 Dec 2023
Viewed by 743
Abstract
In this paper, a buck DC-DC converter with the proposed twin frequency control scheme (TFCS) and accurate load current sensing (ALCS) was designed and implemented with 0.18 µm CMOS technology for a supply voltage ranging from 2.0 to 3.0 V, which is compatible [...] Read more.
In this paper, a buck DC-DC converter with the proposed twin frequency control scheme (TFCS) and accurate load current sensing (ALCS) was designed and implemented with 0.18 µm CMOS technology for a supply voltage ranging from 2.0 to 3.0 V, which is compatible with state-of-the-art batteries (NiCd/NiMH: 1.1–2 V, Li-Ion: 2.5–4.2 V). The proposed converter yields a peak efficiency of about 92.7% with a load current of 30 mA. Furthermore, it only occupies a silicon area of 1.3 mm2. The proposed buck converter is dedicated for smartphone applications whereby it spends most of its time in idle, low load conditions. Full article
(This article belongs to the Special Issue Advances in SoCs and Embedded Systems)
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