Li, D.; Li, B.; Han, S.; Li, D.; Yang, B.; Gong, B.; Zhang, Z.; Yu, C.; Chen, P.
The Effect of BEOL Design Factors on the Thermal Reliability of Flip-Chip Chip-Scale Packaging. Micromachines 2025, 16, 121.
https://doi.org/10.3390/mi16020121
AMA Style
Li D, Li B, Han S, Li D, Yang B, Gong B, Zhang Z, Yu C, Chen P.
The Effect of BEOL Design Factors on the Thermal Reliability of Flip-Chip Chip-Scale Packaging. Micromachines. 2025; 16(2):121.
https://doi.org/10.3390/mi16020121
Chicago/Turabian Style
Li, Dejian, Bofu Li, Shunfeng Han, Dameng Li, Baobin Yang, Baoliang Gong, Zhangzhang Zhang, Chang Yu, and Pei Chen.
2025. "The Effect of BEOL Design Factors on the Thermal Reliability of Flip-Chip Chip-Scale Packaging" Micromachines 16, no. 2: 121.
https://doi.org/10.3390/mi16020121
APA Style
Li, D., Li, B., Han, S., Li, D., Yang, B., Gong, B., Zhang, Z., Yu, C., & Chen, P.
(2025). The Effect of BEOL Design Factors on the Thermal Reliability of Flip-Chip Chip-Scale Packaging. Micromachines, 16(2), 121.
https://doi.org/10.3390/mi16020121
