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Open AccessArticle

Understanding of BeCu Interaction Characteristics with a Variation of ns Laser-Pulse Duration

Department of Mechanical and Automotive Engineering, Kongju National University, Cheonan 31080, Korea
Materials 2018, 11(8), 1423; https://doi.org/10.3390/ma11081423
Received: 10 July 2018 / Revised: 8 August 2018 / Accepted: 12 August 2018 / Published: 13 August 2018
(This article belongs to the Section Manufacturing Processes and Systems)
An inspection process using a Spring Contact Probe (SCP) is an essential step in the semiconductor-manufacturing process. Many plungers, which are the main body of the SCP, are manufactured by a stamping process. After the stamping process, mechanical cutting is applied and the plunger body may be damaged. Thus, to improve cut quality and productivity while minimizing body damage, laser spot cutting can be used. To fully utilize this technology, it is necessary to investigate interaction characteristics of beryllium copper (BeCu) during laser spot cutting. Effects of a total irradiated laser-pulse energy (1 mJ ~1000 mJ ) and pulse duration (100 ns ~8 ns ) on the material-removal zone, thermal depth, and crater size are examined. The crater size can be affected by the localization of heating dominantly. An incubation model is applied to investigate the correlation between crater size and laser-pulse energy. Surface morphology characteristics such as edge separation, small particles, spatter motion, and soaring-up motion are observed. View Full-Text
Keywords: laser-material interaction characteristics; laser spot cutting; spring contact probe; semiconductor package inspection; beryllium copper laser-material interaction characteristics; laser spot cutting; spring contact probe; semiconductor package inspection; beryllium copper
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Lee, D. Understanding of BeCu Interaction Characteristics with a Variation of ns Laser-Pulse Duration. Materials 2018, 11, 1423.

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