Novel Research on Heat Transfer and Thermodynamics
This special issue belongs to the section "Applied Thermal Engineering".
Special Issue Information
Dear Colleagues,
This is a kind invitation for you to submit an article in the fields of heat transfer and thermodynamics. Recent advances allow many aspects of the effects of properties, conditions, and various applications. However, more research is necessary to improve the thermal performance of processes and devices. This Special Issue seeks to publish all contributions with a deep insight into solving technological problems and applications. Also, looking to mitigate the consequences of climate change, this Special Issue looks for friendly solutions involving heat and thermodynamics.
I hope you will consider submitting your work to this Special Issue of the Journal of Applied Sciences.
Prof. Dr. Fernando Zenaido Sierra-Espinosa
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the Special Issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-anonymized peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- convective heat transfer coefficient
- film cooling
- thermal boundary layer
- Nusselt number
- Reynolds number
- natural–forced convection
- turbulence
- thermal comfort
- thermal conjugate CFD solution
- ORC
- thermo-economic evaluation
- failure analysis
- solar-assisted system
- heat transfer rate
- Rayleigh number
- nanofluid
- thermal boundary layer
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Published Papers
Appl. Sci. - ISSN 2076-3417