Particle Velocities near and along the Electrode during Electrophoretic Deposition: Influence of Surfactant Counter-Ions
AbstractResearch into the micro-nanostructured coatings process has made a variety of new applications available. Electrophoretic deposition (EPD) is an efficient and attractive technique to produce coated materials. Therefore the understanding of the formation and growth mechanism of the coating process continues to be investigated. In this study, a home-made EPD laminar flow cell was used for in-situ investigation of the particle velocity and deposition of micronic particles on a cathode. Monodisperse polystyrene latex particles were functionalized with cationic surfactants: cetyltrimethyl ammonium bromide (CTAB) or cetyltrimethyl ammonium chloride (CTAC). The tangential velocity of the particles when they migrated to the electrode, the approach angle and the tangential velocity along the electrode were measured under a DC electric field. From the values of the velocities, the particle-electrode distance was evaluated in CTAB and CTAC solutions. The electrophoretic velocity was calculated from the electrophoretic mobility of the particles and the electric field applied to the particles. All these parameters depend on the type of surfactant counter-ions and influence the growth of the coating. Dense structures were obtained in CTAB solution while open structures were observed in CTAC solution. View Full-Text
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Filiâtre, C.; Pignolet, C.; Buron, C.C. Particle Velocities near and along the Electrode during Electrophoretic Deposition: Influence of Surfactant Counter-Ions. Coatings 2017, 7, 147.
Filiâtre C, Pignolet C, Buron CC. Particle Velocities near and along the Electrode during Electrophoretic Deposition: Influence of Surfactant Counter-Ions. Coatings. 2017; 7(9):147.Chicago/Turabian Style
Filiâtre, Claudine; Pignolet, Céline; Buron, Cédric C. 2017. "Particle Velocities near and along the Electrode during Electrophoretic Deposition: Influence of Surfactant Counter-Ions." Coatings 7, no. 9: 147.
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