Article Versions Notes

Li D, Li B, Han S, Li D, Yang B, Gong B, Zhang Z, Yu C, Chen P. The Effect of BEOL Design Factors on the Thermal Reliability of Flip-Chip Chip-Scale Packaging. Micromachines. 2025; 16(2):121. https://doi.org/10.3390/mi16020121

Li, Dejian, Bofu Li, Shunfeng Han, Dameng Li, Baobin Yang, Baoliang Gong, Zhangzhang Zhang, Chang Yu, and Pei Chen. 2025. "The Effect of BEOL Design Factors on the Thermal Reliability of Flip-Chip Chip-Scale Packaging" Micromachines 16, no. 2: 121. https://doi.org/10.3390/mi16020121

Li, D., Li, B., Han, S., Li, D., Yang, B., Gong, B., Zhang, Z., Yu, C., & Chen, P. (2025). The Effect of BEOL Design Factors on the Thermal Reliability of Flip-Chip Chip-Scale Packaging. Micromachines, 16(2), 121. https://doi.org/10.3390/mi16020121