Thi Hong Hoa, N.; Hoan, N.T.; Nguyen Trong, N.; Linh, N.T.N.; Quy, B.M.; Pham, T.T.H.; Nguyen, V.Q.; Nguyen Van, P.; Nguyen, V.D.
Enhancement of Leaching Copper from Printed Circuit Boards of Discarded Mobile Phones Using Ultrasound–Ozone Integrated Approach. Metals 2023, 13, 1145.
https://doi.org/10.3390/met13061145
AMA Style
Thi Hong Hoa N, Hoan NT, Nguyen Trong N, Linh NTN, Quy BM, Pham TTH, Nguyen VQ, Nguyen Van P, Nguyen VD.
Enhancement of Leaching Copper from Printed Circuit Boards of Discarded Mobile Phones Using Ultrasound–Ozone Integrated Approach. Metals. 2023; 13(6):1145.
https://doi.org/10.3390/met13061145
Chicago/Turabian Style
Thi Hong Hoa, Nguyen, Nguyen To Hoan, Nghia Nguyen Trong, Nguyen Thi Ngoc Linh, Bui Minh Quy, Thi Thu Ha Pham, Van Que Nguyen, Phuoc Nguyen Van, and Vinh Dinh Nguyen.
2023. "Enhancement of Leaching Copper from Printed Circuit Boards of Discarded Mobile Phones Using Ultrasound–Ozone Integrated Approach" Metals 13, no. 6: 1145.
https://doi.org/10.3390/met13061145
APA Style
Thi Hong Hoa, N., Hoan, N. T., Nguyen Trong, N., Linh, N. T. N., Quy, B. M., Pham, T. T. H., Nguyen, V. Q., Nguyen Van, P., & Nguyen, V. D.
(2023). Enhancement of Leaching Copper from Printed Circuit Boards of Discarded Mobile Phones Using Ultrasound–Ozone Integrated Approach. Metals, 13(6), 1145.
https://doi.org/10.3390/met13061145
