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Open AccessReview

3D Printing of Highly Pure Copper

1
Department of Mechanical Engineering, National University of Singapore, 9 Engineering Drive 1, EA-07-05, Singapore 117575, Singapore
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Faculty of Mechanical Engineering, Ho Chi Minh City University of Technology, VNUHCM, 268 Ly Thuong Kiet, District 10, Ho Chi Minh City 740400, Vietnam
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Institute of Materials Engineering, National Laboratory of Solid State Microstructures, College of Engineering and Applied Sciences, Nanjing University, Nanjing 210093, China
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Lightweight Materials Laboratory, Department of Mechanical Engineering, National Institute of Technology Karnataka, Surathkal 575025, India
*
Authors to whom correspondence should be addressed.
Metals 2019, 9(7), 756; https://doi.org/10.3390/met9070756
Received: 14 June 2019 / Revised: 29 June 2019 / Accepted: 2 July 2019 / Published: 5 July 2019
Copper has been widely used in many applications due to its outstanding properties such as malleability, high corrosion resistance, and excellent electrical and thermal conductivities. While 3D printing can offer many advantages from layer-by-layer fabrication, the 3D printing of highly pure copper is still challenging due to the thermal issues caused by copper’s high conductivity. This paper presents a comprehensive review of recent work on 3D printing technology of highly pure copper over the past few years. The advantages and current issues of 3D printing methods are compared while different properties of copper parts printed by these methods are summarized. Finally, we provide several potential applications of the 3D printed copper parts and an overview of current developments that could lead to new improvements in this advanced manufacturing field. View Full-Text
Keywords: copper; additive manufacturing; selective laser melting; electron beam melting; binder jetting; ultrasonic additive manufacturing copper; additive manufacturing; selective laser melting; electron beam melting; binder jetting; ultrasonic additive manufacturing
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MDPI and ACS Style

Tran, T.Q.; Chinnappan, A.; Lee, J.K.Y.; Loc, N.H.; Tran, L.T.; Wang, G.; Kumar, V.V.; Jayathilaka, W.A.D.M.; Ji, D.; Doddamani, M.; Ramakrishna, S. 3D Printing of Highly Pure Copper. Metals 2019, 9, 756. https://doi.org/10.3390/met9070756

AMA Style

Tran TQ, Chinnappan A, Lee JKY, Loc NH, Tran LT, Wang G, Kumar VV, Jayathilaka WADM, Ji D, Doddamani M, Ramakrishna S. 3D Printing of Highly Pure Copper. Metals. 2019; 9(7):756. https://doi.org/10.3390/met9070756

Chicago/Turabian Style

Tran, Thang Q.; Chinnappan, Amutha; Lee, Jeremy K.Y.; Loc, Nguyen H.; Tran, Long T.; Wang, Gengjie; Kumar, Vishnu V.; Jayathilaka, W. A.D.M.; Ji, Dongxiao; Doddamani, Mrityunjay; Ramakrishna, Seeram. 2019. "3D Printing of Highly Pure Copper" Metals 9, no. 7: 756. https://doi.org/10.3390/met9070756

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