Li, M.; Chen, X.; Deng, Y.; Wang, W.; Li, J.; Obara, E.; Han, Z.; Luo, C.
Multi-Scale Transient Thermo-Mechanical Coupling Analysis Method for the SiCf/SiC Composite Guide Vane. Materials 2025, 18, 3348.
https://doi.org/10.3390/ma18143348
AMA Style
Li M, Chen X, Deng Y, Wang W, Li J, Obara E, Han Z, Luo C.
Multi-Scale Transient Thermo-Mechanical Coupling Analysis Method for the SiCf/SiC Composite Guide Vane. Materials. 2025; 18(14):3348.
https://doi.org/10.3390/ma18143348
Chicago/Turabian Style
Li, Min, Xue Chen, Yu Deng, Wenjun Wang, Jian Li, Evance Obara, Zhilin Han, and Chuyang Luo.
2025. "Multi-Scale Transient Thermo-Mechanical Coupling Analysis Method for the SiCf/SiC Composite Guide Vane" Materials 18, no. 14: 3348.
https://doi.org/10.3390/ma18143348
APA Style
Li, M., Chen, X., Deng, Y., Wang, W., Li, J., Obara, E., Han, Z., & Luo, C.
(2025). Multi-Scale Transient Thermo-Mechanical Coupling Analysis Method for the SiCf/SiC Composite Guide Vane. Materials, 18(14), 3348.
https://doi.org/10.3390/ma18143348