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3D Integrated Circuit Cooling with Microfluidics

School of software and microelectronics, Northwestern Polytechnical University, Xi’an 710072, China
Lassonde School of Engineering, York University, Toronto, ON M3J 1P3, Canada
Research & Development Institute of Northwestern Polytechnical University, Shenzhen 518057, China
School of Pharmaceutical Science, Guangzhou University of Chinese Medicine, Guangzhou 510006, China
Author to whom correspondence should be addressed.
Micromachines 2018, 9(6), 287;
Received: 27 April 2018 / Revised: 24 May 2018 / Accepted: 1 June 2018 / Published: 7 June 2018
(This article belongs to the Section B:Biology)
PDF [2133 KB, uploaded 7 June 2018]


Using microfluidic cooling to achieve thermal management of three-dimensional integrated circuits (ICs) is recognized as a promising method of extending Moore law progression in electronic components and systems. Since the U.S. Defense Advanced Research Projects Agency launched Intra/Inter Chip Enhanced Cooling thermal packaging program, the method of using microfluidic cooling in 3D ICs has been under continuous development. This paper presents an analysis of all publications available about the microfluidic cooling technologies used in 3D IC thermal management, and summarized these research works into six categories: cooling structure design, co-design issues, through silicon via (TSV) influence, specific chip applications, thermal models, and non-uniform heating and hotspots. The details of these research works are given, future works are suggested. View Full-Text
Keywords: microfluidics; 3D; integrated circuits; cooling microfluidics; 3D; integrated circuits; cooling

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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).

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Wang, S.; Yin, Y.; Hu, C.; Rezai, P. 3D Integrated Circuit Cooling with Microfluidics. Micromachines 2018, 9, 287.

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