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Advanced RF/MM-Wave Circuits Design and Applications

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Electrical, Electronics and Communications Engineering".

Deadline for manuscript submissions: 20 September 2025 | Viewed by 287

Special Issue Editors


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Guest Editor
School of Integrated Circuit Science and Engineering, Beihang University, Xueyuan Str 37, Haidian District, Beijing 100191, China
Interests: millimeter-wave; terahertz; system-on-chip; biomedical communication systems; millimeter-wave/terahertz phased arrays; RF chips; on-chip/AiP antennas; low-power implantable chips; implantable/wearable body communication; embedded systems
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
School of Integrated Circuit Science and Engineering, Beihang University, Beijing 100191, China
Interests: internet of things communication chips
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

The rapid advancement in radio frequency (RF) and millimeter-wave (MM-Wave) technologies is pushing the boundaries of modern communication, sensing, and imaging systems. The growing demand for higher bandwidth, lower latency, and increased efficiency in applications such as 5G/6G wireless communications, radar systems, satellite communications, and autonomous vehicles necessitates innovative designs for RF/MM-Wave circuits and systems. This Special Issue aims to present the latest developments, trends, and applications in the design and implementation of advanced RF/MM-Wave circuits, focusing on novel materials, devices, and system architectures.

Topics of interest include, but are not limited to, the following:

  • Novel RF/MM-Wave circuit architectures and designs.
  • Integrated circuits for high-frequency applications.
  • Antenna design for RF/MM-Wave systems.
  • Advanced integrated passive devices for RF/MM-Wave systems.
  • Advanced packaging technologies for 5G/6G mmWave and IoT, etc.
  • Materials and fabrication technologies for RF/MM-Wave devices.
  • RF/MM-Wave System-on-Chip (SoC) Design.
  • Low Power and Energy-Efficient RF/MM-Wave Systems.
  • Wireless Power Transfer and Energy Harvesting at RF/MM-Wave Frequencies.
  • Machine Learning and AI for RF/MM-Wave Circuit Design.
  • Advanced RF/MM-Wave Applications: wireless communications, radar, imaging, sensing, etc.

This Special Issue will feature original research papers, reviews, and experimental studies that contribute to advancing the field of RF/MM-Wave circuits and their diverse applications.

Dr. Xiao Fang
Prof. Dr. Hui Zhang
Guest Editors

Manuscript Submission Information

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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • RF/MM-Wave circuit architectures
  • high-frequency integrated circuits
  • antenna design
  • integrated passive devices
  • 5G/6G mmWave technologies
  • materials for RF/MM-Wave devices
  • System-on-Chip (SoC) design
  • energy-efficient RF/MM-Wave systems
  • wireless power transfer
  • machine learning for circuit design

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Published Papers (1 paper)

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Research

11 pages, 5736 KiB  
Article
A Multi-Coupling 3D Frequency-Selective Surface with High Selectivity and Wide Dual Passband
by Xiao Fang, Rongguang Feng, Zinan Wang, Ning Leng, Pan Ou and Ming Bai
Appl. Sci. 2025, 15(10), 5531; https://doi.org/10.3390/app15105531 - 15 May 2025
Viewed by 140
Abstract
A novel single-layer multi-coupling 3D frequency-selective surface featuring high selectivity and a 3D dual-band frequency-selective surface (3D-DBFSS) is presented in this paper. By incorporating three different coupling gaps within each unit cell, the design achieves two distinct passbands with wide bandwidths and steep [...] Read more.
A novel single-layer multi-coupling 3D frequency-selective surface featuring high selectivity and a 3D dual-band frequency-selective surface (3D-DBFSS) is presented in this paper. By incorporating three different coupling gaps within each unit cell, the design achieves two distinct passbands with wide bandwidths and steep transition edges. For the first passband, the −3 dB bandwidth ranges from the lower cutoff frequency of 9.9 GHz to the upper cutoff frequency of 15.2 GHz, yielding a bandwidth (BWL3dB) of 5.3 GHz. For the second passband, the −3 dB bandwidth extends from 22 GHz to 26 GHz, providing a bandwidth (BWU3dB) of 4 GHz. The structure exhibits eight transmission poles and four transmission zeros within a single layer, enhancing its selectivity. The simulation results indicate that the dual passbands are centered at 12 GHz and 24 GHz, respectively, with bandwidths sufficient for practical applications. The proposed frequency-selective surface demonstrates a low insertion loss of just 0.8 dB, which is significantly lower compared to most reported dual-band FSS designs. Furthermore, the thickness of the 3D-DBFSS is only one-third of the wavelength in free space, making it considerably thinner than other 3D-FSS structures operating in the same frequency range. The proposed design also ensures stable performance over a wide range of incident angles, which is crucial for practical deployment. Additionally, the overall size of the unit cell of the frequency-selective surface is 4 × 4 × 10.8 m3. The structure is easy to fabricate, which contributes to its potential for cost-effective mass production. Overall, the 3D-DBFSS offers high frequency selectivity, effective bandpass performance, and strong suppression in the stopband region. Full article
(This article belongs to the Special Issue Advanced RF/MM-Wave Circuits Design and Applications)
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