Zhao, D.; Zhang, K.; Ma, N.; Li, S.; Yin, C.; Huo, F.
Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging. Materials 2020, 13, 831.
https://doi.org/10.3390/ma13040831
AMA Style
Zhao D, Zhang K, Ma N, Li S, Yin C, Huo F.
Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging. Materials. 2020; 13(4):831.
https://doi.org/10.3390/ma13040831
Chicago/Turabian Style
Zhao, Di, Keke Zhang, Ning Ma, Shijie Li, Chenxiang Yin, and Fupeng Huo.
2020. "Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging" Materials 13, no. 4: 831.
https://doi.org/10.3390/ma13040831
APA Style
Zhao, D., Zhang, K., Ma, N., Li, S., Yin, C., & Huo, F.
(2020). Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging. Materials, 13(4), 831.
https://doi.org/10.3390/ma13040831