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Sensors 2018, 18(8), 2712; https://doi.org/10.3390/s18082712

Adhesive-Free Bonding of Monolithic Sapphire for Pressure Sensing in Extreme Environments

Department of Electronics and Electrical Engineering, Dankook University, Yongin-si 16890, Korea
Received: 24 July 2018 / Revised: 13 August 2018 / Accepted: 13 August 2018 / Published: 17 August 2018
(This article belongs to the Special Issue Sensors and Materials for Harsh Environments)
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Abstract

This paper presents a monolithic sapphire pressure sensor that is constructed from two commercially available sapphire wafers through a combination of reactive-ion etching and wafer bonding. A Fabry–Perot (FP) cavity is sealed fully between the adhesive-free bonded sapphire wafers and thus acts as a pressure transducer. A combination of standard silica fiber, bonded sapphire wafers and free-space optics is proposed to couple the optical signal to the FP cavity of the sensor. The pressure in the FP cavity is measured by applying both white-light interferometry and diaphragm deflection theory over a range of 0.03 to 3.45 MPa at room temperature. With an all-sapphire configuration, the adhesive-free bonded sapphire sensor is expected to be suitable for in-situ pressure measurements in extreme harsh environments. View Full-Text
Keywords: adhesive-free sapphire bonding; pressure sensor; Fabry–Perot cavity; diaphragm deflection; white-light interferometry adhesive-free sapphire bonding; pressure sensor; Fabry–Perot cavity; diaphragm deflection; white-light interferometry
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. (CC BY 4.0).
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Yi, J. Adhesive-Free Bonding of Monolithic Sapphire for Pressure Sensing in Extreme Environments. Sensors 2018, 18, 2712.

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