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Article

Mechanical Vibrations of Thermally Actuated Silicon Membranes

1
Electrical and Microelectronic Engineering Department, Rochester Institute of Technology, 82 Lomb Memorial Dr., Rochester, NY 14623, USA
2
Microsystems Engineering Department, Rochester Institute of Technology, 82 Lomb Memorial Dr., Rochester, NY 14623, USA
*
Author to whom correspondence should be addressed.
Micromachines 2012, 3(2), 255-269; https://doi.org/10.3390/mi3020255
Received: 14 February 2012 / Revised: 14 March 2012 / Accepted: 26 March 2012 / Published: 28 March 2012
(This article belongs to the Special Issue Thermal Switches and Control of Heat Transfer in MEMS)
A thermally-actuated micro-electro-mechanical (MEMS) device based on a vibrating silicon membrane has been proposed as a viscosity sensor by the authors. In this paper we analyze the vibration mode of the sensor as it vibrates freely at its natural frequency. Analytical examination is compared to finite element analysis, electrical measurements and the results obtained through real-time dynamic optical surface profilometry. The vertical movement of the membrane due to the applied heat is characterized statically and dynamically. The natural vibration mode is determined to be the (1,1) mode and good correlation is found between the analytical predictions, the simulation analysis, the observed mechanical displacement and the electrical measurements. View Full-Text
Keywords: MEMS; thermal actuation; thermal vibration; vibration mode MEMS; thermal actuation; thermal vibration; vibration mode
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MDPI and ACS Style

Puchades, I.; Koz, M.; Fuller, L. Mechanical Vibrations of Thermally Actuated Silicon Membranes. Micromachines 2012, 3, 255-269. https://doi.org/10.3390/mi3020255

AMA Style

Puchades I, Koz M, Fuller L. Mechanical Vibrations of Thermally Actuated Silicon Membranes. Micromachines. 2012; 3(2):255-269. https://doi.org/10.3390/mi3020255

Chicago/Turabian Style

Puchades, Ivan, Mustafa Koz, and Lynn Fuller. 2012. "Mechanical Vibrations of Thermally Actuated Silicon Membranes" Micromachines 3, no. 2: 255-269. https://doi.org/10.3390/mi3020255

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