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Polymers
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Epoxy Resins and Epoxy-Based Composites: Research and Development
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Epoxy Resins and Epoxy-Based Composites: Research and Development

A special issue of Polymers (ISSN 2073-4360). This special issue belongs to the section "Polymer Composites and Nanocomposites".

Deadline for manuscript submissions: 30 November 2025 | Viewed by 543

Special Issue Editor

Dr. Seong-Hwang Kim

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Guest Editor
Korea Institute of Convergence Textile, Gyeongsan-si, Gyeongsangbuk-do, Republic of Korea
Interests: epoxy thermosets; multi-functional nanomaterials; fiber reinforcement; thermal conductivity; mechanical properties; interfacial properties

Special Issue Information

Dear Colleagues,

Amongst the various thermosetting materials, epoxy resins (EPs) possess superior characteristics and therefore currently constitute the most widely used polymer resins. EPs will continue to be at the forefront of many thermoset applications due to their versatile properties. At present, researchers and industries are in a continual quest to develop multi-functional and cost-efficient EPs or epoxy-based composites designed for various applications, including electronic packaging, aerospace, ship, automotive, civil, food packaging, electromagnetic interference (EMI) shielding, flame-retardant materials, anti-corrosive coatings, and biomedical applications.

Although epoxy resins are widely used in industrial applications, new processes and application technologies necessitate pushing the benchmark further. An epoxy resin that is very tough yet flexible and moldable is highly desired in aviation, automotive and rail vehicles, and shipbuilding industries; in some of the automated processes found in these industries, rapid curing is essential. The fabrication of structural parts that are nearly or intended to be exposed in extreme physical and chemical conditions, such as in automotive engines and rockets, mandates an epoxy matrix of high temperature and chemical stability.  In some niche markets where megastructures are manufactured in pieces, composite parts need to exhibit toughness and flexibility to withstand wear and tear during the manufacturing stages.

The objective of this Special Issue is to provide fresh perspectives on the enhancement of epoxy-based products by incorporating various fillers and fibers tailored to meet the diverse demands of cutting-edge technologies. In particular, this Special Issue hopes to cover a range of length scales from nano, micro, and macro to full product/structural level, with a focus on engineered composites that work in high performance applications.

Dr. Seong-Hwang Kim
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Polymers is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • epoxy resin
  • nanocomposites
  • fiber-reinforced composites
  • multi-scale composites

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Published Papers (2 papers)

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Research

22 pages, 7333 KiB  
Article
Multi-Objective Toughness Optimization of Epoxy Resin for Steel Bridge Deck Pavement Based on Crosslink Density Regulation
by Yixin Zhou, Gang Xu, Yulou Fan, Yuxiang Li, Xianhua Chen, Jun Yang and Wei Huang
Polymers 2025, 17(10), 1422; https://doi.org/10.3390/polym17101422 - 21 May 2025
Viewed by 56
Abstract
Epoxy resins (ERs) are esteemed for their mechanical robustness and adhesive qualities, particularly in steel bridge deck applications. Nonetheless, their intrinsic brittleness limits broader utility. This study addresses this limitation by modulating ER crosslink density through adjustments in curing agent concentration, incorporation of [...] Read more.
Epoxy resins (ERs) are esteemed for their mechanical robustness and adhesive qualities, particularly in steel bridge deck applications. Nonetheless, their intrinsic brittleness limits broader utility. This study addresses this limitation by modulating ER crosslink density through adjustments in curing agent concentration, incorporation of hyperbranched polymers (HBPs), and optimization of curing conditions. Employing a multi-objective optimization strategy, this research aims to enhance toughness while minimizing strength degradation. Non-isothermal curing kinetics, realized using the differential scanning calorimetry (DSC) method, attenuated total reflection Fourier transform infrared spectroscopy (ATR-FTIR), tensile testing, and thermogravimetric analysis (TGA), were employed to investigate the effects of curing agent and HBP content on the curing reaction, mechanical properties, and thermal stability, respectively. Response surface methodology facilitated comprehensive optimization. Findings indicate that both curing agent and HBP contents significantly influence curing dynamics and mechanical performance. Curing agent content below 40% or above 50% can induce side reactions, adversely affecting properties. While a curing agent content exceeding 45% or an HBP content exceeding 5% improves the toughness of ER, these increases concurrently reduce mechanical strength and thermal stability. The study identifies an optimal formulation comprising 45.21% curing agent, a curing temperature of 60.45 °C, and 5.77% HBP content. Full article
(This article belongs to the Special Issue Epoxy Resins and Epoxy-Based Composites: Research and Development)
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17 pages, 6137 KiB  
Article
Research on the Thermal Aging Characteristics of Cured Epoxy Resin Insulating Materials for DC Bushings
by Daijun Liu, Xiaobang Tong, Libao Liu, Tao Chen, Jiarong Tang, Wenkai Tang, Liming Wang, Bin Cao and Zimin Luo
Polymers 2025, 17(8), 1064; https://doi.org/10.3390/polym17081064 - 15 Apr 2025
Viewed by 325
Abstract
High-temperature-resistant epoxy composites play a crucial role in enhancing the operational reliability and service life of devices such as DC bushings, which is of great significance for the long-term stable operation of ultra-high voltage and flexible power transmission and distribution systems. In this [...] Read more.
High-temperature-resistant epoxy composites play a crucial role in enhancing the operational reliability and service life of devices such as DC bushings, which is of great significance for the long-term stable operation of ultra-high voltage and flexible power transmission and distribution systems. In this study, the epoxy composite was prepared, and long-term thermal aging tests were conducted at 250 °C and 270 °C. The changes in physical properties, electrical characteristics, and bending strength of epoxy composite were systematically investigated, and the thermal aging mechanism of these materials was elucidated. The experimental results revealed that with the progression of thermal aging, the epoxy composites exhibited volume shrinkage due to the breaking of chemical bonds. After 10 thermal aging cycles at 270 °C, the mass loss rate of the epoxy composite reached 20.52%. At 250 °C, the breakdown strength decreased by 9.9% compared to the unaged state. After aging at 250 °C and 270 °C, the volume resistivity decreased by a maximum of 53.75% and 76.94%, respectively, while the dielectric constant decreased by a maximum of 50.34% and 41.94%, respectively. After 10 aging cycles at 250 °C and 270 °C, the bending strength of the cured epoxy composite decreased by 39.79% and 53.91%, respectively. These findings provide valuable insights into the thermal aging characteristics of epoxy composites used in DC bushings and other electrical devices, offering a scientific basis for material selection and reliability assessment in high-voltage insulation applications. Full article
(This article belongs to the Special Issue Epoxy Resins and Epoxy-Based Composites: Research and Development)
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