Ventola, L.; Curcuruto, G.; Fasano, M.; Fotia, S.; Pugliese, V.; Chiavazzo, E.; Asinari, P.
Unshrouded Plate Fin Heat Sinks for Electronics Cooling: Validation of a Comprehensive Thermal Model and Cost Optimization in Semi-Active Configuration. Energies 2016, 9, 608.
https://doi.org/10.3390/en9080608
AMA Style
Ventola L, Curcuruto G, Fasano M, Fotia S, Pugliese V, Chiavazzo E, Asinari P.
Unshrouded Plate Fin Heat Sinks for Electronics Cooling: Validation of a Comprehensive Thermal Model and Cost Optimization in Semi-Active Configuration. Energies. 2016; 9(8):608.
https://doi.org/10.3390/en9080608
Chicago/Turabian Style
Ventola, Luigi, Gabriele Curcuruto, Matteo Fasano, Saverio Fotia, Vincenzo Pugliese, Eliodoro Chiavazzo, and Pietro Asinari.
2016. "Unshrouded Plate Fin Heat Sinks for Electronics Cooling: Validation of a Comprehensive Thermal Model and Cost Optimization in Semi-Active Configuration" Energies 9, no. 8: 608.
https://doi.org/10.3390/en9080608
APA Style
Ventola, L., Curcuruto, G., Fasano, M., Fotia, S., Pugliese, V., Chiavazzo, E., & Asinari, P.
(2016). Unshrouded Plate Fin Heat Sinks for Electronics Cooling: Validation of a Comprehensive Thermal Model and Cost Optimization in Semi-Active Configuration. Energies, 9(8), 608.
https://doi.org/10.3390/en9080608