Zain-ul-abdein, M.; Ijaz, H.; Saleem, W.; Raza, K.; Mahfouz, A.S.B.; Mabrouki, T.
Finite Element Analysis of Interfacial Debonding in Copper/Diamond Composites for Thermal Management Applications. Materials 2017, 10, 739.
https://doi.org/10.3390/ma10070739
AMA Style
Zain-ul-abdein M, Ijaz H, Saleem W, Raza K, Mahfouz ASB, Mabrouki T.
Finite Element Analysis of Interfacial Debonding in Copper/Diamond Composites for Thermal Management Applications. Materials. 2017; 10(7):739.
https://doi.org/10.3390/ma10070739
Chicago/Turabian Style
Zain-ul-abdein, Muhammad, Hassan Ijaz, Waqas Saleem, Kabeer Raza, Abdullah Salmeen Bin Mahfouz, and Tarek Mabrouki.
2017. "Finite Element Analysis of Interfacial Debonding in Copper/Diamond Composites for Thermal Management Applications" Materials 10, no. 7: 739.
https://doi.org/10.3390/ma10070739
APA Style
Zain-ul-abdein, M., Ijaz, H., Saleem, W., Raza, K., Mahfouz, A. S. B., & Mabrouki, T.
(2017). Finite Element Analysis of Interfacial Debonding in Copper/Diamond Composites for Thermal Management Applications. Materials, 10(7), 739.
https://doi.org/10.3390/ma10070739