Heat Transfer in Advanced Semiconductor Interconnects and Packaging
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D：Materials and Processing".
Deadline for manuscript submissions: closed (30 December 2023) | Viewed by 424
Special Issue Editor
Special Issue Information
Dear Colleagues,
Advanced semiconductor packaging plays a vital role in enhancing system performance and functionality, particularly in response to the escalating demand for computational requirements. Three-dimensional (3D) integration, characterized by densely packed interconnections with small pitches, multi-chip stacking, and advanced packaging methodologies, holds significant potential for the future. However, the aggressive reduction in interconnect pitches and utilization of the nanoscale via interconnections present substantial challenges in process development and reliability. The adoption of high-density 3D integration systems has resulted in a substantial increase in heat flux and power density.
Furthermore, 3D integration or advanced packaging result in elevated temperatures compared to single-die configurations due to the vertical integration of multiple layers, the use of low-thermal-conductivity thermal interface materials, and the thinning of stacked dies. As a result, effective heat dissipation from 3D stacks becomes even more challenging. Additionally, there exists strong thermal coupling between components within the 3D chip stacking system. To tackle these challenges, the development of thermal management solutions that offer high performance and energy efficiency is imperative.
This Special Issue aims to delve into the heat transfer aspects of semiconductor interconnects and advanced packaging. It will explore topics such as efficient thermal management materials and innovative thermal cooling solutions that leverage the principles of thermal fluid engineering and advanced packaging techniques.
Dr. Tiwei Wei
Guest Editor
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Keywords
- heterogenous integration
- thermal management
- electronic cooling
- heat transfer
- semiconductor interconnects
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