Sign in to use this feature.

Years

Between: -

Subjects

remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline

Journals

Article Types

Countries / Regions

Search Results (35)

Search Parameters:
Keywords = micro-hole taper

Order results
Result details
Results per page
Select all
Export citation of selected articles as:
11 pages, 5328 KB  
Article
Emission-Programmed Femtosecond Bessel Beams for Fabricating Micro–Nano Hierarchical Structures
by Yu Lu, Lin Kai, Fei Yin, Qing Yang, Kaiduan Yue and Feng Chen
Nanomaterials 2026, 16(4), 236; https://doi.org/10.3390/nano16040236 - 12 Feb 2026
Viewed by 806
Abstract
Ultrafast laser-induced micro–nano hierarchical structures show broad applicability in optoelectronics, functional surfaces, and biomedicine. However, precisely controlling their formation through light field manipulation remains a relatively unexplored area. This work demonstrates a rapid drilling strategy on silicon using an emission-programmed, high-repetition-rate femtosecond Bessel [...] Read more.
Ultrafast laser-induced micro–nano hierarchical structures show broad applicability in optoelectronics, functional surfaces, and biomedicine. However, precisely controlling their formation through light field manipulation remains a relatively unexplored area. This work demonstrates a rapid drilling strategy on silicon using an emission-programmed, high-repetition-rate femtosecond Bessel beam. This spatiotemporal modulation enables a unique manufacturing synergy that integrates subtractive drilling and thermo-fluidic redistribution by the central lobes with additive nanostructuring by the peripheral lobes, directly fabricating a micro–nano hierarchical structure comprising tapered micro-holes, elevated micropillars, and dense nanocoatings. Meanwhile, areal scanning enables programmable geometry control through line interval adjustment. This approach offers new insights into laser-matter interactions and facilitates applications in infrared photodetection or drag-reduction surfaces. Full article
Show Figures

Figure 1

20 pages, 5520 KB  
Article
Characterization of Micro-Hole Quality in Alumina Ceramics by Picosecond Laser Ring-Cut Drilling
by Wanqi Zhang, Linzheng Ye, Xijing Zhu, Shida Chuai and Peide Liu
Machines 2026, 14(2), 180; https://doi.org/10.3390/machines14020180 - 4 Feb 2026
Viewed by 1264
Abstract
In this study, a novel picosecond laser ring-cut drilling method was employed to drill holes in alumina ceramics. The morphology, dimensions, taper angle, and heat-affected zone (HAZ) of the resultant micro-holes were systematically characterized under various laser processing parameters. The crystal structure, microstructure, [...] Read more.
In this study, a novel picosecond laser ring-cut drilling method was employed to drill holes in alumina ceramics. The morphology, dimensions, taper angle, and heat-affected zone (HAZ) of the resultant micro-holes were systematically characterized under various laser processing parameters. The crystal structure, microstructure, and elemental composition of micro-holes processed under specific parameters were characterized. The results showed that the micro-hole entrance and exit dimensions and HAZ area increased with increasing spot-scanning number. However, the micro-hole taper angle initially decreased before stabilizing with an increasing spot-scanning number. Furthermore, the micro-hole entrance and exit dimensions and HAZ area gradually decreased with increasing spot-scanning speed. Conversely, the micro-hole taper angle increased with increasing spot-scanning speed. Additionally, the micro-hole entrance and exit dimensions and HAZ area gradually increased with increasing average power. However, the micro-hole taper angle gradually decreased with increasing average power. Under processing parameters of spot-scanning number N = 90, scanning speed v = 600 mm/s, and average power P = 24 W, the micro-holes exhibited a taper angle α of 4.32° and a HAZ width of approximately 0.207 mm2. In contrast to the large bright grains on the original substrate, fine grains were observed around the machining area. Compared to the original substrate surface, the percentage of oxygen atoms decreased, whereas the percentage of aluminum atoms increased at the micro-hole edge and HAZ surface. The results of this study have potential applications in the field of ceramic manufacturing. Full article
(This article belongs to the Special Issue Composite Machining in Manufacturing)
Show Figures

Figure 1

15 pages, 12323 KB  
Article
Research on Machining Characteristics of C/SiC Composite Material by EDM
by Peng Yu, Ziyang Yu, Lize Wang, Yongcheng Gao, Qiang Li and Yiquan Li
Micromachines 2025, 16(12), 1423; https://doi.org/10.3390/mi16121423 - 18 Dec 2025
Cited by 3 | Viewed by 1314
Abstract
Carbon fiber reinforced silicon carbide (C/SiC) composite material exhibits exceptional properties, including high strength, high stiffness, low density, outstanding high-temperature performance, and corrosion resistance. Consequently, they are widely used in aerospace, defense, and automotive engineering. However, their anisotropic, high hardness, and brittle characteristics [...] Read more.
Carbon fiber reinforced silicon carbide (C/SiC) composite material exhibits exceptional properties, including high strength, high stiffness, low density, outstanding high-temperature performance, and corrosion resistance. Consequently, they are widely used in aerospace, defense, and automotive engineering. However, their anisotropic, high hardness, and brittle characteristics make them a typical difficult-to-machine material. This paper focuses on achieving high-quality micro hole machining of C/SiC composite material via electrical discharge machining. It systematically investigates electrical discharge machining characteristics and innovatively develops a hollow internal flow helical electrode reaming process. Experimental results reveal four typical chip morphologies: spherical, columnar, blocky, and molten. The study uncovers a multi-mechanism cutting process: the EDM ablation of the composite involves material melting and explosive vaporization, the intact extraction and fracture of carbon fibers, and the brittle fracture and spalling of the SiC matrix. Discharge energy correlates closely with surface roughness: higher energy removes more SiC, resulting in greater roughness, while lower energy concentrates on m fibers, yielding higher vaporization rates. C fiber orientation significantly impacts removal rates: processing time is shortest at θ = 90°, longest at θ = 0°, and increases as θ decreases. Typical defects such as delamination were observed between alternating 0° and 90° fiber bundles or at hole entrances. Cracks were also detected at the SiC matrix–C fiber interface. The proposed hole-enlargement process enhances chip removal efficiency through its helical structure and internal flushing, reduces abnormal discharges, mitigates micro hole taper, and thereby improves forming quality. This study provides practical references for the EDM of C/SiC composite material. Full article
Show Figures

Figure 1

17 pages, 12946 KB  
Article
Experimental Study on Backwater-Assisted Picosecond Laser Trepanning of 304 Stainless Steel
by Liang Wang, Rui Xia, Jie Zhou, Yefei Rong, Changjian Wu, Long Xu, Xiaoxu Han and Kaibo Xia
Metals 2025, 15(10), 1138; https://doi.org/10.3390/met15101138 - 13 Oct 2025
Cited by 2 | Viewed by 973 | Correction
Abstract
This study focuses on the high-precision microhole machining of 304 stainless steel and explores a backwater-assisted picosecond laser trepanning technique. The laser used is a 30 W green picosecond laser with a wavelength of 532 nm, a repetition rate of 1000 kHz, and [...] Read more.
This study focuses on the high-precision microhole machining of 304 stainless steel and explores a backwater-assisted picosecond laser trepanning technique. The laser used is a 30 W green picosecond laser with a wavelength of 532 nm, a repetition rate of 1000 kHz, and a pulse width of less than 15 ps. Experiments were conducted under both water-based and non-water-based laser processing environments to systematically investigate the effects of laser power and scanning cycles on hole roundness, taper, and overall hole quality. The experimental results further confirm the advantages of the backwater-assisted technique in reducing slag accumulation, minimizing roundness variation, and improving hole uniformity. In addition, thermal effects during the machining process were analyzed, showing that the water-based environment effectively suppresses the expansion of the heat-affected zone and mitigates recast layer formation, thereby enhancing hole wall quality. Compared with conventional non-water-based methods, the backwater-assisted approach demonstrates superior processing stability, better hole morphology, and more efficient thermal management. This work provides a reliable technical route and theoretical foundation for precision microhole machining of stainless steel and exhibits strong potential for engineering applications. Full article
(This article belongs to the Special Issue Laser Processing of Metallic Material)
Show Figures

Figure 1

21 pages, 5385 KB  
Article
Research on the Mechanism and Process of Water-Jet-Guided Laser Annular Cutting for Hole Making in Inconel 718
by Qian Liu, Guoyong Zhao, Yugang Zhao, Shuo Yu and Guiguan Zhang
Micromachines 2025, 16(10), 1090; https://doi.org/10.3390/mi16101090 - 26 Sep 2025
Cited by 3 | Viewed by 1995
Abstract
Nickel-based superalloys, serving as the preferred materials for hot-end structural components in aerospace engines, pose considerable challenges for the fabrication of high-quality gas film holes on their surfaces due to their inherent high hardness and strength. Water-jet-guided laser processing technology has exhibited notable [...] Read more.
Nickel-based superalloys, serving as the preferred materials for hot-end structural components in aerospace engines, pose considerable challenges for the fabrication of high-quality gas film holes on their surfaces due to their inherent high hardness and strength. Water-jet-guided laser processing technology has exhibited notable potential in the realm of gas film hole fabrication; however, its engineering application is hindered by the lack of synergy between processing quality and efficiency. To tackle this issue, this study achieves efficient coupling between a 1064 nm high-power laser and a stable water jet, leveraging a multi-focal water–light coupling mode. Furthermore, an “inside-to-outside” multi-pass ring-cutting drilling strategy is introduced, and the controlled variable method is employed to investigate the influence of laser single-pulse energy, scanning speed, and pulse frequency on the surface morphology and geometric accuracy of micro-holes. Building upon this foundation, micro-holes fabricated using optimized process parameters are analyzed and validated using scanning electron microscopy and energy-dispersive spectroscopy. The findings reveal that single-pulse energy is a pivotal parameter for achieving micro-hole penetration. By moderately increasing the scanning speed and pulse frequency, melt deposition and thermal accumulation effects can be effectively mitigated, thereby enhancing the surface morphology and machining precision of micro-holes. Specifically, when the single-pulse energy is set at 0.8 mJ, the scanning speed at 25 mm/s, and the pulse frequency at 300 kHz, high-quality micro-holes with an entrance diameter of 820 μm and a taper angle of 0.32° can be fabricated in approximately 60 s. The micro-morphology and element distribution of the micro-holes affirm that water-jet-guided laser processing exhibits exceptional performance in minimizing recast layers, narrowing the heat-affected zone, and preserving the smoothness of the hole wall. Full article
(This article belongs to the Special Issue Ultra-Precision Micro Cutting and Micro Polishing)
Show Figures

Figure 1

30 pages, 48007 KB  
Article
Advantages of Femtosecond Laser Microdrilling PDMS Membranes over Conventional Methods for Organ-on-a-Chip
by Chahinez Berrah, Daniel Sanchez-Garcia, Javier Rodriguez Vazquez Aldana and Andres Sanz-Garcia
J. Manuf. Mater. Process. 2025, 9(9), 300; https://doi.org/10.3390/jmmp9090300 - 1 Sep 2025
Viewed by 2684
Abstract
Organ-on-a-chip (OoC) technology aims to replicate the functions of human organs and tissues. This study evaluates femtosecond laser micromachining (FLM) for producing PDMS membranes with controlled porosity as an alternative approach to conventional microfabrication for OoCs. Membranes of varying thicknesses were microdrilled, and [...] Read more.
Organ-on-a-chip (OoC) technology aims to replicate the functions of human organs and tissues. This study evaluates femtosecond laser micromachining (FLM) for producing PDMS membranes with controlled porosity as an alternative approach to conventional microfabrication for OoCs. Membranes of varying thicknesses were microdrilled, and the influence of laser parameters on microhole geometry was assessed, showing that pulse energy strongly affected hole diameter, whereas exposure time had a lesser impact. The heat-affected zone (HAZ) and taper angle, key indicators of microhole geometric quality, were also analyzed and found to be strongly dependent on membrane thickness. Prediction models were developed to guide parameter selection for future laser-based ablation processes. A numerical model that predicts plasma shielding effects provided further insight into the physics of PDMS laser ablation, revealing that higher pulse energies led to a marked increase in crater diameter. The fabricated membranes were integrated into an OoC device, onto which human mesenchymal stem cells were seeded. The results demonstrated strong cell adhesion, the rapid formation of a homogeneous monolayer, and no evidence of cytotoxicity. These findings confirm that FLM is a versatile and flexible technique for microdrilling PDMS membranes, enabling their effective integration into OoC. Full article
Show Figures

Figure 1

22 pages, 6027 KB  
Article
Study on the Process Characteristics of Picosecond Laser Trepan Cutting Hole Manufacturing for Heat-Resistant Steel
by Liang Wang, Long Xu, Changjian Wu, Yefei Rong and Kaibo Xia
Metals 2025, 15(8), 917; https://doi.org/10.3390/met15080917 - 19 Aug 2025
Viewed by 1214
Abstract
Picosecond laser drilling offers high precision and quality, and compared to femtosecond lasers, it also balances processing efficiency, making it widely used across various fields. However, existing drilling processes still face issues such as roundness and taper. Therefore, further research into the processing [...] Read more.
Picosecond laser drilling offers high precision and quality, and compared to femtosecond lasers, it also balances processing efficiency, making it widely used across various fields. However, existing drilling processes still face issues such as roundness and taper. Therefore, further research into the processing characteristics of picosecond laser technology is needed to improve processing quality. This paper uses ANSYS software to conduct numerical simulations of picosecond laser ring-cutting drilling, analyzing the temperature field of microholes under ring-cutting scanning paths as parameters change. Experimental studies were conducted using AISI 310S heat-resistant stainless steel as the base material. This material exhibits excellent high-temperature oxidation resistance and strength retention, making it suitable for laser thermal processing. Using a single-factor method, the study investigated the influence of equidistant concentric circular paths and inner-dense-outer-sparse concentric circular paths on microhole morphology characteristics. The results show that the laser energy distribution is different under different paths. The entrance aperture of the equidistant concentric circle path is larger than that of the inner dense and outer sparse concentric circle path, while the exit aperture is smaller than the latter. Moreover, the roundness is also better than that of the inner dense and outer sparse concentric circle path. The taper of the inner dense and outer sparse concentric circle path is better than that of the equidistant concentric circle path. This study can provide a reference for the optimization of different processing paths in the future. Full article
(This article belongs to the Special Issue High-Energy Beam Machining of Metals)
Show Figures

Figure 1

13 pages, 8245 KB  
Article
Numerical Simulation and Experimental Study of Millisecond Percussion Drilling in Titanium Alloy
by Liang Wang, Long Xu, Changjian Wu, Yefei Rong and Kaibo Xia
Materials 2025, 18(15), 3719; https://doi.org/10.3390/ma18153719 - 7 Aug 2025
Cited by 1 | Viewed by 1128
Abstract
This study addresses the challenge of drilling film-cooling holes in the turbine blades of aircraft engines. Titanium alloy TC4 was selected as the experimental material. The laser-drilling process was simulated with ANSYS to determine optimal parameters, which were subsequently applied in machining trials. [...] Read more.
This study addresses the challenge of drilling film-cooling holes in the turbine blades of aircraft engines. Titanium alloy TC4 was selected as the experimental material. The laser-drilling process was simulated with ANSYS to determine optimal parameters, which were subsequently applied in machining trials. An impact-drilling method was then used to evaluate how pulse width, pulse energy, and pulse count affect micro-hole entrance and exit diameters, taper, and roundness. Simulations revealed that pulse energy and pulse count predominantly govern entrance and exit diameters, whereas pulse count and pulse width exert a stronger influence on taper. Experiments confirmed that entrance and exit diameters increased as pulse energy rose from 2.0 J to 2.8 J; taper increased as pulse width widened from 0.6 ms to 1.4 ms; and entrance diameter, exit diameter, and taper all grew as pulse count rose from 40 to 60. Pulse width and pulse count also significantly affected hole roundness. Full article
Show Figures

Figure 1

16 pages, 4746 KB  
Article
Experimental Study on Millisecond Laser Percussion Drilling of Heat-Resistant Steel
by Liang Wang, Changjian Wu, Yefei Rong, Long Xu and Kaibo Xia
Materials 2025, 18(15), 3699; https://doi.org/10.3390/ma18153699 - 6 Aug 2025
Cited by 1 | Viewed by 1350
Abstract
Millisecond lasers, with their high processing efficiency and large power, are widely used in manufacturing fields such as aerospace. This study aims to investigate the effects of different processing parameters on the micro-hole processing of 316 heat-resistant steel using millisecond lasers. Through the [...] Read more.
Millisecond lasers, with their high processing efficiency and large power, are widely used in manufacturing fields such as aerospace. This study aims to investigate the effects of different processing parameters on the micro-hole processing of 316 heat-resistant steel using millisecond lasers. Through the control variable method, the study examines the impact of pulse energy, pulse count, and pulse width on the quality of micro-holes, including the entrance diameter, exit diameter, and taper. Furthermore, combined with orthogonal experiments and COMSOL Multiphysics 6.2 simulations, the study explores the influence of pulse width on the formation of blind holes. The experimental results show that when the pulse energy is 2.2 J, the taper is minimal (2.2°), while the taper reaches its peak (2.4°) at 2.4 J pulse energy. As the pulse count increases to 55–60 pulses, the exit diameter stabilizes, and the taper decreases to 1.8°. Blind holes begin to form when the pulse width exceeds 1.2 ms. When the pulse width is 1.2 ms, pulse energy is 2.4 J, and pulse count is 50, the entrance diameter of the blind hole reaches its maximum, indicating that longer pulse widths result in more significant energy reflection and thermal accumulation effects. COMSOL simulations reveal that high-energy pulses cause intense melt ejection, while longer pulse widths exacerbate thermal accumulation at the micro-hole entrance, leading to blind hole formation. This study provides important process references for laser processing of through-holes and blind holes in heat-resistant steel. Full article
Show Figures

Figure 1

15 pages, 3563 KB  
Article
Process Optimization on Trepanning Drilling in Titanium Alloy Using a Picosecond Laser via an Orthogonal Experiment
by Liang Wang, Yefei Rong, Long Xu, Changjian Wu and Kaibo Xia
Micromachines 2025, 16(8), 846; https://doi.org/10.3390/mi16080846 - 24 Jul 2025
Cited by 5 | Viewed by 1527
Abstract
To optimize the laser drilling process and reduce the processing time, this study investigates picosecond laser trepan drilling on the titanium alloy TC4, analyzing the effects of laser parameters on micro-hole diameter, taper, and roundness. Four independent variables were selected: laser power, defocusing [...] Read more.
To optimize the laser drilling process and reduce the processing time, this study investigates picosecond laser trepan drilling on the titanium alloy TC4, analyzing the effects of laser parameters on micro-hole diameter, taper, and roundness. Four independent variables were selected: laser power, defocusing distance, scanning speed, and the number of scans. An L25 (56) orthogonal array was employed for experimental design. The mean response and range analyses evaluated parameter impacts on micro-hole quality, revealing the influence mechanisms of these variables at different levels. The results indicate the following: (1) the scanning speed and laser power significantly affect entrance and exit micro-hole diameters; (2) the defocusing distance substantially influences micro-hole taper; (3) the laser power most critically impacts inlet roundness; (4) the defocusing distance, scanning speed, and laser power directly correlate with outlet roundness; (5) the number of scans exhibits weaker relationships with inlet/outlet diameters, taper, and roundness. A comprehensive balance method applied to orthogonal test results for process optimization yielded the following optimal parameters: 90% laser power (30 W total), −0.2 mm defocus, a 27 mm/s scanning speed, and 15 scans. Full article
(This article belongs to the Special Issue Laser Micro/Nano Fabrication, Second Edition)
Show Figures

Figure 1

25 pages, 10123 KB  
Article
Fabrication of Micro-Holes with High Aspect Ratios in Cf/SiC Composites Using Coaxial Waterjet-Assisted Nanosecond Laser Drilling
by Chenhu Yuan, Zenggan Bian, Yue Cao, Yinan Xiao, Bin Wang, Jianting Guo and Liyuan Sheng
Micromachines 2025, 16(7), 811; https://doi.org/10.3390/mi16070811 - 14 Jul 2025
Cited by 5 | Viewed by 1913
Abstract
In the present study, the coaxial waterjet-assisted nanosecond laser drilling of micro-holes in Cf/SiC composites, coupled with nanosecond laser drilling in air for fabricating micro-holes with high aspect ratios, were investigated. The surface morphology, reaction products, and micro-hole shapes were thoroughly [...] Read more.
In the present study, the coaxial waterjet-assisted nanosecond laser drilling of micro-holes in Cf/SiC composites, coupled with nanosecond laser drilling in air for fabricating micro-holes with high aspect ratios, were investigated. The surface morphology, reaction products, and micro-hole shapes were thoroughly examined. The results reveal that, for the coaxial waterjet-assisted nanosecond laser drilling of micro-holes in the Cf/SiC composite, the increasing of waterjet velocity enhances the material removal rate and micro-hole depth, but reduces the micro-hole diameter and taper angle. The coaxial waterjet isolates the laser-ablated region and cools down the corresponding region rapidly, leading to the formation of a mixture of SiC, SiO2, and Si on the surface. As the coaxial waterjet velocity increases, the morphology of residual surface products changes from a net-like structure to individual spheres. Coaxial waterjet-assisted nanosecond laser drilling, with a waterjet velocity of 9.61 m/s, achieves micro-holes with a good balance between efficiency and quality. For the fabrication of micro-holes with a high aspect ratio in Cf/SiC composites, micro-holes fabricated by nanosecond laser drilling in air exhibit obvious taper features, which should be ascribed to the combined effects of spattering slag, plasma, and energy dissipation. The application of coaxial waterjet-assisted nanosecond laser drilling on micro-holes fabricated by laser drilling in air effectively expands the hole diameter. The fabricated micro-holes have very small taper angles, with clean wall surfaces and almost no reaction products. This approach, combining nanosecond laser drilling in air followed by coaxial waterjet-assisted nanosecond laser drilling, offers a promising technique for fabricating high-quality micro-holes with high aspect ratios in Cf/SiC composites. Full article
(This article belongs to the Special Issue Optical and Laser Material Processing, 2nd Edition)
Show Figures

Figure 1

16 pages, 3744 KB  
Article
Effects of Water-Based and Underwater Assistance Methods on the Hole Quality of Silicon Nitride Ceramics Using a Picosecond Laser
by Jie Zhang, Liang Wang, Yongchao Shi, Song Yao and Kaibo Xia
Micromachines 2025, 16(6), 651; https://doi.org/10.3390/mi16060651 - 29 May 2025
Cited by 4 | Viewed by 2170
Abstract
This study investigated the effects of water-based and underwater assistance methods on the quality of picosecond laser-drilled microholes in silicon nitride ceramics, analyzing the influence of laser power variations in air and aqueous environments on entrance/exit diameters, taper angles, internal wall morphology, surface [...] Read more.
This study investigated the effects of water-based and underwater assistance methods on the quality of picosecond laser-drilled microholes in silicon nitride ceramics, analyzing the influence of laser power variations in air and aqueous environments on entrance/exit diameters, taper angles, internal wall morphology, surface roughness, and oxygen content. Water-based assistance involved submerging the workpiece’s lower surface while keeping the upper surface in the air, whereas underwater processing involved fully immersing the specimen. The experimental results demonstrated that both aqueous environments effectively improved microhole quality compared to air processing. The water-assisted methods significantly enhanced the entrance/exit morphology by reducing ablation traces and slag deposits. The aqueous medium increased the entrance/exit diameters while decreasing the taper angles and effectively removing debris, thereby reducing internal wall roughness. Underwater processing achieved lower roughness at the hole entrances and middle sections compared to water-based assistance. Both water-assisted methods produced superior internal wall morphology to air processing, with comparable performance. These findings provide valuable references for optimizing water-assisted picosecond laser drilling processes. Full article
(This article belongs to the Special Issue Laser Micro/Nano Fabrication, Second Edition)
Show Figures

Figure 1

26 pages, 21993 KB  
Article
Improvement of Micro-Hole Processing in SiCf/SiC Ceramic Matrix Composite Using Efficient Two-Step Laser Drilling
by Yue Cao, Bin Wang, Zhehang Li, Jiajia Wang, Yinan Xiao, Qingyang Zeng, Xinfeng Wang, Wenwu Zhang, Qunli Zhang and Liyuan Sheng
Micromachines 2025, 16(4), 430; https://doi.org/10.3390/mi16040430 - 2 Apr 2025
Cited by 12 | Viewed by 3440
Abstract
SiCf/SiC ceramic matrix composite (CMC), a hard and brittle material, faces significant challenges in efficient and high-quality processing of small-sized shapes. To address these challenges, the nanosecond laser was used to process micro-holes in the SiCf/SiC CMC using a [...] Read more.
SiCf/SiC ceramic matrix composite (CMC), a hard and brittle material, faces significant challenges in efficient and high-quality processing of small-sized shapes. To address these challenges, the nanosecond laser was used to process micro-holes in the SiCf/SiC CMC using a two-step drilling method, including laser pre-drilling in air and laser final-drilling with a water jet. The results of the single-parameter variation and optimized orthogonal experiments reveal that the optimal parameters for laser pre-drilling in air to process micro-holes are as follows: 1000 processing cycles, 0.7 mJ single-pulse energy, −4 mm defocus, 15 kHz pulse-repetition frequency, and 85% overlap rate. With these settings, a micro-hole with an entrance diameter of 343 μm and a taper angle of 1.19° can be processed in 100 s, demonstrating high processing efficiency. However, the entrance region exhibits spattering slags with oxidation, while the sidewall is covered by the recast layer with a wrinkled morphology and attached oxides. These effects are primarily attributed to the presence of oxygen, which enhances processing efficiency but promotes oxidation. For the laser final-drilling with a water jet, the balanced parameters for micro-hole processing are as follows: 2000 processing cycles, 0.6 mJ single-pulse energy, −4 mm defocus, 10 kHz pulse-repetition frequency, 85% overlap rate, and a 4.03 m/s water jet velocity. Using these parameters, the pre-drilled micro-hole can be finally processed in 96 s, yielding an entrance diameter of 423 μm and a taper angle of 0.36°. Due to the effective elimination of spattering slags and oxides by the water jet, the final micro-hole exhibits a clean sidewall with microgrooves, indicating high-quality micro-hole processing. The sidewall morphology could be ascribed to the different physical properties of SiC fiber and matrix, with steam explosion and cavitation erosion. This two-step laser drilling may provide new insights into the high-quality and efficient processing of SiCf/SiC CMC with small-sized holes. Full article
(This article belongs to the Special Issue Optical and Laser Material Processing, 2nd Edition)
Show Figures

Figure 1

18 pages, 5444 KB  
Article
The Effects of Static- and Flowing-Water-Assisted Methods on the Quality of Femtosecond Laser Drilling of Thermal-Barrier-Coated Superalloys
by Naifei Ren, Jie Zhang, Zhen Li, Dehu Qi, Hongmei Zhang and Kaibo Xia
Metals 2025, 15(3), 261; https://doi.org/10.3390/met15030261 - 28 Feb 2025
Cited by 12 | Viewed by 2528
Abstract
Under high fluence and a high repetition rate, femtosecond laser drilling still produces defects due to heat accumulation. In order to suppress these defects, this study conducted research on water-assisted femtosecond laser drilling. This study focused on the impact of two different water-assisted [...] Read more.
Under high fluence and a high repetition rate, femtosecond laser drilling still produces defects due to heat accumulation. In order to suppress these defects, this study conducted research on water-assisted femtosecond laser drilling. This study focused on the impact of two different water-assisted methods, static-water-based and flowing-water-based approaches, on the quality of microholes made using layer-by-layer helical drilling with a femtosecond laser in thermal-barrier-coated superalloys. Furthermore, the effects of single-pulse laser energy on the hole entrance/exit diameter, taper angle, sidewall morphology, sidewall roughness, and sidewall oxygen content in the two water environments were compared and analyzed. Water-based-assisted laser drilling is an auxiliary method where the lower surface of the workpiece is placed in water while the upper surface remains in the air. On the other hand, the water flows horizontally in the flowing-water-based method. The experimental results demonstrate that both static- and flowing-water-based methods can significantly improve the quality of femtosecond laser drilling. Notably, the improvement effect was more pronounced with the flowing-water-based method. At a laser pulse energy of 50 μJ, the hole taper angle in the flowing-water environment was reduced by 38.80% compared with that in the air. With flowing-water-based assistance, the hole sidewall roughness was lower and the melt was less. Flowing water was better at carrying away the debris and heat generated by processing. The oxygen content of the hole sidewalls decreased significantly in both kinds of water-assisted environments. The experimental results provide a valuable reference for optimizing water-assisted femtosecond laser drilling. Full article
Show Figures

Figure 1

19 pages, 72798 KB  
Article
Experimental Investigation of Water Jet-Guided Laser Micro-Hole Drilling of Cf/SiC Composites
by Binying Bao, Guangyi Zhang, Zhongan Chen, Yang Chao, Chunhai Guo and Wenwu Zhang
Materials 2024, 17(9), 1975; https://doi.org/10.3390/ma17091975 - 24 Apr 2024
Cited by 23 | Viewed by 3216
Abstract
In this paper, water jet-guided laser (WJGL) drilling of Cf/SiC composites was employed and the effects of the processing parameters on the depth and quality of the micro-holes were systematically investigated. Firstly, the depth measurement showed that the increase in [...] Read more.
In this paper, water jet-guided laser (WJGL) drilling of Cf/SiC composites was employed and the effects of the processing parameters on the depth and quality of the micro-holes were systematically investigated. Firstly, the depth measurement showed that the increase in processing time and power density led to a significant improvement in micro-hole drilling depth. However, the enhancement of the water jet speed resulted in a pronounced decrease in the depth due to the phenomenon of water splashing. In contrast, the scanning speed, path overlap ratio, pulse frequency, and helium pressure exhibited less effect on the micro-hole depth. Secondly, the microstructural analysis revealed that the increase in power density resulted in the deformation and fracture of the carbon fibers, while the augmentation in water jet speed reduced the thermal defects. Finally, based on the optimization of the processing parameters, a micro-hole of exceptional quality was achieved, with a depth-to-diameter ratio of 8.03 and a sidewall taper of 0.72°. This study can provide valuable guidance for WJGL micro-hole drilling of Cf/SiC composites. Full article
(This article belongs to the Special Issue Cutting Processes for Materials in Manufacturing)
Show Figures

Figure 1

Back to TopTop