This issue of Engineering Proceedings gathers the papers presented at the 8th International Electronic Conference on Sensors and Applications (ECSA-8), held online on 1–15 November 2021, through the sciforum.net platform developed by MDPI. The annual ECSA conference was initiated in 2014 on an online basis only, to allow participation from all over the world with no concerns of travel and related expenditures. This type of conference looks particularly appropriate and useful because research concerned with sensors is rapidly growing, and a platform for rapid and direct exchanges about the latest research findings can provide a further burst in the development of novel ideas.
This year’s edition saw increased collaboration online during virtual presentations, an increased number of submissions and dialogue, and the inclusion of conference committee members worldwide. Video recordings of the sessions and open access to papers and presentations can be found online at https://ecsa-8.sciforum.net/.
ECSA-8 collected contributions concerning four thematic areas where sensors are changing science (Chemo- and Biosensors, Physical Sensors, Sensor Networks, and Applications) and eight focus area sessions (Structural Health Monitoring Technologies and Sensor Networks, Wearable Sensors, Smart Cities, Optical Sensors, Sensing and Imaging, Positioning and Navigation, Sensing for Robotics and Automation, and Ultrasonic Monitoring of Fibre Metal Laminates), see https://ecsa-8.sciforum.net/. In total, 91 technical contributions and two keynote presentations were gathered, and all went through an independent peer-review process. During the conference, three live sessions were held online successfully.
A companion Special Issue of Sensors, see https://www.mdpi.com/journal/sensors/special_issues/ECSA_8, will collect full-length versions of selected papers.
We would also like to warmly thank Jason Liu and Nora Zhang for their extraordinary editorial work and support before, during, and right after ECSA-8.
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© 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).