Yin, T.; Xiang, N.; Wang, G.; Tian, B.; Sun, W.; Zhang, X.
Optimal Hot-Dipped Tinning Process Routine for the Fabrication of Solderable Sn Coatings on Circuit Lead Frames. Materials 2020, 13, 1191.
https://doi.org/10.3390/ma13051191
AMA Style
Yin T, Xiang N, Wang G, Tian B, Sun W, Zhang X.
Optimal Hot-Dipped Tinning Process Routine for the Fabrication of Solderable Sn Coatings on Circuit Lead Frames. Materials. 2020; 13(5):1191.
https://doi.org/10.3390/ma13051191
Chicago/Turabian Style
Yin, Ting, Nan Xiang, Guangxin Wang, Baohong Tian, Wanting Sun, and Xiaoyu Zhang.
2020. "Optimal Hot-Dipped Tinning Process Routine for the Fabrication of Solderable Sn Coatings on Circuit Lead Frames" Materials 13, no. 5: 1191.
https://doi.org/10.3390/ma13051191
APA Style
Yin, T., Xiang, N., Wang, G., Tian, B., Sun, W., & Zhang, X.
(2020). Optimal Hot-Dipped Tinning Process Routine for the Fabrication of Solderable Sn Coatings on Circuit Lead Frames. Materials, 13(5), 1191.
https://doi.org/10.3390/ma13051191