Wang, B.; Zhang, Y.; Huang, Y.; Li, Z.; Jiang, S.; Wang, F.; Liu, Q.; Yang, X.
A High-Accuracy Solid/Liquid Composite Packaging Method for Implantable Pressure Sensors. Micromachines 2026, 17, 162.
https://doi.org/10.3390/mi17020162
AMA Style
Wang B, Zhang Y, Huang Y, Li Z, Jiang S, Wang F, Liu Q, Yang X.
A High-Accuracy Solid/Liquid Composite Packaging Method for Implantable Pressure Sensors. Micromachines. 2026; 17(2):162.
https://doi.org/10.3390/mi17020162
Chicago/Turabian Style
Wang, Bo, Yubiao Zhang, Yuning Huang, Zhonghua Li, Senran Jiang, Fuji Wang, Qiang Liu, and Xing Yang.
2026. "A High-Accuracy Solid/Liquid Composite Packaging Method for Implantable Pressure Sensors" Micromachines 17, no. 2: 162.
https://doi.org/10.3390/mi17020162
APA Style
Wang, B., Zhang, Y., Huang, Y., Li, Z., Jiang, S., Wang, F., Liu, Q., & Yang, X.
(2026). A High-Accuracy Solid/Liquid Composite Packaging Method for Implantable Pressure Sensors. Micromachines, 17(2), 162.
https://doi.org/10.3390/mi17020162