Next Article in Journal
A Review of Classification Problems and Algorithms in Renewable Energy Applications
Previous Article in Journal
Experimental and Numerical Analyses on the Rotary Vane Expander Operating Conditions in a Micro Organic Rankine Cycle System
Open AccessArticle

Unshrouded Plate Fin Heat Sinks for Electronics Cooling: Validation of a Comprehensive Thermal Model and Cost Optimization in Semi-Active Configuration

1
Energy Department, Politecnico di Torino, Corso Duca degli Abruzzi 24, 10129 Torino (TO), Italy
2
DENSO Thermal Systems, 10046 Poirino (TO), Italy
*
Author to whom correspondence should be addressed.
Academic Editor: Kamel Hooman
Energies 2016, 9(8), 608; https://doi.org/10.3390/en9080608
Received: 8 March 2016 / Revised: 30 June 2016 / Accepted: 27 July 2016 / Published: 2 August 2016
Plate Fin Heat Sinks (PFHS) are among the simplest and most widespread devices for electronics cooling. Because of the many design parameters to be considered, developing both cost and thermal effective PFHS is a critical issue. Here, a novel thermal model of PFHS is presented. The model has a broad field of applicability, being comprehensive of the effects of flow bypass, developing boundary layers, fin efficiency and spreading resistance. Experiments are then carried out to validate the proposed thermal model, and its good accuracy is demonstrated. Finally, an optimization methodology based on genetic algorithms is proposed for a cost-effective selection of the design parameters of PFHS, which is particularly effective with semi-active configurations. Such an optimization methodology is then tested on a commercial heat sink, resulting in a possible 53% volume reduction at fixed thermal performances. View Full-Text
Keywords: heat transfer enhancement; electronics cooling; plate fin heat sinks; cost optimization; genetic algorithms heat transfer enhancement; electronics cooling; plate fin heat sinks; cost optimization; genetic algorithms
Show Figures

Graphical abstract

MDPI and ACS Style

Ventola, L.; Curcuruto, G.; Fasano, M.; Fotia, S.; Pugliese, V.; Chiavazzo, E.; Asinari, P. Unshrouded Plate Fin Heat Sinks for Electronics Cooling: Validation of a Comprehensive Thermal Model and Cost Optimization in Semi-Active Configuration. Energies 2016, 9, 608.

Show more citation formats Show less citations formats
Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Article Access Map by Country/Region

1
Search more from Scilit
 
Search
Back to TopTop