Spiridon, B.F.; Griffin, P.H.; Jarman, J.C.; Liu, Y.; Zhu, T.; Luca, A.D.; Oliver, R.A.; Udrea, F.
On-Chip Thermal Insulation Using Porous GaN. Proceedings 2018, 2, 776.
https://doi.org/10.3390/proceedings2130776
AMA Style
Spiridon BF, Griffin PH, Jarman JC, Liu Y, Zhu T, Luca AD, Oliver RA, Udrea F.
On-Chip Thermal Insulation Using Porous GaN. Proceedings. 2018; 2(13):776.
https://doi.org/10.3390/proceedings2130776
Chicago/Turabian Style
Spiridon, Bogdan F., Peter H. Griffin, John C. Jarman, Yingjun Liu, Tongtong Zhu, Andrea De Luca, Rachel A. Oliver, and Florin Udrea.
2018. "On-Chip Thermal Insulation Using Porous GaN" Proceedings 2, no. 13: 776.
https://doi.org/10.3390/proceedings2130776
APA Style
Spiridon, B. F., Griffin, P. H., Jarman, J. C., Liu, Y., Zhu, T., Luca, A. D., Oliver, R. A., & Udrea, F.
(2018). On-Chip Thermal Insulation Using Porous GaN. Proceedings, 2(13), 776.
https://doi.org/10.3390/proceedings2130776
