Search Results (338)

Optical materials are widely used in large optical systems such as lithography machines and astronomical telescopes. However, optical materials inevitably produce subsurface damage (SSD) during lapping and polishing processes, degrading the laser damage threshold and impacting the service life of the optical system. The large surface roughness of the lapped optical materials further increases the difficulty of the nondestructive detection of SSD. Quantum dots (QDs) show great development potential in the nondestructive detection of SSD in lapped materials. However, existing QD-based SSD detection methods ignore the polarization sensitivity of QDs to excitation light, which affects the detection accuracy of SSD. To address this problem, this paper explores the fluorescence polarization properties of QDs in the SSD of optical materials. First, the detection principle of SSD based on the fluorescence polarization of QDs is investigated. Subsequently, a fluorescence polarization detection system is developed to analyze the fluorescence polarization properties of QDs in SSD. Finally, the SSD is detected based on the studied polarization properties. The results show that the proposed method effectively improves the detection rate of SSD by 10.8% and thus provides guidance for evaluating the quality of optical material and optimizing optical material processing technologies. The research paradigm is equally applicable to biomedicine, energy, optoelectronics, and the environment, where QDs have a wide range of applications. Full article

This review examines the design of thermal control systems for state-of-the-art deep ultraviolet (DUV) and extreme ultraviolet (EUV) projection lithography tools. The lithographic system under investigation integrates several critical subsystems along the optical transmission chain, including the light source, reticle stage, projection optics (featuring DUV refractive lenses and EUV multilayer mirrors), immersion liquid, wafer stage, and metrology systems. Under high-power irradiation conditions with concurrent thermal perturbations, the degradation of thermal stability and gradient uniformity within these subsystems significantly compromises exposure precision. Through a systematic analysis of the thermal challenges specific to each subsystem, this review synthesizes established thermal control systems across two technical dimensions: thermal control structures and thermal control algorithms. Prospects for future advancements in lithographic thermal control are also discussed. Full article

Nanoimprint lithography (NIL) has emerged as a promising sub-10 nm patterning at low cost; yet, robust process control remains difficult because of time-consuming physics-based simulators and labeled SEM data scarcity. We propose a data-efficient, two-stage deep-learning framework here that directly reconstructs post-imprint SEM images from binary design layouts and delivers calibrated pixel-by-pixel uncertainty simultaneously. First, a shallow U-Net is trained on conformalized quantile regression (CQR) to output 90% prediction intervals with statistically guaranteed coverage. Moreover, per-level errors on a small calibration dataset are designed to drive an outlier-weighted and encoder-frozen transfer fine-tuning phase that refines only the decoder, with its capacity explicitly focused on regions of spatial uncertainty. On independent test layouts, our proposed fine-tuned model significantly reduces the mean absolute error (MAE) from 0.0365 to 0.0255 and raises the coverage from 0.904 to 0.926, while cutting the labeled data and GPU time by 80% and 72%, respectively. The resultant uncertainty maps highlight spatial regions associated with error hotspots and support defect-aware optical proximity correction (OPC) with fewer guard-band iterations. Extending the current perspective beyond OPC, the innovatively model-agnostic and modular design of the pipeline here allows flexible integration into other critical stages of the semiconductor manufacturing workflow, such as imprinting, etching, and inspection. In these stages, such predictions are critical for achieving higher precision, efficiency, and overall process robustness in semiconductor manufacturing, which is the ultimate motivation of this study. Full article

Polymer-based photonic sensors are emerging as cost-effective, scalable alternatives to conventional silicon and glass photonic platforms, offering unique advantages in flexibility, functionality, and manufacturability. This review provides a comprehensive assessment of recent advances in polymer photonic sensing technologies, focusing on material systems, fabrication techniques, device architectures, and application domains. Key polymer materials, including PMMA, SU-8, polyimides, COC, and PDMS, are evaluated for their optical properties, processability, and suitability for integration into sensing platforms. High-throughput fabrication methods such as nanoimprint lithography, soft lithography, roll-to-roll processing, and additive manufacturing are examined for their role in enabling large-area, low-cost device production. Various photonic structures, including planar waveguides, Bragg gratings, photonic crystal slabs, microresonators, and interferometric configurations, are discussed concerning their sensing mechanisms and performance metrics. Practical applications are highlighted in environmental monitoring, biomedical diagnostics, and structural health monitoring. Challenges such as environmental stability, integration with electronic systems, and reproducibility in mass production are critically analyzed. This review also explores future opportunities in hybrid material systems, printable photonics, and wearable sensor arrays. Collectively, these developments position polymer photonic sensors as promising platforms for widespread deployment in smart, connected sensing environments. Full article

This study examined the effect of build orientation on the surface finish of micro-optofludic (MoF) devices fabricated via a polydimethylsiloxane (PDMS)-based 3D-printing primary–secondary fabrication protocol, where an inkjet 3D-printing technique was implemented. The molds (i.e., primaries) for fabricating the MoF devices were 3D-printed in two orientations: along $XY$ (Dev-1) and across $YX$ (Dev-2) the printhead direction. Next, the surface finish was characterized using a profilometer to acquire the primary profile of the surface along the microchannel’s edge. The results indicated that the build orientation had a strong influence on the latter, since Dev-1 displayed a tall and narrow Gaussian distribution for a channel width of 398.43 ± 0.29 µm; Dev-2 presented a slightly lower value of 393.74 ± 1.67 µm, characterized by a flat and broader distribution, highlighting greater variability due to more disruptive, orthogonally oriented, and striated patterns. These results were also confirmed by hydrodynamically testing the two MoF devices with an air–water slug flow process. A large experimental study was conducted by analyzing the mean period trend in the slug flow with respect to the imposed flow rate and build orientation. Dev-1 showed greater sensitivity to flow rate changes, attributed to its smoother, more consistent microchannel geometry. The slightly narrower average channel width in Dev-2 contributed to increased flow velocity at the expense of having worse discrimination capability at different flow rates. This study is relevant for optimizing 3D-printing strategies for the fabrication of high-performance microfluidic devices, where precise flow control is essential for applications in biomedical engineering, chemical processing, and lab-on-a-chip systems. These findings highlight the effect of microchannel morphology in tuning a system’s sensitivity to flow rate modulation. Full article

Three-dimensional (3D) photolithography has found wide applications in microelectronics, optoelectronics, biomedicine, etc. Traditionally, it requires repetitive exposure and developing cycles. Meanwhile, a laser direct writing (LDW) system with a digital micromirror device (DMD) enables high-speed maskless lithography with programmable doses. In this paper, we propose a quasi-3D digitized photolithography via LDW with a DMD to remove multiple developing cycles from the process. This approach quantizes the dose of the 3D geometry and stores it in a grayscale image. And the entire dose distribution can be formed by overlapping the exposures with sliced binary dose maps from the above grayscale dose map. In the image slicing algorithm, a modified Golomb coding is introduced to make full use of the highest available exposure intensity. Both 1D multi-step patterns and diffractive optical devices (DOEs) have been fabricated to verify its feasibility. This type of digitized quasi-3D photolithography can be applied to fabricating DOEs, microlens arrays (MLAs), micro-refractive optical elements (μROEs), etc., and 3D molds for micro-embossing/nano-imprinting. Full article

Calcium fluoride (CaF₂) crystals are widely utilized in deep-ultraviolet (DUV) lithography due to their excellent optical properties. The laser-induced degradation and damage of CaF₂ crystals is a critical concern that restricts its extended application. Impurities of CaF₂ crystal are considered a key factor affecting its laser resistance. Establishing the quantitative relationship and mechanism of impurity content impacting the degradation and damage characteristics of CaF₂ crystal is essential. This study investigated the characteristics of different impurity contents affecting the degradation and laser-induced damage thresholds (LIDTs) of CaF₂ crystals under X-ray and 193 nm pulsed laser irradiations, and quantitatively analyzed the degradation process and mechanism. Our findings demonstrate that impurities at ppm levels significantly diminish the transmittance of CaF₂ crystals across various wavelengths following X-ray irradiation. In contrast, these impurities have a negligible effect on the LIDT test results, suggesting distinct damage mechanisms between X-ray and laser irradiation. This study provides valuable insights for optimizing the CaF₂ crystal fabrication process and enhancing irradiation resistance. Full article

To address the demand for laser beam-shaping techniques, we developed a one-step exposure process based on moving-mask lithography for the fabrication of a continuous-surface diffractive optical element (DOE) for laser beam shaping. The fabrication process is described in detail, and the influence of key parameters, such as pre-baking conditions, exposure gaps, development conditions, and post-baking conditions, of the lithography process on the microstructure profile of the DOE is analyzed. The reliability of the preparation method was verified through optical performance experiments. The speckle contrast, uniformity, and diffraction efficiency of the prepared linear beam-shaping element are 4.2%, 97.3%, and 87%. Full article

In this study, we detailed the fabrication and characterization of photovoltaic structures based on PTB7:ICBA (1:1, wt.%) bulk-heterojunction on optical glass substrates by spin-coating. Some samples were deposited on a flat substrate, and others were placed on a patterned substrate obtained by nano-imprinting lithography; the induced effects were analyzed. We demonstrated that using a patterned substrate enhanced the maximum output power, primarily because the short-circuit current density increased. This can be considered a direct consequence of reduced optical reflection and improved optical absorption. The topological parameters evaluated by atomic force microscopy, namely, the root mean square, Skewness, and Kurtosis, had small values of around 2 nm and 1 nm, respectively. This proves that the mixture of a conductive polymer and a fullerene derivative creates a thin film network with a high flatness degree. The samples discussed in this paper were fabricated and characterized in air; we can admit that the results are encouraging, but further optimization is needed. Full article

In this work, we present a graphene-based photodetector operating at a wavelength of 1310 nm. The device leverages the SPARK effect, which has previously been investigated only at 1550 nm. It features a hybrid waveguide structure comprising hydrogenated amorphous silicon, graphene, and crystalline silicon. Upon optical illumination, defect states release charge carriers into the graphene layer, modulating the thermionic current across the graphene/crystalline silicon Schottky junction. The photodetector demonstrates a peak responsivity of 0.3 A/W at 1310 nm, corresponding to a noise-equivalent power of 0.4 pW/Hz^1/2. The experimental results provide deeper insights into the SPARK effect by enabling the determination of the efficiency × lifetime product of carriers at 1310 nm and its comparison with values previously reported at 1550 nm. The wavelength dependence of this product is analyzed and discussed. Additionally, the response times of the device are measured and evaluated. The silicon-based fabrication approach employed is versatile and does not rely on sub-micron lithography techniques. Notably, reducing the incident optical power enhances the responsivity, making this photodetector highly suitable for power monitoring applications in integrated photonic circuits. Full article

Lithography is crucial to semiconductor manufacturing, enabling the production of smaller, more powerful electronic devices. This review explores the evolution, principles, and advancements of key lithography techniques, including extreme ultraviolet (EUV) lithography, electron beam lithography (EBL), X-ray lithography (XRL), ion beam lithography (IBL), and nanoimprint lithography (NIL). Each method is analyzed based on its working principles, resolution, resist materials, and applications. EUV lithography, with sub-10 nm resolution, is vital for extending Moore’s Law, leveraging high-NA optics and chemically amplified resists. EBL and IBL enable high-precision maskless patterning for prototyping but suffer from low throughput. XRL, using synchrotron radiation, achieves deep, high-resolution features, while NIL provides a cost-effective, high-throughput method for replicating nanostructures. Alignment marks play a key role in precise layer-to-layer registration, with innovations enhancing accuracy in advanced systems. The mask fabrication process is also examined, highlighting materials like molybdenum silicide for EUV and defect mitigation strategies such as automated inspection and repair. Despite challenges in resolution, defect control, and material innovation, lithography remains indispensable in semiconductor scaling, supporting applications in integrated circuits, photonics, and MEMS/NEMS devices. Various molecular strategies, mechanisms, and molecular dynamic simulations to overcome the fundamental lithographic limits are also highlighted in detail. This review offers insights into lithography’s present and future, aiding researchers in nanoscale manufacturing advancements. Full article

Large-size diffraction gratings have played an important role in modern scientific fields such as inertial confinement fusion, large-aperture astronomical telescopes, and high-precision immersion lithography machines with long-stroke displacement stages. However, due to the large size and high accuracy requirements of gratings, and considering the need for high efficiency and low cost, the fabrication of large gratings is extremely difficult. This paper reviews the fabrication technologies for large diffraction gratings, including grating tiling technology, grating ruling technology, single-exposure lithography, optical mosaic grating technology, and scanning beam interference lithography. It introduces the basic principles, representative research, and research progress of these technologies, analyzes their advantages and current problems, and provides reference for the development and optimization of the fabrication technologies of large diffraction gratings. Full article

This paper introduces a method for improving the measurement performance of single wavelength overlay errors by incorporating higher diffraction orders. In this method, to enhance the accuracy and robustness of overlay error detection between layers, the measurement errors introduced by empirical formulas are corrected by incorporating higher diffraction orders, based on the differences in the light intensity difference curves for different diffraction orders. This method also expands the range of available wavelengths for selection. The introduction of specially designed overlay error measurement markers enhances the diffraction efficiency of higher diffraction orders to overcome the issue of their weak light intensity, making them difficult to utilize effectively. This paper first conducts a theoretical analysis using scalar diffraction theory, and then demonstrates the feasibility of the design through vector diffraction simulations and optical path simulations. The resulting two-layer marker structure is simple and compatible with existing measurement systems, showing tremendous potential for application at advanced process nodes. Full article

We propose a simple and innovative configuration consisting of a quantum dot and micro-optical resonator that emits single photons with good directionality in a plane parallel to the substrate. In this device, a single quantum dot is placed as a light source between the slits of a triangular split-ring micro-optical resonator (SRR) supported in an optical polymer film with an air-bridge structure. Although most of the previous single photon emitters in solid-state devices emitted photons upward from the substrate, operation simulations confirmed that this configuration realizes lateral light emission in narrow regions above, below, left, and right in the optical polymer film, despite the absence of a light confinement structure such as an optical waveguide. This device can be fabricated using silica-coated colloidal quantum dots, focused ion beam (FIB) lithography, and wet etching using an oxide layer on a silicon substrate as a sacrificial layer. The device has a large tolerance to the variation in the position of the SRR in the optical polymer film and the height of the air-bridge. We confirmed that Pt-SRRs can be formed on the optical polymer film using FIB lithography. This simple lateral photon emitter is suitable for coupling with optical fibers and for fabricating planar optical quantum solid-state circuits, and is useful for the development of quantum information processing technology. Full article

The precise and deterministic integration of fluorescent emitters with photonic nanostructures is an important challenge in nanophotonics and key to the realization of hybrid photonic systems, supporting effects such as emission enhancement, directional emission, and strong coupling. Such integration typically requires the definition or immobilization of the emitters at defined positions with nanoscale precision. While various methods were already developed for creating localized emitters, in this work we present a new method for the deterministic fabrication of fluorescent nanostructures featuring well-defined optical transitions; it works with a minimal amount of steps and is scalable. Specifically, electron-beam lithography is used to directly pattern a mixture of the negative-tone electron-beam resist with the europium complex Eu(TTA)₃, which exhibits both electric and magnetic dipolar transitions. Crucially, the lithography process enables precise control over the shape and position of the resulting fluorescent structures with a feature size of approx. 100 $\mathrm{n}$$\mathrm{m}$. We demonstrate that the Eu(TTA)₃ remains fluorescent after exposure, confirming that the electron beam does not alter the structure the optical transitions. This work supports the experimental study of local density of optical states in nanophotonics. It also expands the knowledge base of fluorescent polymer materials, which can have applications in polymer-based photonic devices. Altogether, the presented fabrication method opens the door for the realization of hybrid nanophotonic systems incorporating fluorescent emitters for light-emitting dielectric metasurfaces. Full article