Dunputh, Y.; Kiss, N.; Sandy, M.J.; Székely, D.; Firoz, M.M.D.; Bakonyi, A.
Finite Element Simulation of Surface-Mount Resistor Solder Joint Quarter Models Under Thermomechanical Loading. Eng. Proc. 2025, 113, 50.
https://doi.org/10.3390/engproc2025113050
AMA Style
Dunputh Y, Kiss N, Sandy MJ, Székely D, Firoz MMD, Bakonyi A.
Finite Element Simulation of Surface-Mount Resistor Solder Joint Quarter Models Under Thermomechanical Loading. Engineering Proceedings. 2025; 113(1):50.
https://doi.org/10.3390/engproc2025113050
Chicago/Turabian Style
Dunputh, Yashveer, Norbert Kiss, Matthew Joshua Sandy, Dániel Székely, Mahmud M. D. Firoz, and Antal Bakonyi.
2025. "Finite Element Simulation of Surface-Mount Resistor Solder Joint Quarter Models Under Thermomechanical Loading" Engineering Proceedings 113, no. 1: 50.
https://doi.org/10.3390/engproc2025113050
APA Style
Dunputh, Y., Kiss, N., Sandy, M. J., Székely, D., Firoz, M. M. D., & Bakonyi, A.
(2025). Finite Element Simulation of Surface-Mount Resistor Solder Joint Quarter Models Under Thermomechanical Loading. Engineering Proceedings, 113(1), 50.
https://doi.org/10.3390/engproc2025113050
