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Open AccessArticle

Feasibility Study of an Automated Assembly Process for Ultrathin Chips

Hahn-Schickard, Allmandring 9b, 70569 Stuttgart, Germany
Institute for Micro Integration (IFM), University of Stuttgart, Allmandring 9B, 70569 Stuttgart, Germany
Author to whom correspondence should be addressed.
Present adress: Pilz GmbH & Co.KG, Felix-Wankel-Straße 2, 73760 Ostfildern, Germany
Present adress: Balluff GmbH, Schurwaldstraße 9, 73765 Neuhausen auf den Fildern, Germany
Micromachines 2020, 11(7), 654;
Received: 26 May 2020 / Revised: 10 June 2020 / Accepted: 26 June 2020 / Published: 30 June 2020
(This article belongs to the Section E:Engineering and Technology)
This paper presents a feasibility study of an automated pick-and-place process for ultrathin chips on a standard automatic assembly machine. So far, scientific research about automated assembly of ultrathin chips, with thicknesses less than 50 µm, is missing, but is necessary for cost-effective, high-quantity production of system-in-foil for applications in narrow spaces or flexible smart health systems applied in biomedical applications. Novel pick-and-place tools for ultrathin chip handling were fabricated and a process for chip detachment from thermal release foil was developed. On this basis, an adhesive bonding process for ultrathin chips with 30 µm thickness was developed and transferred to an automatic assembly machine. Multiple ultrathin chips aligned to each other were automatically placed and transferred onto glass and polyimide foil with a relative placement accuracy of ±25 µm. View Full-Text
Keywords: system-in-foil; ultrathin chips; automated assembly system-in-foil; ultrathin chips; automated assembly
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MDPI and ACS Style

Janek, F.; Saller, E.; Müller, E.; Meißner, T.; Weser, S.; Barth, M.; Eberhardt, W.; Zimmermann, A. Feasibility Study of an Automated Assembly Process for Ultrathin Chips. Micromachines 2020, 11, 654.

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