Search Results (32)

A novel cyanide-free gold electroplating bath was developed with 2-hydroxyphosphonoacetic acid (HPAA) as the core complexing agent in this work. Scanning electron microscopy (SEM) observations demonstrate that the obtained gold electrodeposits possess a smooth and compact surface morphology. The crystal structure of the gold electrodeposits was characterized via X-ray diffraction (XRD), and the coating–substrate adhesion was systematically evaluated through scratch tests. Molecular dynamics (MD) simulations were performed to investigate the adsorption interaction between HPAA and metal (Au/Ni) surfaces. The MD simulation results show that all the studied phosphonate-containing derivatives can strongly adsorb on the gold surface and exert a significant inhibitory effect on the electroreduction of gold ions during electrodeposition. Cyclic voltammetry (CV) and other electrochemical tests reveal that the cathodic reduction peak potential of gold shifts significantly negatively after the addition of phosphonate-based organic additives, which effectively enhances the cathodic polarization of gold deposition, delays the gold nucleation rate, and refines the grain size of electrodeposits, ultimately yielding gold electrodeposits with a denser and smoother surface. Owing to its environmental benignity, excellent process stability and superior coating performance, this cyanide-free gold electroplating system exhibits broad application prospects in the field of modern green surface engineering. Full article

The development of stable, non-toxic electrolytes is essential for electrodepositing large-area coatings. This study presents a novel low-cyanide electrolyte, offering a viable alternative to traditional cyanide-based solutions for the electroplating of gold–copper alloys. Compared to conventional baths, the new formulation offers safer handling and environmental compatibility without compromising performance. Electrolyte compositions were optimized via cyclic voltammetry, and coatings were deposited using direct current, pulse current, and reverse pulse current methods. The novel low-cyanide electrolyte system achieved a 99.1% reduction in cyanide use compared with the commercial formulation. Coatings produced with pulse current and reverse pulse current deposition exhibited structural, morphological, and mechanical properties comparable to those obtained from cyanide-based electrolytes. Overall, the low-cyanide electrolyte represents a safer, high-performance alternative to traditional cyanide-based systems. Full article

Abnormal expression of miRNAs is associated with the occurrence and progression of cancer and other diseases, making miRNAs essential biomarkers for disease diagnosis and prognosis. However, the intrinsic properties of miRNAs, such as short length, low abundance, and high sequence homology, represent great challenges for fast and accurate miRNA detection in clinics. Herein, we developed a novel hybridization chain reaction (HCR)-based electrochemical miRNAs chip (e-miRchip), featured with gold nanostructured electrodes (GNEs) and silver nanoparticle reporters (AgNRs), for sensitive and multiplexed miRNA detection. AgNRs were synthesized and applied on the e-miRchip to generate strong redox signals in the presence of miRNA. The stem–loop capture probe was covalently immobilized on the GNEs, and was opened upon miRNA hybridization to consequently trigger the HCR for signal amplification. The multiple long-repeated DNA helix generated by HCR provides the binding sites for the AgNRs, contributing to the amplification of the electrochemical signals of miRNA hybridization. To optimize the detection sensitivity, GNEs with three distinct structures were electroplated, in which flower-like GNEs were found to be the best electrode morphology for miRNAs analysis. Under optimal conditions, the HCR-based e-miRchip showed an excellent detection performance with an LOD of 0.9 fM and a linear detection range from 1 fM to 10 pM. Moreover, this HCR-based e-miRchip platform was able to effectively distinguish miRNAs from the one- or two-base mismatches. This HCR-based e-miRchip holds great potential as a highly efficient and promising miRNA detection platform for the diagnosis and prognosis of cancer and other diseases in the future. Full article

Due to its excellent electrical performance, mechanical reliability, and thermal stability, electroplated gold is still the most commonly used material for movable beams in RF MEMS switches. This paper investigates the influence of process conditions on the quality and growth rate of gold electroplating, and the optimized process parameters for the gold electroplating process are obtained. The characterization of the optimized electroplated gold layer shows that it has small surface roughness and excellent thermal stability. With this optimized gold electroplating process, the RF MEMS switches are fabricated and hermetic packaged. In order to obtain the temperature environment adaptability of the packaged switch, the influence of working temperature is studied. The temperature effects on mechanical performance (includes pull-in voltage and lifetime) and RF performance (includes insertion loss and isolation) are revealed. Full article

Vacuum-sliding electrical contacts find extensive application in aerospace components, yet they face limitations related to inadequate lubrication performance. In this study, we analyzed the design of an emerging conductive lubricant material, NbSe₂. A series of NbSe₂-Ti films with varying doped Ti contents were prepared through magnetron sputtering technology. We investigated the correlation between the sputtering current and composition, microstructure, mechanical properties, and current-carrying tribological properties of the films. The results indicate that under vacuum and current-carrying conditions, the NbSe₂-Ti films demonstrate significant advantages over existing electrical-contact lubrication materials. Compared with electroplated gold films, the NbSe₂-Ti films reduced the coefficient of friction from 0.25 to 0.015, thereby improving the wear life by more than six times. This result demonstrates that magnetron-sputtered NbSe₂ film can be used as a lubricant for space current-carrying sliding contacts. Full article

An electrical connector is an important component for achieving the interconnection of electric equipment. However, the degradation of contacting parts within the electrical connector under repetitive mechanical insertion and extraction operations causes a decrease in the contact reliability level, resulting in considerable safety hazards. The coating quality, determining the degree of degradation of contact pairs, is considered a critical factor in fabricating more reliable and safer electrical connectors. In this paper, a gold and nickel coating is deposited onto the surface of a pin within an electrical connector using magnetron sputtering and is compared to an electroplated pin, and the effects of different processing techniques on the microstructure, mechanical properties, and wear behavior are systematically investigated. The measurement results indicate that the surface quality (uniformity and defect density) and mechanical properties (hardness and elastic modulus) of the gold/nickel coating based on magnetron sputtering are significantly better than those achieved using electroplating, showing excellent wear properties and electrical contact stability after repetitive insertion–extraction operations. This study is critical for the development of advanced coatings using a novel deposition technique. Full article

Increasing requirements for neural implantation are helping to expand our understanding of nervous systems and generate new developmental approaches. It is thanks to advanced semiconductor technologies that we can achieve the high-density complementary metal-oxide-semiconductor electrode array for the improvement of the quantity and quality of neural recordings. Although the microfabricated neural implantable device holds much promise in the biosensing field, there are some significant technological challenges. The most advanced neural implantable device relies on complex semiconductor manufacturing processes, which are required for the use of expensive masks and specific clean room facilities. In addition, these processes based on a conventional photolithography technique are suitable for mass production, which is not applicable for custom-made manufacturing in response to individual experimental requirements. The microfabricated complexity of the implantable neural device is increasing, as is the associated energy consumption, and corresponding emissions of carbon dioxide and other greenhouse gases, resulting in environmental deterioration. Herein, we developed a fabless fabricated process for a neural electrode array that was simple, fast, sustainable, and customizable. An effective strategy to produce conductive patterns as the redistribution layers (RDLs) includes implementing microelectrodes, traces, and bonding pads onto the polyimide (PI) substrate by laser micromachining techniques combined with the drop coating of the silver glue to stack the laser grooving lines. The process of electroplating platinum on the RDLs was performed to increase corresponding conductivity. Sequentially, Parylene C was deposited onto the PI substrate to form the insulation layer for the protection of inner RDLs. Following the deposition of Parylene C, the via holes over microelectrodes and the corresponding probe shape of the neural electrode array was also etched by laser micromachining. To increase the neural recording capability, three-dimensional microelectrodes with a high surface area were formed by electroplating gold. Our eco-electrode array showed reliable electrical characteristics of impedance under harsh cyclic bending conditions of over 90 degrees. For in vivo application, our flexible neural electrode array demonstrated more stable and higher neural recording quality and better biocompatibility as well during the 2-week implantation compared with those of the silicon-based neural electrode array. In this study, our proposed eco-manufacturing process for fabricating the neural electrode array reduced 63 times of carbon emissions compared to the traditional semiconductor manufacturing process and provided freedom in the customized design of the implantable electronic devices as well. Full article

With the rapid development of nano/micro technology for commercial electronics, the typical interconnection method could not satisfy the high power-density packaging requirement. The 2.5D/3D integrated packaging was seen as a promising technology for nano/micro systems. The gold (Au) bump was the frequently used bonding method for these systems because of its excellent thermal, electric, and mechanical performance. However, relatively little work has been performed to analyze its height uniformity. In this study, the simulation and experimental methods were used to analyze the Au bump height uniformity. Firstly, the electroplating process of Au bump under different flow field parameters was simulated by COMSOL software. The simulated results indicated that the Au⁺ concentration polarization was the significant reason that caused the non-uniform distribution of Au bump along the wafer radius. Meanwhile, the flow field parameters, such as inlet diameter, inlet flow, titanium (Ti), wire mesh height, and Ti wire mesh density, were optimized, and their values were 20 mm, 20 L/min, 12 mm, and 50%, respectively. Subsequently, the Au bump height uniformity under different current densities was analyzed through an experimental method based on these flow field parameters. The experimental results showed that the increases of current density would decrease the Au bump height uniformity. When the current density was 0.2 A/dm², the average height, range, and deviance values of Au bump were 9.04 μm, 1.33 μm, and 0.43 μm, respectively, which could reach the requirement of high density and precision for 2.5D/3D integrated packaging. Full article

Electroactive polymer (EAP) is a polymer that reacts to electrical stimuli, such as voltage, and can be divided into electronic and ionic EAP by an electrical energy transfer mechanism within the polymer. The mechanism of ionic EAP is the movement of the positive ions inducing voltage change in the polymer membrane. Among the ionic EAPs, an ionic polymer–metal composite (IPMC) is composed of a metal electrode on the surface of the polymer membrane. A common material for the polymer membrane of IPMC is Nafion containing hydrogen ions, and platinum, gold, and silver are commonly used for the electrode. As a result, IPMC has advantages, such as low voltage requirements, large bending displacement, and bidirectional actuation. Manufacturing of IPMC is composed of preparing the polymer membrane and plating electrode. Preparation methods for the membrane include solution casting, hot pressing, and 3D printing. Meanwhile, electrode formation methods include electroless plating, electroplating, direct assembly process, and sputtering deposition. The manufactured IPMC is widely demonstrated in applications such as grippers, micro-pumps, biomedical, biomimetics, bending sensors, flow sensors, energy harvesters, biosensors, and humidity sensors. This paper will review the overall field of IPMC by demonstrating the categorization, principle, materials, and manufacturing method of IPMC and its applications. Full article

X-ray zone plates made from gold are common optical components used in X-ray imaging experiments. These nanostructures are normally fabricated using a combination of electron-beam lithography and gold electroplating with cyanide gold baths. In this study, we present a gold electroplating process in a miniaturized gold-suplphite bath. The miniaturization is enabled by on-chip reference plating areas with well defined sizes, offering a reliable way to control the height of the structures by carefully choosing the plating time at a given current density in accordance with a calibration curve. Fabricated gold zone plates were successfully used in X-ray imaging experiments with synchrotron radiation. Although gold electroplating of nanostructures is a well-established method, details about the actual process are often missing in the literature. Therefore, we think that our detailed descriptions and explanations will be helpful for other researchers that would like to fabricate similar structures. Full article

In this paper, we have examined the influence of electroplated gold thickness on the thermal and electro-optical properties of mid-IR AlInAs/InGaAs, InP QCLs. The experimental results show a significant reduction of the temperature of QCL active region (AR) with increasing gold layer thickness. For QCLs with 5.0 μm gold thickness, we observed a 50% reduction of the active region temperature. An improvement of key electro-optical parameters, that is, threshold current density and maximum emitted power for structures with thick gold, was observed. The results of micro-Raman characterization show that the electroplated gold layer introduces only moderate compressive strain in top InP cladding, which is well below the critical value for the creation of misfit dislocations. Full article

An absorber with a high absorbing efficiency is crucial for X-ray transition edge sensors (TESs) to realize high quantum efficiency and the best energy resolution. Semimetal Bismuth (Bi) has shown greater superiority than gold (Au) as the absorber due to the low specific heat capacity, which is two orders of magnitude smaller. The electroplating process of Bi films is investigated. The Bi grains show a polycrystalline rhombohedral structure, and the X-ray diffraction (XRD) patterns show a typical crystal orientation of (012). The average grain size becomes larger as the electroplating current density and the thickness increase, and the orientation of Bi grains changes as the temperature increases. The residual resistance ratio (RRR) (R_{300 K}/R_{4.2 K}) is 1.37 for the Bi film (862 nm) deposited with 9 mA/cm² at 40 °C for 2 min. The absorptivity of the 5 μm thick Bi films is 40.3% and 30.7% for 10 keV and 15.6 keV X-ray radiation respectively, which shows that Bi films are a good candidate as the absorber of X-ray TESs. Full article

2,2′-thiobisethanol dimethacrylate/ethylene glycol dimethacrylate copolymer (coP-TEDMA/EGDMA) was used as a sorbent for gold recovery from residual solutions resulting from the electroplating industry. Firstly, synthesized material was characterized by X-ray diffraction, scanning electron microscopy, energy dispersive X-ray spectroscopy, and confocal laser scanning microscopy. The sorption process mechanism was evidenced on the basis of kinetic, thermodynamic and equilibrium studies. To highlight this, the influence of solution pH, temperature and gold initial concentration on maximum sorption capacity was studied. The obtained experimental data were modeled using Langmuir, Freundlich and Sips sorption isotherms, and it was observed that the Sips one was better for describing the studied sorption process. Kinetic data were fitted using pseudo-first-order and pseudo-second-order kinetic models. Of these models, the studied process was better described by the pseudo-second-order model. The thermodynamic parameters free Gibbs energy (ΔG0), enthalpy (ΔH0), and entropy (ΔS0) were evaluated on the basis of the van’t Hoff equation. On the basis of the thermodynamic study, it was concluded that gold recovery on coP-TEDMA/EGDMA is a spontaneous and endothermic process. Full article

Narrow band-gap semiconductors, namely ternary InAsSb alloys, find substantial technological importance for mid-infrared application as photodetectors in medical diagnostics or environmental monitoring. Thus, it is crucial to develop electrical contacts for these materials because they are the fundamental blocks of all semiconductor devices. This study demonstrates that electroplated gold contacts can be considered as a simple and reliable metallization technology for the electrical-response examination of a test structure. Unalloyed electroplated Au contacts to InAsSb exhibit specific contact resistivity even lower than vacuum-deposited standard Ti–Au. Moreover, temperature-dependent transport properties, such as Hall carrier concentration and mobility, show similar trends, with a minor shift in the transition temperature. It can be associated with a difference in metallization technology, mainly the presence of a Ti interlayer in vacuum-deposited contacts. Such a transition may give insight into not only the gentle balance changes between conductivity channels but also an impression of changing the dominance of carrier type from p- to n-type. The magnetotransport experiments assisted with mobility spectrum analysis clearly show that such an interpretation is incorrect. InAsSb layers are strongly p-type dominant, with a clear contribution from valence band carriers observed at the whole analyzed temperature range. Furthermore, the presence of thermally activated band electrons is detected at temperatures higher than 220 K. Full article