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Materials 2014, 7(4), 2501-2521;

Tunneling Conductivity and Piezoresistivity of Composites Containing Randomly Dispersed Conductive Nano-Platelets

Advanced Composite Materials Engineering Group, Department of Mechanical Engineering, University of Alberta, Edmonton T6G 2G8, AB, Canada
Department of Chemical and Petroleum Engineering, University of Calgary, Calgary T2N 1N4, AB, Canada
Author to whom correspondence should be addressed.
Received: 31 October 2013 / Revised: 2 December 2013 / Accepted: 18 March 2014 / Published: 28 March 2014
(This article belongs to the Special Issue Nanocomposites of Polymers and Inorganic Particles 2013)
Full-Text   |   PDF [633 KB, uploaded 28 March 2014]


In this study, a three-dimensional continuum percolation model was developed based on a Monte Carlo simulation approach to investigate the percolation behavior of an electrically insulating matrix reinforced with conductive nano-platelet fillers. The conductivity behavior of composites rendered conductive by randomly dispersed conductive platelets was modeled by developing a three-dimensional finite element resistor network. Parameters related to the percolation threshold and a power-low describing the conductivity behavior were determined. The piezoresistivity behavior of conductive composites was studied employing a reoriented resistor network emulating a conductive composite subjected to mechanical strain. The effects of the governing parameters, i.e., electron tunneling distance, conductive particle aspect ratio and size effects on conductivity behavior were examined. View Full-Text
Keywords: nanocomposites; electrical properties; modeling; piezoresistivity effect nanocomposites; electrical properties; modeling; piezoresistivity effect
This is an open access article distributed under the Creative Commons Attribution License (CC BY 3.0).

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MDPI and ACS Style

Oskouyi, A.B.; Sundararaj, U.; Mertiny, P. Tunneling Conductivity and Piezoresistivity of Composites Containing Randomly Dispersed Conductive Nano-Platelets. Materials 2014, 7, 2501-2521.

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