Search Results (32)

Cu is widely employed in power device packaging materials owing to its excellent electrical and thermal conductivity, coupled with economic viability. Sintered Cu currently stands as one of the representative interconnect materials in power device packaging. However, it is prone to oxidation during bonding, requires extended bonding times, and needs considerable pressure. Transient liquid phase bonding (TLPB) technology is regarded as a viable solution for power device packaging, enabling high-melting-point, high-strength, and thermally stable connections at low temperatures. Cu and Sn are widely employed metallic materials in common TLP systems. The Sn-coated Cu particle increases the effective reaction area between Cu and Sn, accelerating the formation of intermetallic compounds (IMCs) and reducing bonding time. Sn-coated Cu particles were produced in this study by chemically plating Sn onto micron-sized Cu powder surfaces. The effects of flux content, bonding time, and applied pressure on joint shear strength were investigated. Results indicate that as flux content increases, the shear strength of the solder joints initially increases and then decreases. The shear strength of the solder joint gradually decreased with increasing bonding time, but no significant change was observed when the time exceeded 20 min. Increasing the applied pressure significantly enhanced the shear strength of the solder joint. The shear strength of the solder joint at 10 MPa is 90.2% higher than at 5 MPa. Full article

The bonding behavior of the Ni-based superalloy CM247LC during transient liquid phase (TLP) bonding is strongly governed by filler metal chemistry, particularly boron activity. In this study, the time-dependent bonding mechanisms of CM247LC joints fabricated using a high-boron MBF-80 filler and a low-boron MBF-20 filler are systematically compared to clarifying the transition between reaction-dominated brazing and diffusion-assisted TLP bonding. Microstructural analyses reveal that MBF-80 promotes the formation of a persistent, reaction-stabilized interlayer characterized by strong boron localization and the development of boron-rich intermetallic reaction products. These features kinetically suppress diffusion-assisted homogenization and prevent isothermal solidification, resulting in pronounced chemical and mechanical discontinuities across the joint. In contrast, MBF-20 enables progressive boron depletion, suppression of stable intermetallic accumulation, and interfacial smoothing, leading to diffusion-assisted chemical redistribution and partial isothermal solidification. This evolution is accompanied by gradual convergence of hardness profiles toward that of the CM247LC base metal, indicating improved mechanical continuity. These results demonstrate that joint hardness alone is insufficient for evaluating bonding quality in CM247LC. Instead, controlled microstructural evolution governed by low-boron filler chemistry is essential for achieving chemically and mechanically compatible joints. The present work establishes a clear mechanistic link between filler metal composition and bonding behavior, providing guidance for the design of reliable TLP bonding strategies in Ni-based superalloys. Full article

Diffusion bonding with an interlayer is considered an effective means of obtaining Mg/Al dissimilar alloy joints. However, at low temperatures, it is often impossible to simultaneously achieve joints between the interlayer and Mg/Al under the same bonding parameters. For this reason, the interlayer is usually prefabricated on the substrate, followed by conducting diffusion bonding. Due to the higher diffusion rate of atoms in the liquid phase compared to atoms in the solid phase, creating a liquid phase field in diffusion bonding to reduce diffusion resistance and thus omitting the step of prefabricating the interlayer is a feasible approach. In this study, solid-state diffusion bonding and TLP (transient liquid phase) diffusion bonding were combined. The low-temperature diffusion bonding of the Mg/Al alloy was achieved under the same parameters using a Zn/Sn composite interlayer, utilizing the formation of a Zn-Sn eutectic liquid phase and the complete melting of Sn during heating without requiring a prefabricated interlayer. Unlike conventional composite interlayers used in diffusion bonding, the Sn layer of the Zn/Sn composite interlayer completely melts into liquid and is squeezed out of the bonding interface at the bonding temperature. The Mg/Zn interface was bonded by solid-state diffusion bonding, while the Al/Zn interface was joined through TLP diffusion bonding. Research on the bonding temperature showed that the bonding temperature range was narrow and that variation in the bonding temperature had a significant impact on the microstructure of the joints. Full article

This paper introduces a cost-effective, high-performance approach to achieving wafer level vacuum packaging (WLVP) for MEMS-based uncooled infrared sensors. Reliable and hermetic packages for MEMS devices are achieved using a cap wafer that is formed using two silicon wafers, where one wafer has precise grating/moth-eye structures on both sides of a double-sided polished wafer for improved transmission of over 80% in the long-wave infrared (LWIR) wavelength region without the need for an AR coating, while the other wafer is used to form a cavity. The two wafers are bonded using Au-In transient liquid phase (TLP) bonding at low temperature to form the cap wafer, which is then bondelectrical and Electronics d to the sensor wafer using glass frit bonding at high temperature to activate the getter inside the cavity region. The bond quality is assessed using three methods, including He-leak tests, cap deflection, and Pirani vacuum gauges. Hermeticity is confirmed through He-leak tests according to MIL-STD 883, yielding values as low as 0.1 × 10⁻⁹ atm·cc/s. The average shear strength is measured as 23.38 MPa. The package pressure varies from 133–533 Pa without the getter usage to as low as 0.13 Pa with the getter usage. Full article

In this study, a novel composite solder, Sn-3.5Ag-10.0Co, was tailored for transient liquid phase (TLP) bonding in electric vehicle power module integration. Employing a meticulous two-step joining process, the solder joint was transformed into a robust microstructure characterized by two high-melting point intermetallic compounds, Ni₃Sn₄ and (Co,Ni)Sn₂. After 1 h of TLP bonding, the Sn-3.5Ag-10.0Co paste transformed into the IMCs, but voids persisted between them, particularly between (Co,Ni)Sn₂ and Ni₃Sn₄. Voids significantly reduced after 2 h of bonding, with full coalescence of the joint microstructure observed. The joint continued to be densified after 3 h of TLP bonding, but voids tended to accumulate at the joint center. Failure analysis revealed crack propagation through Ni₃Sn₄/(Co,Ni)Sn₂ interfaces and internal voids. The engineered Sn-Ag-Co TLP joint exhibited superior shear strength retention even at an elevated temperature of 200 °C, contrasting with the significant reduction observed in the Sn-3.5Ag control specimen due to remaining Sn. Full article

Three-dimensional (3D) packaging using through-Si-via (TSV) is a key technique for achieving high-density integration, high-speed connectivity, and for downsizing of electronic devices. This paper describes recent developments in TSV fabrication and bonding methods in advanced 3D electronic packaging. In particular, the authors have overviewed the recent progress in the fabrication of TSV, various etching and functional layers, and conductive filling of TSVs, as well as bonding materials such as low-temperature nano-modified solders, transient liquid phase (TLP) bonding, Cu pillars, composite hybrids, and bump-free bonding, as well as the role of emerging high entropy alloy (HEA) solders in 3D microelectronic packaging. This paper serves as a guideline enumerating the current developments in 3D packaging that allow Si semiconductors to deliver improved performance and power efficiency. Full article

The thermomechanical properties of materials within die-attach joints play an essential role in assessing the reliability of high-power modules. Ag-In transient liquid phase (TLP) bonding serves as an alternative method for die attachment. However, relevant material data for the ζ (Ag₃In) phase, one of the Ag-In intermetallic compound (IMC) products of TLP bonding, are limited. This paper proposes an approach to fabricate a densified and pure bulk sample of the ζ (Ag₃In) phase. The thermomechanical properties of the ζ (Ag₃In) phase were subsequently investigated at elevated temperatures and compared to those of other IMCs frequently observed in die-attach joints. As the temperature increased from 30 °C to 200 °C, the hardness of the ζ (Ag₃In) phase decreased linearly from 1.78 GPa to 1.46 GPa. Similarly, the Young’s modulus also decreased linearly from 82.3 GPa to 66.5 GPa. These properties rank among the lowest levels compared to those of other IMCs. The average coefficient of thermal expansion within the temperature range of 70 °C to 250 °C was approximately 18.63 ± 0.61 μm/m/°C, placing the ζ (Ag₃In) phase at a moderate level. When considering its potential for mitigating thermal stress, these combined properties render the ζ (Ag₃In) phase an appropriate material choice for die-attach joints compared to other IMCs. Full article

Although magnesium alloys show potential as structural and functional materials, they are difficult to join using traditional welding methods because of their low melting points and active chemical properties. Their poor weldability impedes their universal application. Ultrasound-assisted transient liquid-phase bonding (U-TLP) is a novel method used for magnesium alloy bonding, but in almost all related studies, a heating device has been required, and the types of solders are limited. In this study, gallium was used as solder to bond AZ31 magnesium alloy with ultrasonic assistance at room temperature (without a heating device) due to the low melting temperature of gallium and its compatibility with other metals when forming intermetallic compounds (IMCs). The variations in the products, microstructure, fracture characteristics, and shear strength of the joints were investigated. A reliable joint composed of IMCs (Mg₂Ga₅, H-MgGa₂, and Mg₂Ga) and a eutectic structure was obtained after an ultrasonic duration of 3 s. Significantly, the plasticity of the joint was improved due to ultrasonic effects, which included the accelerated element diffusion process, the refinement of grains to nanometer particles, and the homogenization of organization. Thus, the highest shear strength of 14.65 MPa at 4 s was obtained, with obvious cleavage fracture characteristics in the region of the IMCs. Full article

5A06 aluminum alloy bar was brazed by temperature gradient transient liquid phase diffusion welding (TG-TLP). The effects of brazing temperature on the microstructure and the tensile strength of the brazing joints were investigated. Three typical brazing filler alloys (1^# Al-20Cu-6Si-2Ni, 2^# Al-10Cu-10Si-3Mg-1Ga, and 3^# Al-6Cu-10Si-2Mg-10Zn) were prepared by smelting, and TG-TLP diffusion bonding was carried out at different brazing temperatures (550 °C~590 °C). The results show that with the increase in brazing temperature, the oxide films at the brazing junction are easier to be broken and dispersed, but the oxidation extent will also increase. The oxidation products enriched were mainly Al₂O₃ and SiO₂ at the brazing junction. There are different optimal brazing temperatures corresponding to the different filler alloys. For 1^#, the optimal temperature is 570 °C; for 2^# is 580 °C; for 3^# is 580 °C. For 1^# brazing joints, the maximum tensile strength was 113 MPa, and for 2^# was 122.4 MPa. Under the experimental conditions of this study, the maximum tensile strength of the TG-TLP joint is 147.4 MPa of 3^# brazing sample (at 580 °C), which has increased by 30% and 20% compared to 1^# and 2^# respectively. The nickel-rich phase at the interface (of 1^# brazing filler) could form a brittle fracture, which was unfavorable for interface bonding. For TG-TLP brazing of 5A06, the filler alloy with high Al:Cu ratio (12:1 wt.%) needs a sufficient temperature gradient to exert the film-breaking effect, while the filler alloy with low Al:Cu ratio (3.6:1 wt.%) needs to accurately control its brazing temperature to avoid excessive oxidation. There are many research gaps in the influence of brazing material composition and brazing temperature on the microstructure and mechanical properties of 5A06 aluminum alloy TG-TLP joints. The research results can provide a theoretical basis for formulating the TG-TLP brazing specification of 5A06 aluminum alloy. Full article

As a technology for micro-deformed solid-phase connection, transient liquid phase (TLP) diffusion bonding plays a key role in the manufacture of heating components of aero engines. However, the harmful brittle phase and high hardness limit the application of TLP diffusion bonding in nickel-based superalloys. In this paper, a new strategy in which a low-boron and high-titanium interlayer can restrain the brittle phase and reduce the hardness of the TLP-diffusion-bonded joint is proposed. With this strategy, the Ni₃Al joint can achieve a high strength of 860.84 ± 26.9 MPa under conditions of 1250 °C, 6 h and 5 MPa. The microhardness results show that the average microhardness of the joint area is 420.33 ± 3.15 HV and is only 4.3% higher than that of the Ni₃Al base material, which proves that this strategy can effectively inhibit the formation of the harmful brittle phase in the joint area. The results of EBSD show that 7.7% of the twin boundaries exist in the isothermal solidification zone, and only small amounts of secondary precipitates are observed at the grain boundaries in the joint, which indicates that twin boundaries may play a dominant role in crack initiation. This study provides a feasible avenue to suppress the brittle phase in TLP-diffusion-bonded joints. Full article

The dissimilar joining of martensitic and ferritic stainless steels have been developed that needs corrosion resistance and enhanced mechanical properties. In this study, the transient liquid-phase bonding of martensitic stainless steel 410 and super-ferritic stainless steel 446 was conducted with a nickel-based amorphous interlayer (BNi-2) at constant temperature (1050 °C) and increasing times of 1, 15, 30, 45, and 60 min. For characterization of the TLP-bonded samples, optical microscopy and scanning emission microscopy equipped with energy-dispersive X-ray spectroscopy were used. To investigate the mechanical properties of TLP-bonded samples, the shear strength test method was used. Finally, the X-ray diffraction method was used for microstructural investigation and phase identification. The microstructural study showed that the microstructure of base metals changed: the martensitic structure transited to tempered martensite, including ferrite + cementite colonies, and the delta phase in super-ferritic stainless steel dissolved in the matrix. During the transient liquid-phase bonding, the aggregation of boron due to its diffusion to base metals resulted in the precipitation of a secondary phase, including iron–chromium-rich borides with blocky and needle-like morphologies at the interface of the molten interlayer and base metals. On the other hand, the segregation of boron in the bonding zone resulted from a low solubility limit, and the distribution coefficient has induced some destructive and brittle phases, such as nickel-rich (Ni₃B) and chromium-rich boride (CrB/Cr₂B). By increasing the time, significant amounts of boron have been diffused to a base metal, and diffusion-induced isothermal solidification has happened, such that the isothermal solidification of the assembly has been completed under the 1050 °C/60 min condition. The distribution of the hardness profile is relatively uniform at the bonding zone after completing isothermal solidification, except the diffusion-affected zone, which has a higher hardness. The shear strength test showed that increasing the holding time was effective in achieving the strength near the base metals such that the maximum shear strength of about 472 MPa was achieved. Full article

Alumina ceramics were joined by a transient liquid phase (TLP) bonding method at relatively lower temperatures, using mixed powders of Bi₂O₃ and ZnO with different weight ratios as interlayers between the ceramic components. Bonding was achieved at 750 °C for several of the prepared interlayer mixtures, which makes the applied approach attractive due to the relatively lower joining temperature and potentially low fabrication costs. Measurements by SEM and EDX were used to study the microstructure and chemical analysis of the obtained joints. It also allowed us to investigate the diffusion mechanism occurring in the systems, which resulted in the hypothesis that Zn²⁺/ZnO diffuses through the ceramics. XRD and Raman spectra were acquired to examine the reaction products that formed during the thermal treatment. The results showed that both ZnO and Bi₂O₃ react with each other as well as with alumina to form spinel and other products. Full article

In this study, transient liquid-phase (TLP) bonding was adopted to obtain a reliable reduced-activation ferritic/martensitic (RAFM) steel joint with Fe-Si-B amorphous foil. The aging tests and creep tests of the TLP joints were carried out at 550 °C to study the microstructural evolution in the service process. The effect of stress loading on the microstructural evolution of the TLP joint was investigated. The results show that creep fractures in the TLP joints occur in the base material. The main factors affecting the creep performance of TLP joints are the recovery of substructures and the coarsening and deformation of martensitic laths. In addition, the M₂₃C₆ carbides in the base material were coarser than in the weld zone. Compared with aging samples and creep samples undergoing the same test temperature, the dislocation density in the isothermal solidification zone (ISZ) increased significantly with increases in the stress level. Furthermore, it is worth noting that the microstructure of the weld zone changed from large-sized ferrite to a mixed, fine microstructure of ferrite and martensite, which increases the heat resistance of the TLP joints, and thus results in creep fractures in the base metal. Full article

The use of a Zn/Ag–Cu–Zn/Zn multi-interlayer was observed to avoid the formation of Mg–Al binary intermetallic compounds (IMCs), which cause embrittlement and low strength of bonding when dissimilar metals such as Mg/Al are joined using ultrasound-assisted transient liquid phase bonding (U-TLP). The change in the microstructure and mechanical properties of the AZ31B/LY12 joints at 410, 440, and 460 °C with prolonging ultrasonic treatment (UST) time was investigated. The results showed that the diffusion of Ag and Cu was faster into the brazing seam on the LY12 side than that on the AZ31B side with increasing UST and temperature. The IMCs on both sides of the joints were transformed with the diffusion of Ag and Cu. The transformation made the fracture path shift from the AZ31B side (410, 440 °C) to the LY12 side (460 °C), and the maximum shear strength of the joints from 43.3 (410 °C) to 65.7 (440 °C) to 84.7 MPa (460 °C). The IMCs on the surface of the fracture path corresponding to the joints with optimal mechanical properties changed from Mg₇Zn₃+MgZn₂+α-Mg (410 °C) to MgZnCu+Mg₇Zn₃ (440 °C) to Al₂Cu (460 °C). Full article

The development of 5G mobile communication created the need for high-frequency communication systems, which require vast quantities of radio frequency (RF) filters with a high-quality factor (Q) and low inband losses. In this study, the packaging of an RF filter with a through-glass via (TGV) interposer was designed and fabricated using a three-dimensional wafer-level package (3D WLP). TGV fabrication is a high-yielding process, which can produce high precision vias without masking and lithography and reduce the manufacturing cost compared with the through silicon via (TSV) solution. The glass interposer capping wafer contains Cu-filled TGV, a metal redistribution layer (RDL), and the bonding layer. The RF filter substrate with Au bump is bonded to the capping wafer based on Au-Sn transient liquid phase (TLP) bonding at 280 °C with a 40 kN (approximately 6.5 MPa) bonding force. Experimental results show that shear strengths of approx. 54.5 MPa can be obtained, higher than the standard requirement (~6 MPa). In addition, a comparison of the electrical performance of the RF filter package after the pre-conditional level three (Pre-Con L3) and unbiased highly accelerated stress (uHAST) tests showed no difference in insertion attenuation across the passband (<0.2 dB, standard value: <1 dB). The final packages passed the reliability tests in the field of consumer electronics. The proposed RF filter WLP achieves high performance, low cost, and superior reliability. Full article