Wang, X.; Li, J.; Chen, Y.; Zhou, J.; Cheng, L.; Zhang, D.
Method for In Situ On-Wafer Tensile Test of Thin Films. Micromachines 2025, 16, 262.
https://doi.org/10.3390/mi16030262
AMA Style
Wang X, Li J, Chen Y, Zhou J, Cheng L, Zhang D.
Method for In Situ On-Wafer Tensile Test of Thin Films. Micromachines. 2025; 16(3):262.
https://doi.org/10.3390/mi16030262
Chicago/Turabian Style
Wang, Xufeng, Jiakang Li, Yi Chen, Jiawei Zhou, Leijian Cheng, and Dacheng Zhang.
2025. "Method for In Situ On-Wafer Tensile Test of Thin Films" Micromachines 16, no. 3: 262.
https://doi.org/10.3390/mi16030262
APA Style
Wang, X., Li, J., Chen, Y., Zhou, J., Cheng, L., & Zhang, D.
(2025). Method for In Situ On-Wafer Tensile Test of Thin Films. Micromachines, 16(3), 262.
https://doi.org/10.3390/mi16030262