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Search Results (362)

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Keywords = optical lithography

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14 pages, 9894 KB  
Article
Low-Loss, Multi-Reticle-Stitched SiN Waveguides for 300 mm Wafer-Level Optical Interconnects
by Pengfei Xu, Chiara Marchese, Guy Lepage, Negin Golshani, Ruben Van Eenaeme, Andrea Mingardi, Joost Van Ongeval, Rafal Magdziak, Luc Halipre, Darko Trivkovic, Peter Verheyen, Maumita Chakrabarti, Dimitrios Velenis, Andy Miller, Filippo Ferraro, Yoojin Ban and Joris Van Campenhout
Photonics 2026, 13(1), 100; https://doi.org/10.3390/photonics13010100 - 22 Jan 2026
Viewed by 43
Abstract
With the rapid development of artificial intelligence (AI) and machine learning (ML) applications, wafer-level optical I/O is becoming increasingly attractive for massive and efficient data interconnects in future wafer-scale multi-processor-units (multi-XPU) compute clusters with unparalleled data bandwidth, energy efficiency, and low latency. In [...] Read more.
With the rapid development of artificial intelligence (AI) and machine learning (ML) applications, wafer-level optical I/O is becoming increasingly attractive for massive and efficient data interconnects in future wafer-scale multi-processor-units (multi-XPU) compute clusters with unparalleled data bandwidth, energy efficiency, and low latency. In this paper, we present a 300 mm sized wafer reticle-stitched low-pressure chemical vapor deposition (LPCVD) silicon nitride (SiN) waveguide technology and demonstrate a multi-reticle-stitched ~56 cm long waveguides across 20 reticles with propagation loss of 0.13~0.15 dB/cm at 1310 nm wavelength, and <0.001~0.002 dB SiN waveguide stitch loss, which is because of <5 nm high-precision reticle lithography offset. These advantageous features of low-loss reticle-stitched SiN waveguides have the potential to significantly enhance future optically interconnected wafer-scale multi-chip compute systems. Full article
(This article belongs to the Special Issue Recent Progress in Silicon Photonics)
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15 pages, 4006 KB  
Article
Circular Dichroism via Extrinsic Chirality in Achiral Plasmonic Nanohole Arrays
by Francesco Floris, Margherita Angelini, Konstantins Jefimovs, Dimitrios Kazazis and Franco Marabelli
Materials 2026, 19(2), 402; https://doi.org/10.3390/ma19020402 - 19 Jan 2026
Viewed by 271
Abstract
The detection of chiral properties is crucial for pharmacology and biochemistry, yet standard circular dichroism spectroscopy suffers from low sensitivity when probing minute sample volumes. While complex asymmetric chiral nanostructures can enhance these Circular Dichroic (CD) signals, their fabrication is intricate and costly. [...] Read more.
The detection of chiral properties is crucial for pharmacology and biochemistry, yet standard circular dichroism spectroscopy suffers from low sensitivity when probing minute sample volumes. While complex asymmetric chiral nanostructures can enhance these Circular Dichroic (CD) signals, their fabrication is intricate and costly. In this work, we analyzed an alternative based on extrinsic chirality in achiral square arrays of plasmonic circular NHAs realized via Displacement Talbot Lithography (DTL), thus exploring the chiroptical response arising from symmetry breaking induced by oblique illumination. Unlike isolated nanoparticles, nanohole arrays (NHAs) support propagating Surface Plasmon Polaritons (SPPs), allowing for unique light confinement capabilities essential for high-throughput sensing. A careful characterization in terms of Stokes parameters has been performed over a selected range of different optical angles of incidence and sample orientation to disentangle extrinsic chiral contribution from spurious effects related to sample imperfections. By optimizing such extrinsic chiral contributions, enhanced chiroptical response could be engineered by significantly amplifying the interaction between light and chiral biomolecules trapped within the holes. This methodology establishes DTL-fabricated achiral NHAs as an ultrasensitive, cost-effective platform for the detection and discrimination of enantiomers in biosensing applications. Full article
(This article belongs to the Section Optical and Photonic Materials)
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20 pages, 1534 KB  
Article
Low-Cost DLW Setup for Fabrication of Photonics-Integrated Circuits
by André Moreira, Alessandro Fantoni, Miguel Fernandes and Jorge Fidalgo
Micromachines 2026, 17(1), 125; https://doi.org/10.3390/mi17010125 - 19 Jan 2026
Viewed by 244
Abstract
The development of photonic-integrated circuits (PICs) for data communication, sensing, and quantum computing is hindered by the high complexity and cost of traditional fabrication methods, which rely on expensive equipment, limiting accessibility for research and prototyping. This study introduces a Direct Laser Writing [...] Read more.
The development of photonic-integrated circuits (PICs) for data communication, sensing, and quantum computing is hindered by the high complexity and cost of traditional fabrication methods, which rely on expensive equipment, limiting accessibility for research and prototyping. This study introduces a Direct Laser Writing (DLW) system designed as a low-cost alternative, utilizing an XY platform for precise substrate movement and an optical system comprising a collimator and lens to focus the laser beam. Operating on a single layer, the system employs SU-8 photoresist to fabricate polymer-based structures on substrates such as ITO-covered glass. Preparation involves thorough cleaning, spin coating with photoresist, and pre- and post-baking to ensure material stability. This approach reduces dependence on costly infrastructure, making it suitable for academic settings and enabling rapid prototyping. A user interface and custom slicer process standard .dxf files into executable commands, enhancing operational flexibility. Experimental results demonstrate a resolution of 10 µm, with successful patterning of structures, including diffraction grids, waveguides, and multimode interference devices. This system aims to transform PIC prototype fabrication into a cost-effective, accessible process. Full article
(This article belongs to the Special Issue Laser-Assisted Ultra-Precision Machining)
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34 pages, 5134 KB  
Review
Inverse Lithography Technology (ILT) Under Chip Manufacture Context
by Xiaodong Meng, Cai Chen and Jie Ni
Micromachines 2026, 17(1), 117; https://doi.org/10.3390/mi17010117 - 16 Jan 2026
Viewed by 264
Abstract
As semiconductor process nodes shrink to 3 nm and beyond, traditional optical proximity correction (OPC) and resolution enhancement technologies (RETs) can no longer meet the high patterning precision needs of advanced chip manufacturing due to the sub-wavelength lithography limits. Inverse lithography technology (ILT), [...] Read more.
As semiconductor process nodes shrink to 3 nm and beyond, traditional optical proximity correction (OPC) and resolution enhancement technologies (RETs) can no longer meet the high patterning precision needs of advanced chip manufacturing due to the sub-wavelength lithography limits. Inverse lithography technology (ILT), a key part of computational lithography, has become a critical solution for these issues. From an EDA industry perspective, this review provides an original and systematic summary of ILT’s development and applications, which helps integrate the scattered research into a clear framework for both academic and industrial use. Compared with traditional OPC, the latest ILT has three main advantages: (1) better patterning accuracy, as a result of the precise optical models that fix complex optical issues (like diffraction and interference) in advanced lithography systems; (2) a wider process window, as it optimizes mask designs by working backwards from the target wafer patterns, making lithography more stable against process changes; and (3) stronger adaptability to new lithography scenarios, such as High-NA EUV and extended DUV nodes. This review first explains ILT’s working principles (the basic concepts, mathematical formulae, and main methods like level-set and pixelated approaches) and its development history, highlighting key events that boosted its progress. It then analyzes ILT’s current application status in the industry (such as hotspot fixing, full-chip trials, and EUV-era use) and its main bottlenecks: a high computational complexity leading to long runtime, difficulties in mask manufacturing, challenges in model calibration, and a conservative market that slows large-scale adoption. Finally, it discusses promising future directions, including hybrid ILT-OPC-SMO strategies, improving model accuracy, AI/ML-driven design, GPU acceleration, multi-beam mask writer improvements, and open-source data to solve data shortage problems. By combining the latest research and industry practices, this review fills the gap of comprehensive ILT summaries that cover the principles, progress, applications, and prospects. It helps readers fully understand ILT’s technical landscape and offers practical insights for solving the key challenges, thus promoting ILT’s industrial use in advanced chip manufacturing. Full article
(This article belongs to the Special Issue Recent Advances in Lithography)
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15 pages, 5058 KB  
Article
Optimizing the Focusing Performance of Diffractive Optical Elements by Integrated Structure Techniques and Laser Lithography
by Hieu Tran Doan Trung, Young-Sik Ghim and Hyug-Gyo Rhee
Photonics 2026, 13(1), 75; https://doi.org/10.3390/photonics13010075 - 15 Jan 2026
Viewed by 257
Abstract
Diffractive optical elements (DOEs) offer significant advantages over conventional refractive optics, particularly in non-visible spectral regions such as ultraviolet, gamma rays, and X-rays, where material limitations restrict traditional optical components. Owing to their design flexibility, DOEs enable the generation of complex beam profiles—including [...] Read more.
Diffractive optical elements (DOEs) offer significant advantages over conventional refractive optics, particularly in non-visible spectral regions such as ultraviolet, gamma rays, and X-rays, where material limitations restrict traditional optical components. Owing to their design flexibility, DOEs enable the generation of complex beam profiles—including circular, vortex, and Airy beams—across a wide range of wavelengths. Despite their structural simplicity and compatibility with micro- and nanoscale fabrication, conventional DOEs often suffer from limited focusing efficiency, frequently requiring additional refractive lenses that introduce optical aberrations, increased system complexity, and higher cost. In this work, we present an integrated design and fabrication approach for micro-scale diffractive optical elements capable of achieving high focusing performance without reliance on supplementary optical components. A machine learning-based decision tree method is employed to generate optimized writing paths, which are subsequently fabricated using direct laser lithography. The proposed integrated DOE structures enable efficient focusing of multiple customized beam profiles within a compact and standalone optical element. This approach improves optical efficiency while maintaining low fabrication cost and system simplicity. The demonstrated integrated micro-DOEs provide a scalable and versatile platform for advanced beam shaping and focusing applications in photonics, particularly where compactness and performance are critical. Full article
(This article belongs to the Section Lasers, Light Sources and Sensors)
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14 pages, 3782 KB  
Article
Strategies for Managing Charge in Electron-Beam Lithography on Glass
by Zhongyang Liu, Yue Chen, Leyang Dang, Wenwu Zhang, Luwei Wang and Junle Qu
Photonics 2026, 13(1), 43; https://doi.org/10.3390/photonics13010043 - 31 Dec 2025
Viewed by 390
Abstract
Optical metasurfaces fabricated via electron beam lithography (EBL) are increasingly pivotal for biosensing and bioimaging applications. However, charge accumulation on insulating glass substrates persists as a critical barrier, causing distortion of the incident electron beam and degradation of patterning fidelity manifested as pattern [...] Read more.
Optical metasurfaces fabricated via electron beam lithography (EBL) are increasingly pivotal for biosensing and bioimaging applications. However, charge accumulation on insulating glass substrates persists as a critical barrier, causing distortion of the incident electron beam and degradation of patterning fidelity manifested as pattern deflection, increased line-edge roughness (LER), and overlay inaccuracy. Here, we evaluate three charge-mitigation strategies: optimization of electron-beam resist (EBR) thickness, spin-coated conductive polymer layers, and thin metal capping layers. A reduction in EBR thickness from 800 nm to 150 nm led to a significant improvement in LER attributed to a shortened charge dissipation path. The introduction of a conductive polymer further enhanced pattern integrity, whereas the most substantial improvement was attained by depositing a 20 nm Au layer, which offers a highly conductive pathway for rapid charge dissipation and resulted in the lowest LER of 0.24. Our comparison establishes a clear hierarchy of effectiveness and identifies metal capping as the most reliable approach for high-fidelity nanofabrication on insulating substrates, thereby offering practical solutions for advancing glass-based photonic and meta-optical devices. Full article
(This article belongs to the Section Optoelectronics and Optical Materials)
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9 pages, 4610 KB  
Article
A Single-Layer Full-Color Diffractive Waveguide by Lithography
by Yong Li, Fei Wu, Huihui Li, Haitao Yang, Mengguang Wang and Zhenrong Zheng
Nanomaterials 2026, 16(1), 6; https://doi.org/10.3390/nano16010006 - 19 Dec 2025
Viewed by 491
Abstract
Augmented reality (AR) near-eye displays (NEDs) couple microdisplay image light to the human eye via integrated optical modules, enabling seamless virtual–real fusion. As core components that synergistically transmit and diffract light, diffractive waveguides are promising for next-generation AR NEDs but face two bottlenecks: [...] Read more.
Augmented reality (AR) near-eye displays (NEDs) couple microdisplay image light to the human eye via integrated optical modules, enabling seamless virtual–real fusion. As core components that synergistically transmit and diffract light, diffractive waveguides are promising for next-generation AR NEDs but face two bottlenecks: compromised full-color performance in single-layer structures caused by grating dispersion and lack of scalable fabrication technologies. To address these, we first propose a mass-production-compatible workflow based on deep ultraviolet (DUV) lithography for large-area nanostructured optics. This workflow enables high-precision wafer-level production with 200 mm wafers and nine dies per wafer, overcomes scalability issues, and is fully compatible with straight-configuration nanostructures to ensure manufacturing feasibility. Leveraging this workflow, we develop a single-layer diffractive waveguide system for AR NEDs, which comprises a thin glass substrate, a broadband high-efficiency multi-layer dielectric in-coupler, and a 2D out-coupler that concurrently expands and out-couples light. Rigorous coupled wave analysis (RCWA) optimized coupler diffraction, while ray tracing refined guided light intensity and significantly improved exit pupil uniformity. This work establishes a foundation for full-color, high-efficiency AR waveguides and provides a scalable paradigm for large-area nanostructured optical systems such as telescopes and lithography equipment. Full article
(This article belongs to the Section Nanophotonics Materials and Devices)
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18 pages, 8716 KB  
Article
Nanomechanical and Optical Properties of Anti-Counterfeiting Nanostructures Obtained by Hydrogel Photoresist in Laser Processing
by Wei Wu, Qingxue Deng, Yuhang Shi and Jiyu Sun
Biomimetics 2025, 10(12), 829; https://doi.org/10.3390/biomimetics10120829 - 11 Dec 2025
Viewed by 480
Abstract
The microstructures of living creatures are widely used in bionics, and some can generate structural colors on biological surfaces and enable the process of dynamic camouflage. This study presents the hydrogel photoresist synthesized by polymerizing HEMA and MMA in THF solvent with initiator [...] Read more.
The microstructures of living creatures are widely used in bionics, and some can generate structural colors on biological surfaces and enable the process of dynamic camouflage. This study presents the hydrogel photoresist synthesized by polymerizing HEMA and MMA in THF solvent with initiator AIBN. Then, nanostructured gratings were fabricated on the hydrogel photoresists via double-beam interference lithography, and were characterized by scanning electron microscopy, angle-resolved spectroscopy system, and nanoindentation for pattern characterization, and nanomechanical and optical performance, respectively. Under multi-angle incident light, the optical computation of gratings with different depths indicates that a shallow implicit grating does not affect its dynamic color-changing performance. It is established that the laser power of 500 mW, a first exposure time of 5 s, and a second exposure time of 3 s are feasible for achieving efficient anti-counterfeiting nanostructures. The L500-5-3 has greater Er and H than that of L500-5 with the second processing, but smaller than ineffective patterns. And the depth of anti-counterfeiting gratings that is less than 0.8 μm is conducive to obtaining anti-counterfeiting gratings with different size parameters. The acquired anti-counterfeiting nanostructures exhibit excellent stability, reliability, and angle-dependent color changes under room light, which provides promising applications for security materials in daily life, sensors, optics, and electronics. Full article
(This article belongs to the Special Issue Bionic Engineering Materials and Structural Design)
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11 pages, 960 KB  
Article
Deep-Ultraviolet Beam Homogenizers: Phase-Modulated Metalens vs. Space-Modulated Chromium Thin-Film
by Changtong Li, Zhaoying Qin, Junhong Li, Duanqi Ma, Shubo Cheng, Guojun Xia, Xiaoming Chen and Hsiang-Chen Chui
Photonics 2025, 12(12), 1192; https://doi.org/10.3390/photonics12121192 - 3 Dec 2025
Viewed by 337
Abstract
Deep-ultraviolet (DUV, 193 nm) tools for lithography and precision micromachining are often limited by beam-profile nonuniformity, which degrades critical-dimension control, line-edge roughness, and process windows. Conventional phase-dependent homogenizers can lose performance under realistic phase noise and pointing jitter. We investigate two complementary, energy–space-modulation [...] Read more.
Deep-ultraviolet (DUV, 193 nm) tools for lithography and precision micromachining are often limited by beam-profile nonuniformity, which degrades critical-dimension control, line-edge roughness, and process windows. Conventional phase-dependent homogenizers can lose performance under realistic phase noise and pointing jitter. We investigate two complementary, energy–space-modulation routes to robust homogenization: (i) a metalens-based microlens array (MLA) that forms a flat-top via controlled beamlet overlap and (ii) a chromium-on-sapphire attenuator that equalizes intensity purely by amplitude shaping. Coupled FDTD and optical modeling guide a graded-transmittance Cr design (target transmittance 0.8–0.9) that converts a Gaussian input into a flat-top plateau. Experiments at 193 nm verify that both approaches achieve high static uniformity (Urms <3.5%). Under dynamic conditions, the MLA exhibits sensitivity to transverse-mode hops and phase fluctuations due to its reliance on coherent overlap, leading to reduced uniformity and fill factor. In contrast, the Cr attenuator remains phase-insensitive and maintains stable output under jitter, offering a power-robust, low-maintenance alternative for industrial DUV systems. We discuss design trade-offs and outline hybrid MLA + attenuation schemes that preserve MLA-level flatness while approaching the robustness of amplitude-shaping solutions. Full article
(This article belongs to the Special Issue Optical Metasurfaces: Applications and Trends)
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18 pages, 2718 KB  
Review
The Principle and Development of Optical Maskless Lithography Based Digital Micromirror Device (DMD)
by Xianjie Li, Guodong Cui and Guili Xu
Micromachines 2025, 16(12), 1356; https://doi.org/10.3390/mi16121356 - 29 Nov 2025
Viewed by 3417
Abstract
A comprehensive review of the DMD-based optical lithography system has been conducted. The essence of the point-array with an oblique-scanning and stepping operation principle has been systematically analyzed, which will serve as the core driving force for its development and application. Similar to [...] Read more.
A comprehensive review of the DMD-based optical lithography system has been conducted. The essence of the point-array with an oblique-scanning and stepping operation principle has been systematically analyzed, which will serve as the core driving force for its development and application. Similar to conventional lithography, the system development has been presented from the aspects of critical dimension (CD) resolution, overlay accuracy, and throughput. With the unique characterizations of the digital virtue mask, achievements are summarized from integrated circuit (IC) manufacturing to various micro-scale fabrication processes. Full article
(This article belongs to the Special Issue Recent Advances in Lithography)
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24 pages, 5092 KB  
Article
Efficient Mask Optimization for DMD-Based Maskless Lithography Using a Genetic–Hippo Hybrid Algorithm
by Zhiyong Chen, Chi Tu, Haifeng Sun, Xia Kang, Junbo Liu and Song Hu
Micromachines 2025, 16(12), 1333; https://doi.org/10.3390/mi16121333 - 27 Nov 2025
Viewed by 733
Abstract
Mask optimization is a critical technique for enhancing imaging performance in digital micromirror device (DMD)-based maskless lithography. Conventional algorithms, however, often suffer from slow convergence and limited adaptability, particularly when handling complex multi-feature mask patterns. To address these challenges, this study proposes a [...] Read more.
Mask optimization is a critical technique for enhancing imaging performance in digital micromirror device (DMD)-based maskless lithography. Conventional algorithms, however, often suffer from slow convergence and limited adaptability, particularly when handling complex multi-feature mask patterns. To address these challenges, this study proposes a hybrid Genetic–Hippo Optimization (GA-HO) algorithm that integrates the global exploration capability of the Genetic Algorithm (GA) with the local exploitation efficiency of the Hippocampus Optimization (HO) Algorithm. The approach employs grayscale modulation for adaptive mask optimization and introduces a global–local cyclic search mechanism to balance exploration and exploitation throughout the optimization process. Simulation results demonstrate that the GA-HO hybrid algorithm achieves a more pronounced improvement in overall optimization performance compared with the standard GA. In complex multi-line mask optimization, the standard GA achieves approximately a 18% enhancement in optimization accuracy, whereas the GA-HO algorithm achieves around a 30% improvement. Moreover, the GA-HO algorithm exhibits a smoother convergence curve, greater stability, and superior robustness. The hybrid method effectively suppresses linewidth variations and corner distortions caused by optical proximity effects (OPE), maintaining high imaging fidelity and stable optimization outcomes even under challenging mask conditions. Overall, the proposed GA-HO framework demonstrates excellent efficiency, adaptability, and precision, providing a reliable and high-performance solution for DMD-based maskless lithography. This work offers a strong theoretical and algorithmic foundation for advancing high-resolution, high-efficiency, and low-cost micro/nanofabrication technologies, highlighting the potential of heuristic hybrid optimization strategies for practical lithography applications. Full article
(This article belongs to the Section E:Engineering and Technology)
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10 pages, 3164 KB  
Article
The Influence and Compensation of Process on Measurement Accuracy in Digital Grating Focusing and Leveling Sensors
by Shiguang Li, Xianjie Li and Guocai He
Micromachines 2025, 16(12), 1326; https://doi.org/10.3390/mi16121326 - 26 Nov 2025
Viewed by 314
Abstract
The digital grating focusing and leveling sensor is a kind of wafer height sensor for focus control in a lithography tool by measuring the displacement of an optical grating image reflected from the wafer surface. The process pattern on the wafer surface can [...] Read more.
The digital grating focusing and leveling sensor is a kind of wafer height sensor for focus control in a lithography tool by measuring the displacement of an optical grating image reflected from the wafer surface. The process pattern on the wafer surface can significantly affect the measurement accuracy of the sensor. To mitigate this effect, the Criminisi algorithm for image processing is employed. First, process patterns in the optical grating image are identified and masked with a specific color—yellow in this paper. The Criminisi algorithm is then applied to recover the clear image in the masked region. To evaluate the algorithm performance, 50 masked images are recovered and compared with the original clear image where the mask ratios range from 1% to 15%. The experimental results indicate that the mean repair accuracy is below 1 nm after 10 repair iterations for a given mask ratio and the maximum error in a single repair is 68 nm across all 50 images. Full article
(This article belongs to the Special Issue Recent Advances in Lithography)
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14 pages, 2342 KB  
Article
Generation of Computer-Generated Holograms as Anti-Counterfeiting Tags via Hybrid Fabrication Using Additive Manufacturing and Nanoimprint Lithography
by Konstantina Tourlouki, Anastasios Tsakas, Nikolaos Kehagias and Dimitris Alexandropoulos
Photonics 2025, 12(11), 1109; https://doi.org/10.3390/photonics12111109 - 10 Nov 2025
Viewed by 616
Abstract
This paper presents a hybrid fabrication method for producing anti-counterfeit optical elements on plastic products and surfaces targeting multidiscipline applications such as food, pharmaceuticals, luxury goods, and electronics industry. Our proposition combines the design flexibility and rapid prototyping capabilities of stereolithography three-dimensional (SLA [...] Read more.
This paper presents a hybrid fabrication method for producing anti-counterfeit optical elements on plastic products and surfaces targeting multidiscipline applications such as food, pharmaceuticals, luxury goods, and electronics industry. Our proposition combines the design flexibility and rapid prototyping capabilities of stereolithography three-dimensional (SLA 3D) printing with nanoimprint lithography (NIL) to create unique optical security tags onto plastic surfaces. The proposed approach is cost-effective, scalable, and tailored for mass production, addressing the increasing demand for secure and reliable authentication solutions. NIL is substrate agnostic, offering material selection versatility and realization of security tags onto polymer surfaces, which are widely used across various sectors such as packaging industry, medical devices, and flexible electronics. This enables integration into a wide range of materials, further enhancing applicability on flat and 3D shape surfaces. An evaluation method based on digital reconstruction has been used to ensure robust performance and verification of the produced optical security features. The results demonstrate that this hybrid approach provides a reproducible and technically feasible path for the development of optical anti-counterfeiting tags suitable for large-scale implementation, particularly within fast-moving consumer goods (FMCG). Full article
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16 pages, 844 KB  
Article
Curvilinear Sub-Resolution Assist Feature Placement Through a Data-Driven U-Net Model
by Jiale Liu, Wenjing He, Wenhao Ding, Yuhang Wang and Yijiang Shen
Micromachines 2025, 16(11), 1229; https://doi.org/10.3390/mi16111229 - 29 Oct 2025
Viewed by 615
Abstract
In advanced semiconductor manufacturing, computational lithography, particularly sub-resolution assist features (SRAFs), is crucial for enhancing the process window. However, conventional SRAF placement methodologies are hampered by a critical trade-off between speed and pattern fidelity, and they largely fail to optimize the complex, curvilinear [...] Read more.
In advanced semiconductor manufacturing, computational lithography, particularly sub-resolution assist features (SRAFs), is crucial for enhancing the process window. However, conventional SRAF placement methodologies are hampered by a critical trade-off between speed and pattern fidelity, and they largely fail to optimize the complex, curvilinear layouts essential for advanced nodes. This study develops a deep learning framework to replace and drastically accelerate the optical refinement of SRAF shapes. We established a large-scale dataset with coarse, binarized SRAF patterns as inputs. Ground-truth labels were generated via an Level-Set Method (LSM) optimized purely for optical performance. A U-Net convolutional neural network was then trained to learn the mapping from the coarse inputs to the optically optimized outputs. Experimental results demonstrate a dual benefit: the model provides a multi-order-of-magnitude acceleration over traditional CPU-based methods and is significantly faster than modern GPU-accelerated algorithms while achieving a final pattern fidelity highly comparable to the computationally expensive LSM. The U-Net-generated SRAFs exhibit high fidelity to the ground-truth layouts and comparable optical performance. Our findings demonstrate that a data-driven surrogate can serve as an effective alternative to traditional algorithms for SRAF optical refinement. This represents a promising approach to mitigating computational costs in mask synthesis and provides a solid foundation for future integrated optimization solutions. Full article
(This article belongs to the Special Issue Recent Advances in Lithography)
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13 pages, 3209 KB  
Article
Fabrication and Measurement of Fiber Optic Sensor Based on Localized Surface Plasmon Resonance for Interleukin-8 Detection Using Micropillar and Gold Nanoparticle Composite
by Min-Jun Kim, Jong-Hyun Bang, Hyeong-Min Kim, Jae-Hyoung Park and Seung-Ki Lee
Appl. Sci. 2025, 15(20), 10894; https://doi.org/10.3390/app152010894 - 10 Oct 2025
Viewed by 1116
Abstract
This study reports the development of a fiber-optic localized surface plasmon resonance (FO-LSPR) sensor incorporating a three-dimensional micropillar array functionalized with gold nanoparticles. The micropillar structures were fabricated on the fiber facet using a single-mask imprint lithography process, followed by nanoparticle immobilization to [...] Read more.
This study reports the development of a fiber-optic localized surface plasmon resonance (FO-LSPR) sensor incorporating a three-dimensional micropillar array functionalized with gold nanoparticles. The micropillar structures were fabricated on the fiber facet using a single-mask imprint lithography process, followed by nanoparticle immobilization to create a composite plasmonic surface. Compared with flat polymer-coated fibers, the micropillar array markedly increased the effective sensing surface and enhanced light trapping by providing anti-reflective conditions at the interface. Consequently, the sensor demonstrated superior performance in refractive index sensing, yielding a sensitivity of 4.54 with an R2 of 0.984, in contrast to 3.13 and 0.979 obtained for the flat counterpart. To validate its biosensing applicability, Interleukin-8 (IL-8), a cancer-associated cytokine, was selected as a model analyte. Direct immunoassays revealed quantitative detection across a broad dynamic range (0.1–1000 pg/mL) with a limit of detection of 0.013 pg/mL, while specificity was confirmed against non-target proteins. The proposed FO-LSPR platform thus offers a cost-effective and reproducible route to overcome the surface-area limitations of conventional designs, providing enhanced sensitivity and stability. These results highlight the potential of the micropillar-based FO-LSPR sensor for practical deployment in point-of-care diagnostics and real-time biomolecular monitoring. Full article
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