Tran, T.Q.; Chinnappan, A.; Lee, J.K.Y.; Loc, N.H.; Tran, L.T.; Wang, G.; Kumar, V.V.; Jayathilaka, W.A.D.M.; Ji, D.; Doddamani, M.;
et al. 3D Printing of Highly Pure Copper. Metals 2019, 9, 756.
https://doi.org/10.3390/met9070756
AMA Style
Tran TQ, Chinnappan A, Lee JKY, Loc NH, Tran LT, Wang G, Kumar VV, Jayathilaka WADM, Ji D, Doddamani M,
et al. 3D Printing of Highly Pure Copper. Metals. 2019; 9(7):756.
https://doi.org/10.3390/met9070756
Chicago/Turabian Style
Tran, Thang Q., Amutha Chinnappan, Jeremy Kong Yoong Lee, Nguyen Huu Loc, Long T. Tran, Gengjie Wang, Vishnu Vijay Kumar, W. A. D. M. Jayathilaka, Dongxiao Ji, Mrityunjay Doddamani,
and et al. 2019. "3D Printing of Highly Pure Copper" Metals 9, no. 7: 756.
https://doi.org/10.3390/met9070756
APA Style
Tran, T. Q., Chinnappan, A., Lee, J. K. Y., Loc, N. H., Tran, L. T., Wang, G., Kumar, V. V., Jayathilaka, W. A. D. M., Ji, D., Doddamani, M., & Ramakrishna, S.
(2019). 3D Printing of Highly Pure Copper. Metals, 9(7), 756.
https://doi.org/10.3390/met9070756