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Volume 13
Issue 20
10.3390/ma13204563
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Article

Size Effect on Mechanical Properties and Deformation Behavior of Pure Copper Wires Considering Free Surface Grains

by
Yu Hou
1,2,3,
Xujun Mi
1,2,*,
Haofeng Xie
1,2,*,
Wenjing Zhang
1,2,
Guojie Huang
1,2,
Lijun Peng
1,2,
Xue Feng
2 and
Zhen Yang
1,2
1
State Key Laboratory of Nonferrous Metals and Processes, GRIMAT Group Co., Ltd., Beijing 100088, China
2
GRIMAT Engineering Institute Co., Ltd., Beijing 101407, China
3
General Research Institute for Nonferrous Metals, Beijing 100088, China
*
Authors to whom correspondence should be addressed.
Materials 2020, 13(20), 4563; https://doi.org/10.3390/ma13204563
Received: 8 September 2020 / Revised: 29 September 2020 / Accepted: 1 October 2020 / Published: 14 October 2020
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Abstract

The size (grain size and specimen size) effect makes traditional macroscopic forming technology unsuitable for a microscopic forming process. In order to investigate the size effect on mechanical properties and deformation behavior, pure copper wires (diameters range from 50 μm to 500 μm) were annealed at different temperatures to obtain different grain sizes. The results show that a decrease in wire diameter leads to a reduction in tensile strength, and this change is pronounced for large grains. The elongation of the material is in linear correlation to size factor D/d (diameter/grain size), i.e., at the same wire diameter, more grains in the section bring better plasticity. This phenomenon is in relationship with the ratio of free surface grains. A surface model combined with the theory of single crystal and polycrystal is established, based on the relationship between specimen/grain size and tensile property. The simulated results show that the flow stress in micro-scale is in the middle of the single crystal model (lower critical value) and the polycrystalline model (upper critical value). Moreover, the simulation results of the hybrid model calculations presented in this paper are in good agreement with the experimental results. View Full-Text
Keywords: size effect; pure copper wires; mechanical properties; deformation behavior; surface model; free surface grain size effect; pure copper wires; mechanical properties; deformation behavior; surface model; free surface grain
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MDPI and ACS Style

Hou, Y.; Mi, X.; Xie, H.; Zhang, W.; Huang, G.; Peng, L.; Feng, X.; Yang, Z. Size Effect on Mechanical Properties and Deformation Behavior of Pure Copper Wires Considering Free Surface Grains. Materials 2020, 13, 4563. https://doi.org/10.3390/ma13204563

AMA Style

Hou Y, Mi X, Xie H, Zhang W, Huang G, Peng L, Feng X, Yang Z. Size Effect on Mechanical Properties and Deformation Behavior of Pure Copper Wires Considering Free Surface Grains. Materials. 2020; 13(20):4563. https://doi.org/10.3390/ma13204563

Chicago/Turabian Style

Hou, Yu, Xujun Mi, Haofeng Xie, Wenjing Zhang, Guojie Huang, Lijun Peng, Xue Feng, and Zhen Yang. 2020. "Size Effect on Mechanical Properties and Deformation Behavior of Pure Copper Wires Considering Free Surface Grains" Materials 13, no. 20: 4563. https://doi.org/10.3390/ma13204563

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