An inspection process using a Spring Contact Probe (SCP) is an essential step in the semiconductor-manufacturing process. Many plungers, which are the main body of the SCP, are manufactured by a stamping process. After the stamping process, mechanical cutting is applied and the plunger body may be damaged. Thus, to improve cut quality and productivity while minimizing body damage, laser spot cutting can be used. To fully utilize this technology, it is necessary to investigate interaction characteristics of beryllium copper (BeCu) during laser spot cutting. Effects of a total irradiated laser-pulse energy (1
) and pulse duration (100
) on the material-removal zone, thermal depth, and crater size are examined. The crater size can be affected by the localization of heating dominantly. An incubation model is applied to investigate the correlation between crater size and laser-pulse energy. Surface morphology characteristics such as edge separation, small particles, spatter motion, and soaring-up motion are observed.
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